![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ti-Cu-Metal-Coated-Silicon-Wafer-Titanium-Copper-Sputtered-Wafer-for-MEMS-Microelectronics-1-300x300.png\")
Ti\/Cu Metal Kapl\u0131 Silikon Wafer, ileri ara\u015ft\u0131rma ve end\u00fcstriyel uygulamalar i\u00e7in standart iletken ve proses uyumlu bir alt tabaka olarak tasarlanm\u0131\u015ft\u0131r. Silikon gofret teknolojisini metal ince film kaplama ile birle\u015ftirerek, elektrik, kimyasal ve mikrofabrikasyon i\u015flemleri i\u00e7in istikrarl\u0131 bir platform sa\u011flar.<\/p>\n
Ti\/Cu kaplama sisteminin yap\u0131s\u0131 hem mekanik g\u00fcvenilirlik hem de i\u015flevsel iletkenlik sa\u011flar. \u00d6zellikle g\u00fcvenilir metal aray\u00fczler, d\u00fczg\u00fcn y\u00fczey iletkenli\u011fi ve standart yar\u0131 iletken i\u015fleme teknikleriyle uyumluluk gerektiren uygulamalar i\u00e7in uygundur.<\/p>\n
\u00dcr\u00fcn, gofret boyutu, alt tabaka tipi ve film kal\u0131nl\u0131\u011f\u0131nda \u00f6zelle\u015ftirmeyi destekleyerek hem k\u00fc\u00e7\u00fck \u00f6l\u00e7ekli ara\u015ft\u0131rma deneyleri hem de pilot \u00fcretim ortamlar\u0131 i\u00e7in uygun hale getirir.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ti-Cu-Metal-Coated-Silicon-Wafer-Titanium-Copper-Sputtered-Wafer-for-MEMS-Microelectronics-4-300x300.png\")
Temel \u00d6zellikler<\/strong><\/span><\/h2>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ti-Cu-Metal-Coated-Silicon-Wafer-Titanium-Copper-Sputtered-Wafer-for-MEMS-Microelectronics-3-300x300.png\")
Tipik Yap\u0131<\/strong><\/span><\/h2>\nSubstrat + Titanyum Yap\u0131\u015fma Katman\u0131 + Bak\u0131r \u0130letken Katman<\/strong><\/p>\n Ti katman\u0131, alt tabaka ile bak\u0131r film aras\u0131nda bir aray\u00fcz ba\u011flama katman\u0131 g\u00f6revi g\u00f6rerek yap\u0131sal stabilite sa\u011flar. Cu katman\u0131, elektrik ve proses uygulamalar\u0131 i\u00e7in fonksiyonel iletken y\u00fczey sa\u011flar.<\/p>\n Ti\/Cu metal kapl\u0131 yonga plakas\u0131 vakumlu magnetron p\u00fcsk\u00fcrtme teknolojisi kullan\u0131larak \u00fcretilmi\u015ftir. \u0130lk olarak, yap\u0131\u015fmay\u0131 iyile\u015ftirmek i\u00e7in temizlenmi\u015f silikon y\u00fczey \u00fczerine bir titanyum tabaka biriktirilir. Ard\u0131ndan, d\u00fczg\u00fcn bir iletken y\u00fczey olu\u015fturmak i\u00e7in titanyum filmin \u00fczerine bir bak\u0131r tabaka biriktirilir.<\/p>\n Daha kal\u0131n bak\u0131r filmler gerektiren uygulamalar i\u00e7in, p\u00fcsk\u00fcrt\u00fclen bak\u0131r katman elektrokaplama i\u00e7in bir tohum katman\u0131 olarak kullan\u0131labilir ve g\u00fc\u00e7l\u00fc yap\u0131\u015fmay\u0131 korurken mikron d\u00fczeyinde kal\u0131nl\u0131k elde etmek i\u00e7in daha fazla metal b\u00fcy\u00fcmesine izin verir.<\/p>\n Bu kombinasyon i\u015flemi hem y\u00fcksek film kalitesi hem de esnek fonksiyonel geni\u015fleme sa\u011flar.<\/p>\n Silikon \u00fczerine do\u011frudan bak\u0131r kaplama ile kar\u015f\u0131la\u015ft\u0131r\u0131ld\u0131\u011f\u0131nda, Ti\/Cu yap\u0131s\u0131 \u015funlar\u0131 sa\u011flar:<\/p>\n Bu da onu hem ara\u015ft\u0131rma laboratuvarlar\u0131 hem de end\u00fcstriyel Ar-Ge ortamlar\u0131 i\u00e7in daha g\u00fcvenilir bir \u00e7\u00f6z\u00fcm haline getirir.