WG-1261 Series Fully Automatic Wafer Thinning Machine

The WG-1261 Series represents a high-precision, fully automatic wafer thinning Machine designed for 12-inch and smaller SiC wafers, as well as sapphire, quartz, and ceramic materials. As a comprehensive solution from a trusted semiconductor equipment supplier, this series integrates advanced spindle technology, high-load wafer carriers, and automation features to ensure stable, accurate, and efficient wafer thinning.

Equipped with high-power, high-precision air-bearing spindles and a new-generation high-load, low-vibration air-bearing wafer carrier, the WG-1261 ensures superior rigidity and enhanced process stability. Its encircling high-rigidity spindle drive further boosts machine stiffness, allowing precise control even for challenging materials like SiC and sapphire.

The inclusion of Autosetup functionality allows the machine to automatically complete wheel dressing after replacement, eliminating manual intervention and improving both productivity and consistency. Additionally, an online measurement unit (range 0–1800μm) ensures precise thickness control, while SECS/GEM connectivity enables seamless integration into modern smart fabs.

Technical Features

• High-Precision Air-Bearing Spindles: Provides stable, vibration-free wafer thinning for difficult-to-process materials.
• Low-Vibration, High-Load Air-Bearing Wafer Carrier: Supports wafers with minimal stress, improving yield and reducing defects.
• Encircling High-Rigidity Spindle Drive: Enhances overall machine stiffness and process stability.
• Autosetup Function: Automatically performs wheel dressing after replacement, minimizing setup time and human error.
• Online Measurement Unit: Accurately monitors wafer thickness during processing, range 0–1800μm.
• SECS/GEM Connectivity: Supports integration into smart manufacturing systems for real-time monitoring and control.
• Multi-Material Compatibility: Handles SiC, sapphire, quartz, and ceramic wafers up to 12 inches.

Applicazioni

The WG-1261 Series is ideal for:

• SiC wafer thinning: High-precision thinning for power devices, automotive, and industrial electronics.
• Sapphire wafer processing: Optical windows, LED substrates, and high-performance electronics.
• Quartz and ceramic wafer processing: High-precision components for semiconductor and optical applications.
• R&D and pilot production: For research centers and fabs developing next-generation materials.
• High-throughput production: Automated system ensures consistent results for medium- to large-scale wafer fabrication.

Machine Specifications

Why Choose WG-1261 Series?

1. High Accuracy & Stability: Advanced air-bearing spindles and low-vibration wafer carriers ensure precise thinning for hard-to-process materials.
2. Automation & Efficiency: Autosetup and full wafer transfer/cleaning systems reduce labor costs and setup time.
3. Versatile Material Support: Handles SiC, sapphire, quartz, and ceramics, offering flexibility for multiple production lines.
4. Integrated Measurement & Smart Connectivity: Online thickness measurement combined with SECS/GEM ensures process reliability and fab integration.
5. Reduced Operational Costs: Optimized design and consumable usage lower material waste and improve production yield.

Domande frequenti (FAQ)

1. Q: What wafer sizes and materials does the WG-1261 support?
   A: The machine supports wafers up to 12 inches, including SiC, sapphire, quartz, and ceramic materials, providing versatile processing options for multiple production lines.
2. Q: How does the Autosetup feature improve productivity?
   A: Autosetup automatically completes wheel dressing after replacement, eliminating manual intervention, reducing setup errors, and significantly saving production time.
3. Q: Does the WG-1261 provide precise control of wafer thickness?
   A: Yes, it is equipped with an online measurement unit (0–1800μm) that ensures accurate monitoring and control of wafer thinning during processing.
4. Q: Can the WG-1261 be integrated into smart fabs?
   A: Absolutely. The machine supports SECS/GEM connectivity, enabling real-time monitoring, data collection, and integration with smart manufacturing systems.
5. Q: How does the WG-1261 ensure stable wafer processing for hard-to-thin materials?
   A: With high-power air-bearing spindles, a low-vibration high-load wafer carrier, and an encircling high-rigidity spindle drive, the WG-1261 maintains excellent process stability even for SiC and sapphire wafers.