The Diamond Wire Single-Line Cutting Machine is a high-performance solution designed for precision cutting of hard and brittle materials. Utilizing a high-speed diamond-coated wire, the system enables efficient, low-loss slicing through a controlled reciprocating motion.
It is widely used for processing materials such as silicon carbide (SiC), sapphire, quartz, glass, ceramics, and semiconductor crystals, supporting applications including cropping, truncation, slicing, and precision sectioning.
Compared with conventional abrasive cutting and laser processing, this machine offers higher efficiency, lower kerf loss, and superior surface quality, making it an ideal choice for semiconductor, photovoltaic, optical, and advanced materials industries.
主要功能
1. High Efficiency & Low Material Loss
- Wire speed up to 1500 m/min for fast cutting of ultra-hard materials
- Slice thickness as low as 0.2 mm, improving material utilization
- Up to 50% higher efficiency than traditional abrasive cutting
2. High Precision Cutting Performance
- Cutting accuracy: <3 μm (6-inch SiC)
- Stable tension control (±0.5 N) ensures consistent results
- Reduced edge chipping and improved surface finish
3. Intelligent & Flexible Operation
- User-friendly touchscreen interface
- Multiple cutting modes: straight, curved, multi-piece cutting
- Fast parameter setup and storage
4. Modular & Expandable Design
- Optional rotary worktable for angle and circular cutting
- High-tension system for ultra-hard materials
- Supports automatic alignment and precision positioning
5. Durable Industrial Structure
- Heavy-duty machine body for vibration resistance
- Key components coated with ceramic/tungsten carbide
- Long service life exceeding 5000 hours
技術規格
| 項目 | 參數 |
|---|---|
| Maximum Work Size | 600 × 500 mm |
| 鑽石線直徑 | φ0.12 – φ0.45 mm |
| Running Speed | 1500 m/min |
| 切割精度 | <3 μm (6-inch SiC) |
| 擺動角度 | 0 ~ ±12.5° |
| Lift Stroke | 650 mm |
| Lift Speed | 0 ~ 9.99 mm/min |
| Tension Range | 15 – 130 N |
| Tension Accuracy | ±0.5 N |
| Power Consumption | 44.4 kW |
| Machine Size | 2680 × 1500 × 2150 mm |
| Weight | 3600 kg |
| Noise Level | ≤75 dB(A) |
工作原理
The machine operates using a diamond-coated wire moving at high speed across the workpiece. The cutting process is achieved through continuous abrasive grinding by diamond particles.
A servo-controlled feeding system ensures precise material positioning, while a cooling fluid system reduces heat and removes debris, minimizing edge damage and improving surface quality.
應用
1. Semiconductor Industry
- SiC ingot slicing for power devices
- Sapphire wafer cutting for LED and optical applications
2. Photovoltaic Industry
- Silicon rod cutting and wafer slicing
- High-efficiency solar material processing
3. Precision Optics & Jewelry
- Quartz glass cutting
- Jade and gemstone processing with high surface quality
4. Advanced Ceramics & R&D
- Aluminum nitride (AlN), zirconia (ZrO₂)
- Aerospace and high-temperature components
常見問題
1. What materials can this machine process?
This machine is designed for hard and brittle materials such as SiC, sapphire, quartz, ceramics, glass, and semiconductor crystals, ensuring high precision and minimal damage.
2. What are the advantages of diamond wire cutting over traditional methods?
Diamond wire cutting provides higher efficiency, lower material loss, and better surface quality, while significantly reducing edge chipping compared to conventional abrasive cutting.
3. Is the machine suitable for large-scale industrial production?
Yes. With its high stability, automation capability, and long service life, it is well-suited for continuous industrial production in semiconductor and advanced material processing.
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