Infrared Picosecond Dual-Platform Laser Cutting System for Sapphire, Quartz & Optical Glass

The ZMSH Infrared Picosecond Dual-Platform Laser Cutting System is a high-precision industrial solution designed for advanced processing of hard and brittle materials, including sapphire, quartz, and optical glass. Based on ultrafast picosecond laser technology (1064 nm wavelength, 1–10 ps pulse duration), the system enables high-quality, low-damage cutting through a non-contact “cold processing” mechanism. It is particularly suitable for industries requiring extreme precision, such as optics, consumer electronics, and semiconductor manufacturing.

By utilizing multiphoton absorption and nonlinear optical effects, the system achieves minimal heat-affected zones (<1μm) and excellent surface quality (Ra <0.5μm), while maintaining micron-level machining accuracy (±2μm). Compared to conventional thermal processing methods, this significantly reduces micro-cracks, edge chipping, and internal stress, ensuring superior structural integrity of processed components.

A key feature of this equipment is its dual-platform (dual-station) design, which allows simultaneous processing and loading/unloading operations. This intelligent configuration increases overall production efficiency by more than 30%, with cutting speeds reaching up to 1000 mm/s depending on material type and thickness. The system supports a wide cutting thickness range from 0.03 mm to 80 mm, making it highly versatile for both ultra-thin and thick materials.

Spécifications techniques

• Laser Type: Infrared Picosecond (1064 nm)
• Platform Size: 700×1200 mm / 900×1400 mm (customizable)
• Cutting Thickness: 0.03–80 mm
• Cutting Speed: 0–1000 mm/s
• Edge Breakage: <0.01 mm
• Processing Accuracy: ±2μm
• Surface Roughness: Ra <0.5μm
• Heat-Affected Zone: <1μm
• Certification: RoHS

Principe de fonctionnement

The system operates based on advanced ultrafast laser-material interaction mechanisms:

1. Ultrafast Laser Processing
   Picosecond laser pulses (10⁻¹² seconds) deliver extremely high peak energy, enabling instantaneous material removal at the atomic level without significant thermal diffusion.
2. Nonlinear Absorption Mechanism
   Through multiphoton absorption, even transparent materials such as sapphire and glass can effectively absorb laser energy, overcoming limitations of traditional laser processing.
3. Dual-Platform Intelligent Operation
   Two independent workstations enable parallel processing and loading/unloading, maximizing machine utilization and reducing downtime.

Principaux avantages

1. Cold processing technology eliminates thermal damage, ensuring crack-free and chip-free edges.
2. Non-contact machining avoids mechanical stress and tool wear, enabling higher precision and repeatability.
3. Dual-platform design improves efficiency by over 30% for high-volume production.
4. Zero consumables significantly reduce operating costs and environmental impact.
5. High precision and zero taper ensure excellent edge quality without secondary processing.

Caractéristiques principales

• High-speed, high-precision complex contour cutting
• Integrated cutting and breaking process for streamlined production
• Automatic model switching for flexible manufacturing
• Smooth, burr-free edges with no secondary polishing required
• Support for internal hole drilling and micro-structure processing
• User-friendly interface with high automation level

Material Compatibility & Applications

This system is widely used for precision processing of various advanced materials:

Applications et avantages

The ZMSH picosecond laser cutting system is ideal for consumer electronics (smartwatch glass, camera lenses), optical components, semiconductor wafers, and precision glass parts. Its ability to process ultra-thin materials (<0.1 mm) as well as thick substrates makes it highly adaptable. The combination of high precision, low damage, and automation ensures improved yield rates, reduced post-processing costs, and consistent product quality.

Foire aux questions (FAQ)

Q1: What is an infrared picosecond laser cutting system used for?
A: It is used for precision cutting of hard and brittle materials such as sapphire, quartz, and optical glass, achieving micron-level accuracy with minimal thermal damage.

Q2: Why choose picosecond lasers over nanosecond lasers?
A: Picosecond lasers provide a significantly smaller heat-affected zone (<1μm), eliminate micro-cracks and chipping, and deliver superior edge quality, making them ideal for high-precision applications and ultra-thin materials.

Q3: What thickness range can the system handle?
A: The system supports a wide range from 0.03 mm ultra-thin materials up to 80 mm thick substrates, offering excellent flexibility across applications.

Q4: Is the system suitable for mass production?
A: Yes, the dual-platform design enables continuous operation with over 30% higher efficiency, making it ideal for high-volume manufacturing environments.

Q5: Does the process require consumables or secondary finishing?
A: No, the system is consumable-free and produces smooth, burr-free edges, eliminating the need for additional polishing or finishing processes.