The ZMSH Semiconductor Wafer Precision Wire Saw Machine is designed for precision slicing applications where stable wire motion, controlled feed, fine cutting wire and reliable mechanical accuracy are required.
The machine integrates the complete slicing process into one industrial platform, including wire supply and take-up, wire traversing, tension control, guide wheels, main roller drive, precision workpiece feed, slurry circulation, heat exchange and electrical control.
According to the supplied equipment specification, the system is intended for semiconductor wafer cutting and supports cutting accuracy of ±0.01 mm, with a stated minimum slicing thickness below 0.05 mm under suitable process conditions.
For semiconductor material manufacturers, wafer processing companies and R&D facilities, the system provides a configurable solution for converting crystal or ingot materials into thin wafer sections before subsequent grinding, lapping, polishing or other wafer finishing processes.
Key Performance Highlights
The equipment is designed around high-speed fine-wire cutting.
Its maximum specified wire speed is:
2200 m/min
Supported wire diameter:
0.014–0.10 mm
Adjustable wire tension:
0–15 N
Maximum wire storage:
100 km
These parameters provide flexibility when selecting different wire sizes and cutting conditions for precision wafer slicing.
The feed system also provides variable cutting-speed control between 0.01 and 5 mm/min, allowing the cutting recipe to be adjusted according to the material, workpiece size and required slicing conditions.
Especificações técnicas
| Parâmetro | Especificação |
|---|---|
| Tamanho máximo da peça de trabalho | W90 × H220 × L450 mm |
| Maximum Workpiece Length | 450 mm |
| Maximum Wire Speed | 2200 m/min |
| Wire Diameter Range | 0.014–0.10 mm |
| Maximum Wire Storage | 100 km |
| Wire Tension Range | 0–15 N |
| Wire Operation Mode | Reciprocating / Unidirectional |
| Feed Travel | ≤220 mm |
| Velocidade de alimentação de corte | 0.01–5 mm/min |
| Rapid Feed Speed | 200 mm/min |
| Método de corte | Downward feed |
| Workpiece Clamping | Automatic hydraulic clamping |
| Slurry Tank Capacity | 300 L |
| Wire Break Detection | Incluído |
| Main Roller Speed | <4500 r/min |
| Maximum Main Roller Diameter | Ø160 mm |
| Main Roller Quantity | 3 pcs + 3 spare |
| Fonte de alimentação | AC 380 V ±10%, 50/60 Hz |
| Dimensões da máquina | Approx. L1750 × W1600 × H2900 mm |
| Peso da máquina | Approx. 8 tons |
The above equipment configuration is based on the technical data supplied for this machine.
Precision Feed for Controlled Wafer Thickness
Consistent wafer slicing requires more than high wire speed. The movement of the material through the wire field must also remain stable.
The machine therefore uses a servo-controlled feed unit with a maximum stroke of approximately 220 mm.
The standard cutting feed speed can be adjusted from:
0.01 to 5 mm/min
while the rapid movement speed reaches:
200 mm/min.
This controlled feed architecture allows users to establish different process conditions according to workpiece material, target wafer thickness and wire specification.
Automatic Hydraulic Workpiece Clamping
Workpiece stability directly influences cutting repeatability.
The equipment uses an automatic hydraulic clamping system to secure the material during processing.
The processing envelope supports workpieces up to approximately:
W90 × H220 × L450 mm
with a maximum length of 450 mm.
This configuration can support different semiconductor material shapes provided they remain within the specified mechanical envelope and suitable fixtures are used.
Integrated Wire Control System
The wire system is composed of several coordinated mechanical units.
The machine documentation identifies the following main modules:
- Wire winding unit
- Wire traversing unit
- Tension arm
- Guide wheels
- Main spindle unit
- Workpiece feed unit
- Heat exchanger
- Slurry tank
- Electrical cabinet
- Operator control panel
The winding unit supplies and stores the cutting wire, while the traversing unit helps maintain smooth payout and even winding.
The tension arm keeps the wire running under a controlled tension, and the guide-wheel system assists with wire routing and stable movement through the cutting area.
Direct-Drive Main Roller System
The equipment uses a direct-drive architecture.
According to the machine specification, the direct connection between the drive system and mechanical components is intended to provide:
- Lower operating noise
- Lower wear-component consumption
- Improved drive precision
The main rollers are also equipped with direct motor drive.
This design reduces the load generated when the cutting wire drives the rollers and is intended to reduce both wire-break risk and roller-groove wear.
270 mm Roller Spacing Design
The specified main roller spacing is approximately:
270 mm
The machine documentation describes the reduced roller spacing as a design intended to improve cutting conditions while reducing cutting time and wire consumption.
For fine-wire cutting, reducing unsupported wire length in the processing area can be particularly useful when process stability is important.
Wire Break Detection and Alarm
Wire breakage is one of the major risks during precision wafer slicing, especially when processing valuable semiconductor materials.
The machine therefore includes standard wire-break detection.
The equipment documentation also specifies a dual-side wire-break alarm system intended to improve detection sensitivity.
This provides an additional layer of process monitoring during extended cutting cycles.
