초경질 소재의 초소형 홀 및 복잡한 홀 형상을 위한 레이저 마이크로 드릴링 머신

The High-Precision Laser Micro-Drilling Machine is designed for the automated formation of ultra-small and complex holes in ultra-hard and high-temperature-resistant materials. The system integrates a high-performance laser source, a coaxial CCD monitoring system, a precision four-axis motion worktable, and a self-developed software control platform.

Through advanced hole-shape programming, the machine is capable of producing multi-layer straight tapered holes, trumpet-shaped holes, straight holes, reverse-taper holes, as well as complex axial inner-wall curved and arbitrary-profile holes. The specially developed software enables stable, high-speed, and fully automated laser drilling processes, making it ideal for precision industrial applications.

주요 기능

• Ultra-Short Wavelength & Small Focus Spot
  Shorter laser wavelength and smaller focal spot significantly reduce the ablation zone, resulting in smooth inner hole walls and superior hole quality.

• Ultra-Small Hole Capability
  Capable of drilling ultra-fine holes down to below 0.005 mm in thin materials, with hole diameter tolerance up to ±0.005 mm.

• Complex Hole Geometry Processing
  Supports drilling of straight holes, tapered holes, reverse-taper holes, multi-layer trumpet holes, and various irregular and curved hole shapes.

• High-Speed & Stable Operation
  Reverse-side drilling design allows convenient clamping, fast processing speed, and long-term stable operation.

• Advanced Self-Developed Software
  Powerful new-generation software system enables automatic micro-hole forming, especially optimized for diamond wire drawing dies.

• Four-Axis Precision Motion Platform
  Ensures high positioning accuracy and repeatability for complex hole machining.

Applicable Materials

Suitable for a wide range of ultra-hard and high-temperature-resistant materials, including:

• Natural diamond

• Polycrystalline diamond (PCD)

• Ruby and sapphire

• 구리

• 세라믹

• Stainless steel

• Carbon steel

• Alloy steel

Technical Capabilities

• Ultra-small hole diameter: ≤ 0.005 mm (thin materials)

• Hole diameter tolerance: ±0.005 mm

• Supports arbitrary-shaped and special-profile holes

• Compatible with multiple metal and selected non-metal materials

애플리케이션 산업

Widely used in precision drilling industries such as:

• Diamond wire drawing dies

• EDM wire drawing molds

• Muffler micro-hole processing

• Medical needle micro-holes

• Gemstone bearings

• Precision nozzles and orifice plates

Application Examples

• Single Crystal Diamond Wire Drawing Die Drilling
• Sapphire Circular Hole Drilling
• Sapphire Y-Shaped Hole Drilling
• Ruby Ball Blind Hole Drilling
• Rhenium Sheet Drilling
• Irregular Profile Cutting and Drilling

GET A QUOTE

Request a Quote for Laser Micro-Drilling Machine for Ultra-Small Holes and Complex Hole Geometries in Ultra-Hard Materials

Tell us your required specifications, dimensions, quantity, application and technical requirements. You can also provide drawings or additional project information. Our technical team will review your requirements and reply as soon as possible.

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