The Ceramic Disc Cleaning and Waxing Integrated Machine is a high-efficiency automated system designed for semiconductor wafer pre-processing, integrating precision cleaning, drying, and wafer waxing (mounting) into a single platform.
This equipment is widely used in SiC, Si, GaN, sapphire, and advanced ceramic processing, ensuring stable wafer bonding to carrier discs prior to grinding, thinning, or polishing processes. By combining ultrasonic cleaning technology with intelligent waxing control, the system achieves high yield rates up to 99.9%, making it ideal for both mass production and high-end semiconductor applications.
With fully automated operation and MES connectivity, this machine significantly improves production efficiency, process consistency, and traceability.
Key Technical Features
Integrated Cleaning and Waxing System
- Combines ceramic disc cleaning + dual waxing stations
- One-step processing: cleaning → drying → waxing
- Parallel operation improves throughput
Ultra-High Precision Alignment
- CCD vision positioning system
- Alignment accuracy: ±0.02 mm
- Ensures precise wafer placement and bonding quality
Controlled Wax Deposition
- Wax amount: 0.8 g ±0.05 g per wafer
- Uniform distribution ensures stable mounting during grinding
Stable Pressure Control
- Pneumatic system maintains 5–10 N/cm² uniform pressure
- Prevents wafer warpage and bonding defects
High Yield and Process Stability
- Yield rate up to 99.9%
- Real-time monitoring with automatic parameter adjustment (±3% tolerance)
Technical Specifications
| Parameter | Value |
|---|---|
| Dimensions | 7740 × 3390 × 2300 mm |
| Power Supply | AC 380V, 50Hz, 90 kW |
| Pneumatic Supply | 2 m³/h, 0.4–0.5 MPa (oil-free dry air) |
| Water Supply | 2 T/h @ 0.3 MPa, ≥12 MΩ·cm DI water |
Working Principle
1. Ceramic Disc Cleaning Stage
- Ultrasonic cleaning system removes micron-level particles and contaminants
- Uses high-purity DI water (≥12 MΩ·cm)
- Combined with air knife + vacuum drying, ensuring zero residue
2. Automated Waxing Process
- Vision system detects disc coordinates
- Programmable dispensing head applies uniform wax layer
- Wafer is mounted under controlled pressure conditions
3. Intelligent Process Control
- PLC system synchronizes cleaning and waxing modules
- Supports parallel processing up to 30 discs per hour
- Thickness sensors monitor wax uniformity in real time
Production Capacity
| Wafer Size | Disc Diameter | Quantity | Cycle Time |
|---|---|---|---|
| 4 inch | Φ485 mm | 11 pcs | 5 min/disc |
| 4 inch | Φ576 mm | 13 pcs | 6 min/disc |
| 6 inch | Φ485 mm | 6 pcs | 3 min/disc |
| 6 inch | Φ576 mm | 8 pcs | 4 min/disc |
| 8 inch | Φ485 mm | 3 pcs | 2 min/disc |
| 8 inch | Φ576 mm | 5 pcs | 3 min/disc |
Applications
Semiconductor Wafer Pre-Processing
- Wafer mounting before grinding / thinning / polishing
- Suitable for:
- Silicon (Si)
- Silicon Carbide (SiC)
- Gallium Nitride (GaN)
Compound Semiconductor Manufacturing
- GaN, SiC power devices
- Advanced substrate handling
Optical and Crystal Materials
- Sapphire substrates
- Precision ceramics
- Optical components
MEMS and Advanced Materials
- Microfabrication wafer preparation
- Specialty material processing
Key Advantages
- High Integration: Cleaning + drying + waxing in one system
- Energy Efficiency: Water recycling rate >80%, reduced consumption
- High Throughput: Up to 30 discs/hour
- Smart Manufacturing Ready: MES/ERP integration supported
- Flexible Customization: Supports Φ300–650 mm non-standard discs
- Fast Changeover: Tooling switch time <3 minutes
Performance Highlights
- Wax uniformity deviation: ≤±3%
- Water consumption: ≤0.5 L/disc
- Automated operation with full traceability
- Stable and repeatable process control
FAQ
Q1: How is high yield ensured?
A dedicated CCD vision alignment system provides ±0.02 mm positioning accuracy, ensuring consistent wafer mounting quality.
Q2: What is the water consumption level?
The system achieves >80% water recycling, with consumption as low as ≤0.5 L per disc.
Q3: Does it support fast wafer size switching?
Yes, the intelligent fixture library enables automatic tooling switching within 3 minutes via HMI.
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