Mechanical Accuracy Requirements
The machine’s acceptance criteria include several mechanical accuracy checks.
| Mechanical Item | Requirement |
|---|---|
| Main Roller Runout | ≤0.02 mm |
| Spindle Taper Radial Runout | ≤0.005 mm |
| Spindle Core Axial Runout | ≤0.005 mm |
| Taper Contact Ratio | ≥70% |
| Vertical Feed Straightness | ≤0.005 mm / 150 mm |
| Wire Twist | <5 turns/m |
| Supply/Take-Up Spindle Vibration | ≤5 m/s² |
| Supply/Take-Up Roller Runout | ≤0.15 mm |
These values define the documented mechanical acceptance requirements of the equipment.
Slurry Circulation and Temperature Management
The cutting system includes a 300 L slurry tank for supplying cutting and cooling fluid during operation.
The integrated heat exchanger controls slurry temperature using external chilled water.
Recommended chilled-water conditions are:
| Utility Requirement | Especificação |
|---|---|
| Cooling Water Temperature | 11 ±1°C |
| Cooling Water Flow | 20–50 L/min |
| Cooling Water Pressure | 0.2–0.4 MPa |
| Cooling Capacity | ≥5 kW |
The cooling-water circuit is insulated to help prevent condensation.
Rigid Integrated Machine Construction
Mechanical rigidity is important when controlling vibration and maintaining stable wire geometry.
The equipment uses a high-strength steel enclosure and an integrated cast machine base.
The machine also includes a bottom tray intended to prevent liquid leakage onto the installation floor, while a pneumatic safety mechanism is provided at the upper section of the equipment to support safe lifting-platform operation.
Electrical and Factory Requirements
Standard power requirement:
Three-phase four-wire AC 380 V ±10%, 50/60 Hz
The technical documentation specifies installation using copper cable of 16 mm² or above.
Referenced operating power consumption is approximately:
5 kWh
although actual consumption will depend on the process and operating condition.
Recommended Operating Environment
Recommended environmental conditions include:
| Item | Requirement |
|---|---|
| Room Temperature | 18–28°C |
| Relative Humidity | ≤75% |
| Environmental Vibration | ≤0.5 G |
The supplied documentation additionally specifies hydraulic workpiece clamping, a 300 L slurry tank and six guide wheels in the referenced configuration.
Semiconductor Wafer Slicing Application
The stated industry application for the machine is:
Semiconductor Wafer Cutting.
Depending on project requirements, the machine may be evaluated for semiconductor and hard-brittle material slicing projects where fine wire and precision feed are required.
Typical customer requirements may include:
- Semiconductor crystal slicing
- Thin wafer preparation
- Research wafer cutting
- Pilot-line wafer production
- Custom wafer thickness development
- Pre-grinding wafer preparation
- Pre-polishing wafer preparation
For specific materials, final process feasibility should be evaluated according to material properties, workpiece geometry, target thickness, tolerance and downstream processing requirements.
Configurações opcionais
Available optional items listed in the technical configuration include:
SECS II communication
Cooling water chiller
Workpiece clamping temperature adjustment
and other process-related configurations.
These functions can be selected according to the customer’s production line and factory automation requirements.
Porquê escolher a ZMSH
ZMSH provides semiconductor materials, wafers, precision components and related processing solutions.
For a wafer slicing project, the equipment itself is only one part of the process.
A complete technical evaluation should normally consider:
Material → Ingot Size → Cutting Wire → Target Thickness → Thickness Tolerance → Cutting Condition → Surface Condition → Grinding → Lapping → Polishing
Customers can therefore provide both the raw material condition and final wafer requirements when requesting a quotation.
This helps ensure the recommended equipment configuration matches the actual semiconductor processing process rather than only the nominal machine specifications.
Informações necessárias para a elaboração do orçamento
Please provide the following information when requesting a quotation:
- Material type
- Workpiece or ingot dimensions
- Target wafer dimensions
- Target thickness
- Thickness tolerance
- Quantity per batch
- Required production capacity
- Wire diameter, if specified
- Cutting accuracy requirement
- Required surface condition after slicing
- Factory power supply
- Cooling-water conditions
- Required SECS II or other automation interfaces
ZMSH can evaluate the appropriate equipment configuration based on these parameters.
FAQ
What is the maximum wire speed?
The maximum specified cutting wire speed is 2200 m/min.
What wire diameter does the machine support?
The specified range is 0.014–0.10 mm.
What is the cutting accuracy?
The supplied equipment documentation specifies cutting accuracy of ±0.01 mm.
What is the minimum slicing thickness?
The documented minimum slicing thickness is less than 0.05 mm, subject to suitable cutting conditions.
Does the equipment detect wire breakage?
Yes. Wire-break detection is included in the equipment specification.
Can the system connect to semiconductor factory automation?
SECS II communication is listed as an optional configuration.
Request a Quote for Semiconductor Wafer Precision Wire Saw Machine for Thin Wafer Slicing
Tell us your required specifications, dimensions, quantity, application and technical requirements. You can also provide drawings or additional project information. Our technical team will review your requirements and reply as soon as possible.
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