The 310×310 mm Alumina Ceramic Heat Sink Plate is a large-size thermal management substrate manufactured from high-purity Al₂O₃ ceramic materials. Engineered for demanding environments, it combines efficient heat dissipation, excellent electrical insulation, high mechanical strength, and outstanding thermal stability.
Unlike conventional metal heat sinks, alumina ceramic provides thermal performance while maintaining electrical isolation, making it especially suitable for power electronics, semiconductor equipment, RF systems, and high-voltage applications.
With excellent corrosion resistance and dimensional stability under elevated temperatures, this ceramic heat dissipation plate delivers reliable long-term performance in industrial environments.
Product Advantages
✔ Excellent heat dissipation performance
✔ High dielectric strength and electrical insulation
✔ Resistant to high temperatures and thermal cycling
✔ High hardness and wear resistance
✔ Corrosion and chemical resistance
✔ Low thermal expansion for dimensional stability
✔ Precision surface grinding available
✔ Suitable for semiconductor-grade applications
Available Material Options
Different purity levels are available according to application and budget requirements:
| Matériau | Characteristics | Recommended Application |
|---|---|---|
| 95% Al₂O₃ | Cost-effective industrial grade | General heat dissipation systems |
| 96% Al₂O₃ | Improved strength and stability | Industrial electronic assemblies |
| 99% Al₂O₃ | High purity and better insulation | Semiconductor and precision equipment |
Spécifications techniques
| Objet | Spécifications |
|---|---|
| Matériau | Alumina Ceramic (Al₂O₃) |
| Taille | 310 × 310 mm |
| Épaisseur | 0.5–10 mm Customizable |
| Densité | 3.6–3.9 g/cm³ |
| Conductivité thermique | 20–30 W/m·K |
| Dielectric Strength | ≥10–15 kV/mm |
| Volume Resistivity | ≥10¹⁴ Ω·cm |
| Résistance à la flexion | ≥300–350 MPa |
| Dureté | ≥80 HRA |
| Rugosité de surface | Ra ≤0.4–0.8 μm |
| Planéité | ≤0.05–0.10 mm |
| Couleur | White / Ivory |
Applications typiques
Power Electronics Cooling
- IGBT module cooling systems
- MOSFET heat dissipation platforms
- Power module insulation structures
Équipements semi-conducteurs
- Wafer process fixtures
- Support plates and carriers
- Vacuum equipment components
LED Thermal Management
- High-power LED modules
- Industrial lighting systems
RF and High Voltage Equipment
- Microwave devices
- Electrical insulation platforms
Precision Industrial Systems
- Electronic packaging assemblies
- Precision thermal management structures
Precision Machining and Customization
Custom manufacturing services are available according to drawings and application requirements:
- Custom sizes and thicknesses
- CNC machining
- Laser cutting
- Precision drilling and slots
- Surface grinding and polishing
- Metallization support:
- Ag coating
- Au coating
- Ni plating
- Semiconductor-grade flatness processing
OEM and custom fabrication supported.
Contrôle de la qualité
Each ceramic heat sink plate undergoes strict inspection procedures:
✔ Dimensional inspection
✔ Surface quality verification
✔ Flatness testing
✔ Crack and defect inspection
✔ Packaging protection inspection
Packaging: Shock-resistant foam and export-grade cartons for international transportation.
Questions fréquemment posées
Q1: Why choose alumina ceramic instead of aluminum heat sinks?
Aluminum offers higher thermal conductivity, but alumina ceramic provides superior electrical insulation, corrosion resistance, and high-temperature stability, making it ideal for high-voltage and semiconductor environments.
Q2: Can customized holes and shapes be processed?
Yes. CNC machining, laser cutting, drilling, grooves, and custom structural processing are available according to customer drawings.
Q3: Is the plate suitable for semiconductor equipment applications?
Yes. High-purity alumina ceramics are widely used in semiconductor processing systems because of their dimensional stability, insulation performance, and resistance to harsh operating conditions.
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