WDP-1240 Series Dry Polishing Machine for 300mm Wafer Stress Relief and Backside Processing

The WDP-1240 Series Dry Polishing Machine is an advanced precision system developed for wafer backside stress relief and damage layer removal in semiconductor manufacturing. Specifically designed for 300 mm wafer processing, this equipment utilizes a dry polishing process to achieve high-quality surface finishing while minimizing environmental impact.

This system is particularly suitable for advanced packaging applications, where wafer thinning and stress control are critical. By effectively removing subsurface damage layers caused during grinding processes, the WDP-1240 helps improve wafer integrity, reduce warpage, and enhance mechanical strength.

Compared with traditional wet polishing systems, the dry process eliminates slurry-related contamination and reduces waste treatment requirements, making it a more environmentally friendly and cost-efficient solution.

Key Features and Technical Advantages

Dry Polishing Technology for Low Environmental Impact

The WDP-1240 adopts a fully dry polishing process, eliminating the need for chemical slurry. This significantly reduces environmental load, simplifies maintenance, and lowers operating costs.

Efficient Stress Relief and Damage Removal

Designed to remove the backside damage layer after wafer grinding, the system effectively releases internal stress, ensuring improved wafer flatness and structural stability.

Enhanced Yield for Thin Wafers

By minimizing stress concentration, the machine helps prevent:

• Wafer cracking
• Edge chipping
• Warpage

This leads to a higher yield rate, especially for large-size and ultra-thin wafers.

Seamless Integration with Thinning Systems

The WDP-1240 can be integrated with upstream equipment such as the WG1251 Automatic Wafer Grinder, enabling fully automated production lines with safe and stable wafer transfer between processes.

Stable and Robust Mechanical Structure

The equipment features a single spindle, single chuck, and dresser unit configuration, ensuring consistent polishing performance and long-term operational stability.

 Technical Specifications

Working Principle

The WDP-1240 operates by applying controlled mechanical polishing to the wafer backside using a high-speed spindle and precision chuck system.

After wafer thinning, a damaged layer often remains beneath the surface, introducing internal stress. The dry polishing process removes this layer while maintaining strict control over pressure and material removal rate. This results in:

• Uniform surface quality
• Reduced residual stress
• Improved wafer flatness

The integrated dresser unit ensures that polishing tools maintain consistent performance throughout the process.

Application Range

The WDP-1240 Series is widely used in:

• Semiconductor wafer backside processing
• Advanced packaging (WLCSP, fan-out packaging)
• Silicon (Si) wafer polishing
• Silicon carbide (SiC) wafer processing
• Thin wafer stress relief applications

It supports 12-inch and below wafers, making it suitable for both mainstream semiconductor production and emerging advanced packaging technologies.

Core Advantages

• Low Environmental Impact
  Dry process eliminates slurry and reduces waste
• High Yield Improvement
  Minimizes cracking and warpage in thin wafers
• High Process Stability
  Robust structure ensures consistent results
• Production Line Integration
  Compatible with automated wafer thinning systems
• Optimized for Advanced Packaging
  Designed for next-generation semiconductor processes

FAQ

Q1: What is the main advantage of dry polishing compared to wet polishing?
A: Dry polishing eliminates the use of slurry, reducing environmental impact, simplifying maintenance, and lowering operating costs while maintaining high surface quality.

Q2: What wafer sizes are supported?
A: The WDP-1240 supports wafers up to 12 inches (300 mm), including Si and SiC materials.

Q3: Can this machine be integrated into a production line?
A: Yes. It can be seamlessly connected with wafer thinning equipment such as the WG1251, enabling automated wafer transfer and continuous processing.