{"id":2529,"date":"2026-06-05T06:08:58","date_gmt":"2026-06-05T06:08:58","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2529"},"modified":"2026-06-05T06:08:59","modified_gmt":"2026-06-05T06:08:59","slug":"ultra-thin-free-standing-diamond-film-for-advanced-semiconductor-packaging-and-thermal-solutions","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/tr\/product\/ultra-thin-free-standing-diamond-film-for-advanced-semiconductor-packaging-and-thermal-solutions\/","title":{"rendered":"Ultra-Thin Free-Standing Diamond Film for Advanced Semiconductor Packaging and Thermal Solutions"},"content":{"rendered":"

\"\"Ultra-Thin Free-Standing Diamond Film is an innovative thermal management material specifically designed for advanced semiconductor packaging, high-power electronics, and emerging photonic systems.<\/p>\n

Manufactured using advanced MPCVD diamond growth technology, the film features a self-supporting polycrystalline diamond structure without requiring a silicon carrier substrate. With thicknesses ranging from 5 \u03bcm to 25 \u03bcm, it combines ultra-high thermal conductivity, electrical insulation, and mechanical flexibility within an exceptionally thin form factor.<\/p>\n

Unlike conventional diamond substrates that are thick and rigid, this free-standing diamond film can be integrated directly into advanced packaging architectures, enabling efficient heat extraction from densely integrated semiconductor devices while minimizing package thickness and thermal resistance.<\/p>\n

The material is particularly suitable for chiplet packaging, 2.5D\/3D integration, wafer-level packaging, AI processors, RF electronics, and next-generation power semiconductor modules.<\/p>\n

\n
\n<\/div>\n

Temel \u00d6zellikler<\/h2>\n

Ultra-Thin and Lightweight<\/h3>\n

Film thicknesses are available from 5 \u03bcm to 25 \u03bcm, allowing integration into highly compact semiconductor packages where space is limited.<\/p>\n

Self-Supporting Structure<\/h3>\n

The film does not require a silicon wafer, metal carrier, or backing substrate, reducing package complexity and interface losses.<\/p>\n

Exceptional Thermal Conductivity<\/h3>\n

Diamond remains the industry’s benchmark thermal conductor, enabling rapid heat spreading and hotspot suppression in high-power devices.<\/p>\n

Flexible Mechanical Properties<\/h3>\n

The ultra-thin structure provides a degree of flexibility that traditional diamond substrates cannot achieve, simplifying integration into complex package designs.<\/p>\n

Electrically Insulating<\/h3>\n

Offers excellent electrical isolation while maintaining outstanding thermal performance, making it suitable for sensitive electronic and RF applications.<\/p>\n

Precision Processing Capability<\/h3>\n

Supports laser cutting, customized dimensions, and application-specific geometries for advanced packaging requirements.<\/p>\n

\n
\n<\/div>\n

Teknik \u00d6zellikler<\/h2>\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Parametre<\/th>\n\u015eartname<\/th>\n<\/tr>\n
Malzeme<\/td>\nPolycrystalline Diamond<\/td>\n<\/tr>\n
Yap\u0131<\/td>\nFree-Standing Diamond Film<\/td>\n<\/tr>\n
Kal\u0131nl\u0131k<\/td>\n5\u201325 \u03bcm<\/td>\n<\/tr>\n
Termal \u0130letkenlik<\/td>\nUltra-High<\/td>\n<\/tr>\n
Electrical Property<\/td>\nInsulating<\/td>\n<\/tr>\n
Y\u00fczey \u0130\u015flemi<\/td>\nSmooth Surface<\/td>\n<\/tr>\n
Processing Method<\/td>\nPrecision Laser Cutting<\/td>\n<\/tr>\n
\u015eekil Se\u00e7enekleri<\/td>\nRound, Square, Customized<\/td>\n<\/tr>\n
Size Customization<\/td>\nMevcut<\/td>\n<\/tr>\n
Application Level<\/td>\nPackage-Level Thermal Management<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n
\n<\/div>\n

Advantages Compared with Conventional Diamond Substrates<\/h2>\n\n\n\n\n\n\n\n\n\n\n
M\u00fclkiyet<\/td>\nFree-Standing Diamond Film<\/td>\nConventional Diamond Plate<\/td>\n<\/tr>\n
Kal\u0131nl\u0131k<\/td>\n5\u201325 \u03bcm<\/td>\n50\u2013500 \u03bcm<\/td>\n<\/tr>\n
A\u011f\u0131rl\u0131k<\/td>\nUltra-Light<\/td>\nRelatively Heavy<\/td>\n<\/tr>\n
Esneklik<\/td>\nM\u00fckemmel<\/td>\nRigid<\/td>\n<\/tr>\n
Thermal Performance<\/td>\nOutstanding<\/td>\nOutstanding<\/td>\n<\/tr>\n
Packaging Compatibility<\/td>\nM\u00fckemmel<\/td>\nOrta d\u00fczeyde<\/td>\n<\/tr>\n
Processability<\/td>\nEasy Custom Cutting<\/td>\nMore Complex<\/td>\n<\/tr>\n
Integration Freedom<\/td>\nY\u00fcksek<\/td>\nS\u0131n\u0131rl\u0131<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n
\n<\/div>\n

