Micro-perceuse laser de précision picoseconde avec commande à quatre axes pour les matériaux ultra-durs et à haute température

The Picosecond Precision Laser Micro-Drilling Machine is engineered for ultra-precise laser micro-drilling and cutting of ultra-hard and high-temperature materials. Equipped with a reliable industrial control computer and advanced laser processing software, the system features a user-friendly interface and full automation for laser drilling and cutting processes.

Key capabilities include:

• Four-axis motion control

• Laser on/off and frequency adjustment

• Gas valve control

• G-code programming or automatic CAD-based programming

• Real-time visualization of drilling and cutting patterns with process tracking

The integrated laser focusing monitoring system includes mirrors, black-and-white CCD camera, monitor, and beam expander. The system supports electronic crosshair alignment and magnification >150x on a high-resolution color monitor, enabling precise positioning. Hole diameter, depth, and shape can be fully set and controlled via the computer.

Matériaux applicables :

Suitable for a wide range of ultra-hard and high-temperature materials, including:

• Natural and polycrystalline diamonds

• Ruby and sapphire

• Copper, ceramics, rhenium

• Stainless steel, carbon steel, alloy steel

Caractéristiques principales :

• Haute précision : Achieves micron-scale holes with minimal thermal effect

• Customizable: Adjustable hole size, depth, taper, and shape

• Advanced Software: Supports G-code and CAD-based automatic programming

• Four-Axis Control: Ensures precise movement and positioning

• Real-Time Monitoring: High-resolution CCD camera and color monitor with >150x magnification

• Fully Automated: Complete laser drilling and cutting process controlled via software

Application Examples