WP-4300 Precision Grinding Machine for 6 Inch Semiconductor Materials and Fragile Substrates

The WP-4300 Precision Grinding Machine is a high-performance system designed for precision surface grinding and polishing of fragile semiconductor materials. It is specifically engineered to process 4-inch and 6-inch substrates, making it suitable for both laboratory-scale research and small-batch production environments.

This machine is widely used for materials such as CdZnTe (CZT), HgCdTe (MCT), GaAs, InP, and InSb, which are commonly applied in infrared detection, optoelectronics, and advanced semiconductor devices. With its optimized structural design and intelligent motion control, the WP-4300 ensures uniform material removal, excellent surface flatness, and minimal subsurface damage.

The compact footprint of only 0.75 m² makes it an ideal solution for facilities with limited space while maintaining high precision and operational flexibility.

Key Features and Advantages

Designed for Fragile Semiconductor Materials

The WP-4300 is optimized for soft and brittle materials, ensuring stable processing without inducing cracks or excessive stress.

Flexible Fixture System

Equipped with 4-inch and 6-inch carriers, the system supports multiple wafer sizes with:

• Vacuum adsorption for secure holding
• Adjustable pressure control (0.2 – 6.5 kg)
  This ensures uniform grinding across the entire wafer surface.

Independent Swing Arm Control

The machine features a precision-controlled swing arm that can operate independently with automatic positioning. The fixture can rotate along a fixed axis or follow the swing arm in a sector motion, enabling complex motion paths for improved surface uniformity.

Stable and Low-Speed Grinding System

• Plate speed range: 0–150 rpm
• Auxiliary rotation: 0–100 rpm
  These parameters ensure controlled material removal, which is essential for high-precision applications.

Advanced Slurry Delivery System

The integrated diaphragm pump provides:

• Flow rate: 0.07 – 1481 ml/min
• Stable and adjustable slurry supply
  This ensures consistent grinding conditions and repeatable results.

Magnetic Stirring System

The machine adopts a magnetic suspension stirring system with a 5L tank capacity, ensuring uniform slurry mixing and stable process performance.

Technical Specifications

Working Principle

The swing arm motion, combined with fixture rotation, ensures uniform distribution of contact pressure and abrasive action. This multi-directional motion helps achieve:

• High surface flatness
• Reduced edge effects
• Minimal subsurface damage

The slurry system continuously supplies abrasive particles, while the magnetic stirring system maintains consistent slurry composition throughout the process.

Applications

The WP-4300 Precision Grinding Machine is widely used in:

• Infrared materials (CZT, MCT) processing
• Compound semiconductors (GaAs, InP, InSb)
• Optoelectronic substrates
• Research laboratories and pilot production lines
• Precision polishing of fragile materials

It is particularly suitable for 6-inch and below substrates, especially in applications requiring high surface quality and precise thickness control.

Core Advantages

• High Precision Grinding
  Ensures excellent surface flatness and uniformity
• Compact Design
  Only 0.75 m² footprint, ideal for lab environments
• Flexible Processing Capability
  Supports multiple wafer sizes and materials
• Stable Process Control
  Advanced motion and slurry systems ensure repeatability
• Optimized for Fragile Materials
  Reduces cracking and improves yield

FAQ

Q1: What materials can the WP-4300 process?
A: It is designed for fragile semiconductor materials such as CZT, MCT, GaAs, InP, and InSb, as well as other soft and brittle substrates.

Q2: What wafer sizes are supported?
A: The machine supports 4-inch and 6-inch wafers, with compatibility for 3-inch substrates.

Q3: Is this machine suitable for laboratory use?
A: Yes. With its compact footprint and flexible configuration, the WP-4300 is ideal for R&D labs and small-scale production.