Uygulama Alanlar\u0131<\/h2>\n

Geli\u015fmi\u015f Ambalajlama<\/h3>\n

Suitable for chiplet packaging, heterogeneous integration, fan-out packaging, wafer-level packaging (WLP), panel-level packaging (PLP), and 3D IC technologies.<\/p>\n

AI and High-Performance Computing<\/h3>\n

Provides effective thermal spreading for AI accelerators, advanced GPUs, CPUs, and data-center processors operating at high power densities.<\/p>\n

G\u00fc\u00e7 Elektroni\u011fi<\/h3>\n

Ideal for SiC MOSFETs, GaN devices, IGBTs, and other power semiconductor components requiring superior thermal management.<\/p>\n

RF and Microwave Systems<\/h3>\n

Supports thermal control in RF power amplifiers, radar modules, satellite communication systems, and wireless infrastructure equipment.<\/p>\n

Photonics and Optical Devices<\/h3>\n

Improves heat dissipation in laser diodes, optical transceivers, silicon photonics devices, and photonic integrated circuits.<\/p>\n

Emerging Flexible Electronics<\/h3>\n

The flexible nature of the film enables thermal management solutions for wearable electronics, flexible circuits, and next-generation electronic systems.<\/p>\n

\n
\n<\/div>\n

\"\"Manufacturing Capability<\/h2>\n

Our diamond manufacturing platform supports:<\/p>\n

    \n
  • Free-standing diamond films from 5 \u03bcm to 25 \u03bcm<\/li>\n
  • Precision laser-cut components<\/li>\n
  • Customized dimensions and shapes<\/li>\n
  • Application-specific thickness development<\/li>\n
  • Prototype to volume production<\/li>\n
  • Strict quality control and thermal performance verification<\/li>\n<\/ul>\n

    Every film is manufactured under tightly controlled conditions to ensure uniform thickness, stable mechanical properties, and reliable thermal conductivity.<\/p>\n

    \n
    \n<\/div>\n

    Why Choose Our Free-Standing Diamond Film?\"\"<\/h2>\n
      \n
    • Ultra-thin structure as low as 5 \u03bcm<\/li>\n
    • Self-supporting design without carrier substrate<\/li>\n
    • Exceptional thermal conductivity<\/li>\n
    • Excellent electrical insulation<\/li>\n
    • Flexible and lightweight<\/li>\n
    • Suitable for advanced semiconductor packaging<\/li>\n
    • Custom dimensions and laser processing available<\/li>\n
    • Designed for future high-power and high-density electronics<\/li>\n<\/ul>\n
      \n
      \n<\/div>\n

      S\u0131k\u00e7a Sorulan Sorular<\/h2>\n

      What makes free-standing diamond film different from diamond-coated wafers?<\/h3>\n

      Diamond-coated wafers rely on a supporting substrate, while free-standing diamond film is completely self-supporting and can be integrated independently into packaging structures.<\/p>\n

      Is the film electrically conductive?<\/h3>\n

      No. The film provides excellent electrical insulation while maintaining extremely high thermal conductivity.<\/p>\n

      What industries can benefit from this material?<\/h3>\n

      The material is widely used in semiconductor packaging, AI computing, RF communications, photonics, power electronics, aerospace electronics, and advanced thermal management applications.<\/p>","protected":false},"excerpt":{"rendered":"

      Ultra-Thin Free-Standing Diamond Film is an innovative thermal management material specifically designed for advanced semiconductor packaging, high-power electronics, and emerging photonic systems.<\/p>","protected":false},"featured_media":2530,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[729],"product_tag":[1465,1466,1463,1464,1461,1460,1428,1459,1458,1467,1468,1470,1462,1469,1440,815],"class_list":{"0":"post-2529","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-wafer","7":"product_tag-2-5d-packaging","8":"product_tag-3d-ic-packaging","9":"product_tag-advanced-packaging-solutions","10":"product_tag-chiplet-packaging","11":"product_tag-diamond-heat-spreader","12":"product_tag-diamond-thermal-management","13":"product_tag-fan-out-packaging","14":"product_tag-flexible-diamond-film","15":"product_tag-free-standing-diamond-film","16":"product_tag-heterogeneous-integration","17":"product_tag-high-thermal-conductivity-diamond","18":"product_tag-semiconductor-cooling-solution","19":"product_tag-semiconductor-packaging-materials","20":"product_tag-thermal-interface-material","21":"product_tag-ultra-thin-diamond-film","22":"product_tag-wafer-level-packaging","23":"desktop-align-left","24":"tablet-align-left","25":"mobile-align-left","26":"ast-product-gallery-layout-horizontal-slider","27":"ast-product-tabs-layout-horizontal","29":"first","30":"instock","31":"shipping-taxable","32":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product\/2529","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/comments?post=2529"}],"version-history":[{"count":2,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product\/2529\/revisions"}],"predecessor-version":[{"id":2535,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product\/2529\/revisions\/2535"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/media\/2530"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/media?parent=2529"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product_brand?post=2529"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product_cat?post=2529"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product_tag?post=2529"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}