{"id":2327,"date":"2026-04-21T06:21:20","date_gmt":"2026-04-21T06:21:20","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2327"},"modified":"2026-04-21T06:21:21","modified_gmt":"2026-04-21T06:21:21","slug":"wafer-thinning-system-precision-back-grinding-equipment-for-si-sic-and-4-to-12-inch-semiconductor-wafers","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/tr\/product\/wafer-thinning-system-precision-back-grinding-equipment-for-si-sic-and-4-to-12-inch-semiconductor-wafers\/","title":{"rendered":"Gofret \u0130nceltme Sistemi Si SiC ve 4 ila 12 \u0130n\u00e7 Yar\u0131 \u0130letken Gofretler i\u00e7in Hassas Geri Ta\u015flama Ekipman\u0131"},"content":{"rendered":"

\"GofretWafer \u0130nceltme Sistemi Hassas Geri Ta\u015flama Ekipman\u0131, geli\u015fmi\u015f yar\u0131 iletken \u00fcretimi i\u00e7in tasarlanm\u0131\u015f y\u00fcksek hassasiyetli bir wafer i\u015fleme \u00e7\u00f6z\u00fcm\u00fcd\u00fcr. Silikon (Si), silikon karb\u00fcr (SiC), galyum arsenit (GaAs), safir ve di\u011fer k\u0131r\u0131lgan bile\u015fik yar\u0131 iletken malzemeler dahil olmak \u00fczere 4 in\u00e7 ila 12 in\u00e7 gofretleri destekler.<\/p>\n

Bu sistem, m\u00fckemmel y\u00fczey b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc korurken kal\u0131nl\u0131\u011f\u0131n mikron ve mikron alt\u0131 seviyelere indirilmesini sa\u011flayan ultra hassas gofret arka taraf\u0131 inceltme i\u00e7in tasarlanm\u0131\u015ft\u0131r. Geli\u015fmi\u015f paketleme, g\u00fc\u00e7 cihazlar\u0131, MEMS ve bile\u015fik yar\u0131 iletken \u00fcretiminde kritik bir rol oynar.<\/p>\n

Y\u00fcksek sertlikte mekanik tasar\u0131m, hassas Z ekseni kontrol\u00fc ve ger\u00e7ek zamanl\u0131 kal\u0131nl\u0131k izlemeyi entegre eden ekipman, end\u00fcstriyel \u00f6l\u00e7ekte \u00fcretim i\u00e7in istikrarl\u0131 ve tekrarlanabilir i\u015fleme performans\u0131 sa\u011flar.<\/p>\n

\n

Temel Teknik \u00d6zellikler<\/span><\/h2>\n

Y\u00fcksek Hassasiyetli Kal\u0131nl\u0131k Kontrol\u00fc<\/span><\/h3>\n
    \n
  • Kal\u0131nl\u0131k hassasiyeti: \u00b11 \u03bcm<\/li>\n
  • Toplam Kal\u0131nl\u0131k De\u011fi\u015fimi (TTV): \u22642 \u03bcm<\/li>\n
  • Geli\u015fmi\u015f modeller \u00b10,5 \u03bcm'ye kadar mikron alt\u0131 kontrol sa\u011flar<\/li>\n<\/ul>\n

    \"\"Geni\u015f Malzeme Uyumlulu\u011fu<\/span><\/h3>\n

    \u00c7ok \u00e7e\u015fitli yar\u0131 iletken ve k\u0131r\u0131lgan malzemeleri destekler:<\/p>\n

      \n
    • Silisyum (Si)<\/li>\n
    • Silisyum Karb\u00fcr (SiC)<\/li>\n
    • Galyum Arsenit (GaAs)<\/li>\n
    • Safir (Al\u2082O\u2083)<\/li>\n
    • Di\u011fer bile\u015fik yar\u0131 iletken gofretler<\/li>\n<\/ul>\n

      Wafer Boyut Uyumlulu\u011fu<\/span><\/h3>\n
        \n
      • 4 in\u00e7 \/ 6 in\u00e7 \/ 8 in\u00e7 \/ 10 in\u00e7 \/ 12 in\u00e7 gofretler<\/li>\n
      • Hem standart hem de \u00f6zelle\u015ftirilmi\u015f alt tabakalar i\u00e7in esnek kullan\u0131m<\/li>\n<\/ul>\n

        Y\u00fcksek Stabiliteli Mekanik Sistem<\/span><\/h3>\n
          \n
        • Y\u00fcksek sertlikte hava yatakl\u0131 mil<\/li>\n
        • D\u00fc\u015f\u00fck titre\u015fimli hassas ta\u015flama platformu<\/li>\n
        • \u0130thal vidal\u0131 mil + lineer k\u0131lavuz sistemi<\/li>\n
        • Y\u00fcksek hassasiyetli servo motor kontrol\u00fc (0,1 \u03bcm \u00e7\u00f6z\u00fcn\u00fcrl\u00fck)<\/li>\n<\/ul>\n

          Geli\u015fmi\u015f So\u011futma Sistemi<\/span><\/h3>\n
            \n
          • Su so\u011futmal\u0131 i\u015f mili sistemi termal stabilite sa\u011flar<\/li>\n
          • Y\u00fcksek h\u0131zl\u0131 ta\u015flama s\u0131ras\u0131nda deformasyonu \u00f6nler<\/li>\n<\/ul>\n
            \n

