The ZMSH Fully Automatic Precision Dicing Saw is an advanced semiconductor and brittle material cutting system designed for high-precision wafer dicing. It supports 8-inch and 12-inch wafers, as well as a wide range of fragile materials, including ceramics, glass, aluminum nitride, PZT, and epoxy substrates. Using diamond blade technology with speeds up to 60,000 RPM, the system achieves micron-level cutting accuracy (±2μm) while minimizing chipping (<5μm), making it ideal for applications where yield, precision, and surface integrity are critical.
This fully automated system integrates dual-axis high-rigidity spindles, nanometric positioning stages, and intelligent vision alignment to perform all key operations—including loading, positioning, cutting, and inspection—without manual intervention. The dual-spindle synchronous cutting mode significantly improves processing throughput by up to 80% compared to conventional single-spindle systems. Premium imported components, including ball screws, linear guides, and Y-axis grating closed-loop control, ensure consistent long-term stability and machining reliability, even in high-volume production environments.
Technical Specifications
- Working Size: Φ8″, Φ12″
- Spindle: Dual-axis 1.2/1.8/2.4/3.0, Max 60,000 RPM
- Blade Size: 2″ – 3″
- Y1/Y2 Axis: Single-step increment 0.0001 mm; positioning accuracy <0.002 mm; cutting range 310 mm
- X Axis: Feed speed 0.1–600 mm/s
- Z1/Z2 Axis: Single-step increment 0.0001 mm; positioning accuracy ≤0.001 mm
- θ Axis: Positioning accuracy ±15″
- Cleaning Station: Auto rinse & spin-dry; rotation speed 100–3000 rpm
- Operating Voltage: 3-phase 380V 50Hz
- Dimensions (W×D×H): 1550×1255×1880 mm
- Weight: 2100 kg
- Certification: RoHS
Key Advantages
- High-speed cassette scanning with collision prevention alerts for rapid and precise positioning.
- Dual-spindle synchronous cutting allows simultaneous multi-wafer processing, improving throughput and efficiency.
- Fully automated operation reduces manual intervention, improving yield and process consistency.
- Premium mechanical components ensure stability and repeatable precision over long production cycles.
- Gantry-style dual-spindle design accommodates diverse wafer thicknesses and blade spacing, supporting ultra-thin wafer processing (<50μm).
Core Features
- High-precision non-contact height measurement system
- Multi-wafer simultaneous dual-blade cutting
- Intelligent detection systems for auto-calibration, blade breakage monitoring, and cut mark inspection
- Flexible alignment algorithms for varied process requirements
- Real-time position monitoring with automatic error correction
- First-cut quality verification for immediate feedback
- Integration-ready with factory automation modules
Material Adaptation and Applications
The ZMSH precision dicing saw is compatible with a wide range of materials, providing tailored cutting solutions for modern semiconductor and electronic packaging:
| Material | Typical Applications | Processing Requirements |
|---|---|---|
| Aluminum Nitride (AlN) | LED substrates, high-power thermal substrates | Low-stress dicing, delamination prevention |
| PZT Ceramic | 5G filters, SAW devices | High-frequency stability cutting |
| Bismuth Telluride (Bi₂Te₃) | Thermoelectric modules | Low-temperature processing |
| Monocrystalline Silicon (Si) | IC chips | Submicron dicing accuracy |
| Epoxy Molding Compound | BGA substrates | Multilayer material compatibility |
| Cu Pillars / PI Dielectric | WLCSP | Ultra-thin wafer processing |
Applications and Benefits
The ZMSH fully automatic dicing saw is suitable for semiconductor manufacturing, advanced packaging, LED production, MEMS devices, and thermoelectric modules. Its precision ensures high yield, minimal wafer damage, and consistent cut quality, even when processing fragile or ultra-thin wafers. The combination of automation, dual-spindle cutting, and real-time error correction makes it ideal for high-throughput industrial applications.
Frequently Asked Questions
Q1: What materials can be cut with this system?
A1: It can cut silicon, SiC, ceramics, glass, aluminum nitride, PZT, thermoelectric materials, and epoxy molding compounds with micron-level accuracy.
Q2: How does the dual-spindle mode improve production?
A2: The dual-spindle synchronous cutting doubles processing efficiency, reduces cycle time, and maintains ±2μm precision, making it faster and more reliable than single-spindle systems.
Q3: Is the system fully automated?
A3: Yes, it automates wafer loading, positioning, cutting, cleaning, and inspection, minimizing manual labor and maximizing process reliability.
Q4: How thin of a wafer can it process?
A4: The system is capable of cutting ultra-thin wafers below 50μm, ensuring high precision and minimal stress without cracking or chipping.
Q5: Can the system be integrated into existing factory automation lines?
A5: Yes, the saw supports customizable automation module integration and can seamlessly connect to existing semiconductor production workflows, improving overall efficiency.
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