The diamond wire multi-wire dual-station cutting machine is a core equipment for precision processing of brittle materials. By using the high-speed reciprocating motion of diamond wire (steel wire coated with silicon carbide or aluminum oxide particles) and relative abrasion with the workpiece, it achieves accurate cutting of hard materials.
The dual-station design accommodates two workpiece fixtures simultaneously (or alternating operations), significantly improving production efficiency. It is widely used for squaring, slicing, and precision shaping of materials such as semiconductor wafers, sapphire, silicon carbide (SiC), ceramics, quartz, and precious metals.
This machine integrates servo control systems, tension regulation, and oscillating cutting technologies, balancing efficiency and precision, and is a critical tool in industries such as photovoltaics, semiconductors, and advanced manufacturing.
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | Multi-Wire Saw |
| Maximum Workpiece Size | ø320×430mm |
| Main Roller Coating Diameter | ø210×450mm (5 main rollers) |
| Wire Running Speed | 1000 (MIX) m/min |
| Diamond Wire Diameter | 0.2–0.37mm |
| Line Storage Capacity (Supply Wheel) | 20 km (0.25mm wire diameter) |
| Cutting Thickness Range | 1.5–80mm |
| Cutting Accuracy | ±0.01mm |
| Vertical Lifting Stroke of Workstation | 350mm |
| Cutting Method | Workbench swings; diamond wire remains stationary |
| Cutting Feed Speed | 0.01–10mm/min |
| Water Tank | 300L |
| Cutting Fluid | Anti-rust high-efficiency cutting fluid |
| Swing Angle | ±8° |
| Swing Speed | 0.83°/s |
| Maximum Cutting Tension | 100N (minimum unit 0.1N) |
| Cutting Depth | 430mm |
| Workstations | 2 |
| Power Supply | Three-phase five-wire AC380V/50Hz |
| Total Machine Power | ≤52kW |
| Main Motor | 7.5×3kW |
| Wiring Motor | 0.75×2kW |
| Workbench Swing Motor | 1.3×2kW |
| Tension Control Motor | 4.4×2kW |
| Wire Release & Collection Motor | 5.5×2kW |
| External Dimensions (without rocker arm box) | 2310×2660×2893mm |
| Machine Weight | 6000kg |
Working Principle
The machine operates based on “diamond wire abrasion + workpiece feed”:
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Diamond Wire Cycling
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A high-speed rotating capstan drives the diamond wire in reciprocating motion (or unidirectional cycling).
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Wire tension is maintained via spring-loaded or pneumatic tension wheels for stable cutting.
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Workpiece Feed
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Servo motors control the workpiece fixture to move toward the diamond wire at a constant speed, generating relative abrasion for cutting.
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Dual-Station Switching
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After cutting one workpiece, the machine automatically switches to the other fixture for continuous operation without downtime.
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Key Technologies
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Oscillating Cutting: ±8° oscillating worktable ensures uniform wire contact and improved surface flatness.
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Tension Control: Sensors monitor real-time wire tension to prevent slippage or breakage.
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Core Features
| Feature | Description |
|---|---|
| High Efficiency | Dual-station design doubles production capacity; high wire speeds reduce cutting time. |
| High Precision | Servo motors + ball screws ensure ±0.01mm accuracy; oscillating mode minimizes surface burrs. |
| Flexibility | Supports single/multi-wire switching and adjustable feed rates (0.01–10 mm/min). |
| Eco-Friendly | Water-based cutting fluids reduce dust and noise. |
| Stability | Cast frameworks enhance rigidity; break-resume function prevents workpiece rejection. |
Applications
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Semiconductors & Photovoltaics
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Wafer slicing for silicon (mono/poly-crystalline) and PERC solar cells
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Edge profiling for LED substrates and solar modules
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Ceramics & Gems
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Sapphire slicing for LED displays and smartphone screens
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Silicon Carbide (SiC) precision cutting for EV power devices, minimizing material waste
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Quartz & Optical Glass
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Crystal oscillators: high-precision slicing for sensors and telecom
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Optical components: lens and prism cutting with minimal surface defects
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Metals & Rare Earths
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Precious metals (gold, platinum) cutting for jewelry, reducing scrap
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Rare earth magnets (NdFeB) slicing for motors and sensors
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FAQ
Q: How does a diamond wire dual-station cutting machine work?
A: It uses diamond wire cycling (reciprocating motion) and a dual-station design for continuous cutting and material switching, minimizing downtime.
Q: What are the key advantages of diamond wire dual-station cutting machines?
A: High efficiency (dual-station parallel processing) and precision (±0.01mm accuracy) for cutting brittle materials like silicon wafers and ceramics.
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