The Picosecond Precision Laser Micro-Drilling Machine is engineered for ultra-precise laser micro-drilling and cutting of ultra-hard and high-temperature materials. Equipped with a reliable industrial control computer and advanced laser processing software, the system features a user-friendly interface and full automation for laser drilling and cutting processes.
Key capabilities include:
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Four-axis motion control
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Laser on/off and frequency adjustment
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Gas valve control
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G-code programming or automatic CAD-based programming
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Real-time visualization of drilling and cutting patterns with process tracking
The integrated laser focusing monitoring system includes mirrors, black-and-white CCD camera, monitor, and beam expander. The system supports electronic crosshair alignment and magnification >150x on a high-resolution color monitor, enabling precise positioning. Hole diameter, depth, and shape can be fully set and controlled via the computer.
Anwendbare Materialien:
Suitable for a wide range of ultra-hard and high-temperature materials, including:
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Natural and polycrystalline diamonds
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Ruby and sapphire
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Copper, ceramics, rhenium
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Stainless steel, carbon steel, alloy steel
Wesentliche Merkmale:
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Hohe Präzision: Achieves micron-scale holes with minimal thermal effect
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Customizable: Adjustable hole size, depth, taper, and shape
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Advanced Software: Supports G-code and CAD-based automatic programming
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Four-Axis Control: Ensures precise movement and positioning
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Real-Time Monitoring: High-resolution CCD camera and color monitor with >150x magnification
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Fully Automated: Complete laser drilling and cutting process controlled via software
Application Examples
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