<\/p>\n S1: Bak\u0131r kaplama alt\u0131nda neden titanyum kullan\u0131l\u0131yor?<\/strong> S2: Bak\u0131r kal\u0131nl\u0131\u011f\u0131 art\u0131r\u0131labilir mi?<\/strong> S3: Gofretin her iki taraf\u0131 da kaplanabilir mi?<\/strong> S4: Hangi alt tabaka se\u00e7enekleri mevcut?<\/strong> Ti\/Cu Metal Kapl\u0131 Silikon Gofret, magnetron p\u00fcsk\u00fcrtme teknolojisi kullan\u0131larak bir silikon substrat \u00fczerine bir titanyum yap\u0131\u015fma tabakas\u0131 ve bir bak\u0131r iletken tabaka biriktirilerek haz\u0131rlanan y\u00fcksek kaliteli bir fonksiyonel gofrettir. Titanyum tabaka film yap\u0131\u015fmas\u0131n\u0131 ve stabilitesini art\u0131r\u0131rken, bak\u0131r tabaka m\u00fckemmel elektrik iletkenli\u011fi sa\u011flar. Bu \u00fcr\u00fcn mikroelektronik, MEMS \u00fcretimi, laboratuvar ara\u015ft\u0131rmalar\u0131 ve ince film proses geli\u015ftirmede yayg\u0131n olarak kullan\u0131lmaktad\u0131r.<\/p>","protected":false},"featured_media":2428,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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\nTeknik \u00d6zellikler<\/strong><\/span><\/h2>\n
\n\n\n\n
\n \n\u00d6\u011fe<\/th>\n A\u00e7\u0131klama<\/th>\n<\/tr>\n<\/thead>\n \n Gofret Boyutu<\/td>\n 2\u2033, 4\u2033, 6\u2033, 8\u2033, \u00f6zel boyutlar<\/td>\n<\/tr>\n \n Alt Tabaka Malzemesi<\/td>\n Silikon, Kuvars, BF33 cam (iste\u011fe ba\u011fl\u0131)<\/td>\n<\/tr>\n \n Kristal Y\u00f6nlendirme<\/td>\n , , vb.<\/td>\n<\/tr>\n \n Diren\u00e7lilik<\/td>\n D\u00fc\u015f\u00fck \/ Orta \/ Y\u00fcksek (\u00f6zelle\u015ftirilebilir)<\/td>\n<\/tr>\n \n Ti Kal\u0131nl\u0131\u011f\u0131<\/td>\n 10-50 nm (tipik aral\u0131k)<\/td>\n<\/tr>\n \n Cu Kal\u0131nl\u0131\u011f\u0131<\/td>\n 50 nm - 1 \u00b5m (p\u00fcsk\u00fcrt\u00fclm\u00fc\u015f), elektrokaplama yoluyla daha kal\u0131n<\/td>\n<\/tr>\n \n Kaplama Y\u00f6ntemi<\/td>\n Magnetron p\u00fcsk\u00fcrtme<\/td>\n<\/tr>\n \n Kaplama Taraf\u0131<\/td>\n Tek tarafl\u0131 veya \u00e7ift tarafl\u0131<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ti-Cu-Metal-Coated-Silicon-Wafer-Titanium-Copper-Sputtered-Wafer-for-MEMS-Microelectronics-2-300x300.png\")
\u00dcretim S\u00fcreci<\/strong><\/span><\/h2>\n
\nUygulamalar<\/strong><\/span><\/h2>\n
\n
\nTek Metal Kaplamaya K\u0131yasla Avantajlar\u0131<\/strong><\/span><\/h2>\n
\n
\nSSS<\/strong><\/span><\/h2>\n
Titanyum, bak\u0131r ve silikon alt tabakalar aras\u0131ndaki yap\u0131\u015fmay\u0131 iyile\u015ftiren, i\u015fleme ve kullan\u0131m s\u0131ras\u0131nda delaminasyonu \u00f6nleyen bir yap\u0131\u015fma tabakas\u0131 g\u00f6revi g\u00f6r\u00fcr.<\/p>\n
Evet. P\u00fcsk\u00fcrt\u00fclm\u00fc\u015f bak\u0131r, uygulama gereksinimlerine ba\u011fl\u0131 olarak daha kal\u0131n metal katmanlar elde etmek i\u00e7in elektrokaplama i\u00e7in bir tohum katman\u0131 olarak kullan\u0131labilir.<\/p>\n
Evet. Talep \u00fczerine tek tarafl\u0131 veya \u00e7ift tarafl\u0131 kaplama se\u00e7enekleri mevcuttur.<\/p>\n
Standart silikon en yayg\u0131n olan\u0131d\u0131r, ancak \u00f6zel optik veya kimyasal uygulamalar i\u00e7in kuvars ve cam alt tabakalar da mevcuttur.<\/p>","protected":false},"excerpt":{"rendered":"