WP-301D Double Side Wafer Grinding Machine for 6 Inch Semiconductor Materials and Precision Lapping

The WP-301D Double Side Wafer Grinding Machine is a high-precision system designed for simultaneous double-sided grinding and polishing of semiconductor wafers and fragile materials. Utilizing an advanced planetary gear-driven motion system, the machine enables uniform material removal on both the upper and lower surfaces of the wafer, significantly improving flatness and parallelism.

Engineered for 6-inch (150 mm) wafers and below, the WP-301D is widely used in processing compound semiconductor materials such as CdZnTe (CZT), HgCdTe (MCT), GaAs, InP, and InSb. These materials are critical in applications including infrared detection, optoelectronics, and high-frequency devices.

With its robust mechanical structure, precision control system, and optimized spindle design, the WP-301D ensures high efficiency, excellent surface quality, and stable batch processing performance.

Key Features and Technical Advantages

Double-Sided Simultaneous Processing

The machine processes both sides of the wafer at the same time, ensuring:

• Improved thickness uniformity
• Better parallelism
• Reduced total processing time

Planetary Gear Motion System

The integrated sun gear and ring gear system can operate either synchronously or independently, enabling flexible process control and optimized grinding paths for different materials.

High Precision Spindle System

Equipped with a high-precision embedded spindle, the WP-301D ensures stable rotation and minimal vibration, which is essential for achieving consistent surface quality.

Real-Time Pressure Control System

The machine features an advanced closed-loop pressure control system, allowing:

• Accurate pressure adjustment (0.1 – 50 kg)
• Real-time monitoring and automatic correction
  This guarantees consistent material removal and prevents over-polishing.

Floating Upper Plate Design

The upper plate adopts a floating connection structure, ensuring it remains parallel to the lower plate during processing. This significantly improves wafer flatness and reduces thickness variation.

Technical Specifications

Working Principle

The WP-301D operates using a planetary motion mechanism, where wafers are placed inside carriers positioned between the upper and lower plates.

During operation:

• The lower plate rotates continuously
• The sun gear drives the carriers
• The ring gear controls rotational motion

This combination creates a complex relative motion between the wafer and polishing plates, ensuring uniform material removal across both surfaces.

Simultaneously, the pressure control system maintains consistent force, while the floating upper plate adapts dynamically to maintain parallel contact. This results in:

• High flatness
• Uniform thickness
• Minimal subsurface damage

Applications

The WP-301D Double Side Grinding Machine is widely used in:

• Compound semiconductor wafer processing
• Infrared materials (CZT, MCT)
• III-V materials (GaAs, InP, InSb)
• Optical substrates and precision components
• Research laboratories and batch production

It is particularly suitable for 6-inch and below fragile materials, where precision and surface integrity are critical.

Core Advantages

• High Efficiency
  Double-sided processing reduces total machining time
• High Precision
  Ensures excellent flatness and parallelism
• Process Stability
  Closed-loop pressure control improves consistency
• Flexible Operation
  Independent or synchronized gear control
• Optimized for Fragile Materials
  Minimizes stress and prevents cracking

FAQ

Q1: What is the main advantage of double-side grinding?
A: It allows simultaneous processing of both wafer surfaces, improving flatness, parallelism, and efficiency compared to single-side grinding.

Q2: What materials can be processed?
A: The machine is suitable for CZT, MCT, GaAs, InP, InSb, and other soft and brittle semiconductor materials.

Q3: What wafer size does the WP-301D support?
A: It supports wafers up to 150 mm (6 inches).