Ai300 (Medium Beam) High Temperature Ion Implantation System for 12 Inch Wafer Processing

The Ai300 (Medium Beam) high temperature ion implantation system is designed for 12-inch silicon wafer semiconductor manufacturing lines. It is a medium current ion implanter developed for advanced doping processes in both silicon-based and wide bandgap semiconductor applications, including SiC process lines.

Ai300 (Medium Beam) High Temperature Ion Implantation System for 12 Inch Wafer ProcessingThe Ai300 (Medium Beam) high temperature ion implantation system is designed for 12-inch silicon wafer semiconductor manufacturing lines. It is a medium current ion implanter developed for advanced doping processes in both silicon-based and wide bandgap semiconductor applications, including SiC process lines.

The system supports an energy range from 5 keV to 300 keV, enabling flexible implantation from shallow junction formation to deep doping applications. It is equipped with a high temperature heated wafer stage with a maximum temperature up to 400°C, allowing improved dopant activation and reduced lattice damage during implantation.

With stable beam performance, high precision control, and compatibility with large-scale integrated circuit processes, the Ai300 system is suitable for advanced semiconductor manufacturing environments.


Features

High Temperature Implant Capability

Equipped with a heated wafer stage supporting temperatures up to 400°C, improving implantation quality and dopant activation efficiency.

Wide Energy Range

Energy range of 5–300 keV supports both shallow and deep implantation processes for advanced device structures.

High Precision Beam Control

Provides high accuracy implantation with angle accuracy ≤ 0.1°, beam parallelism ≤ 0.1°, uniformity ≤ 0.5%, and repeatability ≤ 0.5%.

High Throughput Performance

Supports throughput up to ≥ 500 wafers per hour, suitable for high-volume semiconductor manufacturing.

Advanced Ion Source Capability

Supports multiple implanted elements including C, B, P, N, He, and Ar, meeting diverse semiconductor process requirements.

LSI Process Compatibility

Fully compatible with large-scale integrated circuit manufacturing processes and advanced device fabrication.


Viktiga specifikationer

Process Parameters

Föremål Specifikation
Wafer-storlek 12 inch
Energy Range 5–300 keV
Implanted Elements C, B, P, N, He, Ar
Dose Range 1E11–1E16 ions/cm²

Beam Performance

Föremål Specifikation
Beam Stability ≤ 10% / hour (≤1 beam interruption or arcing per hour)
Beam Parallelism ≤ 0.1°

Implantation Accuracy

Föremål Specifikation
Implant Angle Range 0°–45°
Angle Accuracy ≤ 0.1°
Uniformity (1σ) ≤ 0.5% (P+, 1E14, 100 keV)
Repeatability (1σ) ≤ 0.5%

System Performance

Föremål Specifikation
Genomströmning ≥ 500 wafers per hour
Maximum Implant Temperature 400°C
Equipment Size 6400 × 3640 × 3100 mm
Vakuumnivå 5E-7 Torr
X-ray Leakage ≤ 0.3 μSv/h
Scanning Mode Horizontal electrostatic scanning + vertical mechanical scanning

Application Fields

SiC Semiconductor Processing

Used in silicon carbide device fabrication, supporting high temperature implantation processes required for wide bandgap materials.

Silicon-Based Semiconductor Manufacturing

Applicable to 12-inch silicon wafer production lines for CMOS and advanced integrated circuit fabrication.

High Temperature Implantation Processes

Supports implantation processes requiring elevated wafer temperature to reduce defects and improve dopant activation.

Power Device Fabrication

Suitable for power semiconductor devices where precise doping and high energy implantation are required.

Advanced Integrated Circuit Production

Supports LSI process integration with high precision and high throughput requirements.


Vanliga frågor och svar

1. What wafer size does the Ai300 system support

The system is designed for 12-inch silicon wafers and is suitable for advanced semiconductor manufacturing lines.

2. What is the key advantage of the high temperature implantation capability

The system supports implantation up to 400°C, which helps reduce lattice damage, improve dopant activation, and enhance overall device performance.

3. What level of precision and production efficiency does the system provide

The system provides angle accuracy within 0.1 degrees, beam parallelism within 0.1 degrees, and uniformity and repeatability within 0.5 percent, with throughput up to 500 wafers per hour.

Recensioner

Det finns inga recensioner än.

Bli först med att recensera ”Ai300 (Medium Beam) High Temperature Ion Implantation System for 12 Inch Wafer Processing”

Din e-postadress kommer inte publiceras. Obligatoriska fält är märkta *