            Sistem Yap\u0131land\u0131rmas\u0131<\/span><\/h2>\n

            Gofret inceltme sistemi birden fazla i\u015flevsel mod\u00fcl\u00fc entegre eder:<\/p>\n

            1. Hassas Ta\u015flama Mod\u00fcl\u00fc<\/span><\/h3>\n

            Y\u00fcksek y\u00fczey homojenli\u011fi ile kontroll\u00fc malzeme kald\u0131rma ger\u00e7ekle\u015ftirir.<\/p>\n

            2. Z Ekseni Hassas Kontrol Sistemi<\/span><\/h3>\n

            Tutarl\u0131 gofret kal\u0131nl\u0131\u011f\u0131 i\u00e7in ultra ince dikey ayar sa\u011flar.<\/p>\n

            3. Kal\u0131nl\u0131k \u00d6l\u00e7\u00fcm Sistemi<\/span><\/h3>\n

            Ger\u00e7ek zamanl\u0131 temasl\u0131\/temass\u0131z \u00f6l\u00e7\u00fcm proses stabilitesini sa\u011flar.<\/p>\n

            4. Vakumlu Gofret Aynas\u0131<\/span><\/h3>\n

            D\u00fczensiz gofretler i\u00e7in \u00f6zelle\u015ftirilmi\u015f \u00e7\u00f6z\u00fcmler de dahil olmak \u00fczere g\u00fcvenli gofret sabitleme.<\/p>\n

            5. Otomasyon Kontrol Sistemi<\/span><\/h3>\n
              \n
            • Tam otomatik \/ Yar\u0131 otomatik \u00e7al\u0131\u015fma modlar\u0131<\/li>\n
            • Operasyon g\u00fcnl\u00fc\u011f\u00fc kayd\u0131<\/li>\n
            • Re\u00e7ete tabanl\u0131 s\u00fcre\u00e7 kontrol\u00fc<\/li>\n<\/ul>\n
              \n

              \"\" \u0130\u015fleme Yetenekleri<\/span><\/h2>\n

              Sistem, y\u00fcksek performansl\u0131 gofret arka y\u00fcz\u00fc i\u015fleme i\u00e7in tasarlanm\u0131\u015ft\u0131r:<\/p>\n

                \n
              • Silikon gofret s\u0131rt ta\u015flama<\/li>\n
              • G\u00fc\u00e7 cihazlar\u0131 i\u00e7in SiC wafer inceltme<\/li>\n
              • GaN ve GaAs alt tabaka incelmesi<\/li>\n
              • Safir wafer hassas inceltme<\/li>\n
              • 3D paketleme i\u00e7in ultra ince gofret haz\u0131rlama<\/li>\n<\/ul>\n
                \n

                Uygulamalar<\/span><\/h2>\n

                1. G\u00fc\u00e7 Yar\u0131 \u0130letken Cihazlar\u0131<\/span><\/h3>\n

                SiC MOSFET'lerde, IGBT'lerde ve ultra ince wafer gerektiren y\u00fcksek voltajl\u0131 cihazlarda kullan\u0131l\u0131r.<\/p>\n

                \"\"2. Geli\u015fmi\u015f Paketleme<\/span><\/h3>\n

                Gofret inceltme i\u015flemini destekler:<\/p>\n

                  \n
                • Flip-chip paketleme<\/li>\n
                • 2.5D \/ 3D IC entegrasyonu<\/li>\n
                • TSV (Through Silicon Via) i\u015flemleri<\/li>\n<\/ul>\n

                  3. Bile\u015fik Yar\u0131 \u0130letkenler<\/span><\/h3>\n

                  GaN, GaAs ve InP cihaz imalat\u0131na uygulanabilir.<\/p>\n

                  4. LED ve Optoelektronik<\/span><\/h3>\n

                  LED \u00e7ipleri ve optik cihazlar i\u00e7in safir ve bile\u015fik gofret inceltme.<\/p>\n

                  \n

                  Avantajlar<\/span><\/h2>\n
                    \n
                  • Olgun ve istikrarl\u0131 yonga plakas\u0131 inceltme teknolojisi<\/li>\n
                  • Y\u00fcksek hassasiyetli besleme i\u00e7i ta\u015flama sistemi<\/li>\n
                  • M\u00fckemmel y\u00fczey p\u00fcr\u00fczl\u00fcl\u00fc\u011f\u00fc kontrol\u00fc<\/li>\n
                  • Y\u00fcksek UPH (standart prosesler i\u00e7in 30 gofret\/saate kadar)<\/li>\n
                  • K\u0131r\u0131lgan ve sert malzemeler i\u00e7in g\u00fc\u00e7l\u00fc uyarlanabilirlik<\/li>\n
                  • Tam otomatik s\u00fcre\u00e7 entegrasyon kabiliyeti<\/li>\n<\/ul>\n
                    \n

                    Performans \u00d6zetleri<\/span><\/h2>\n
                      \n
                    • Minimum \u00e7\u00f6z\u00fcn\u00fcrl\u00fck: 0,1 \u03bcm\/s Z ekseni kontrol\u00fc<\/li>\n
                    • Kal\u0131nl\u0131k homojenli\u011fi: \u22641-2 \u03bcm TTV<\/li>\n
                    • Ultra d\u00fc\u015f\u00fck titre\u015fimli y\u00fcksek h\u0131zl\u0131 i\u015f mili<\/li>\n
                    • Ger\u00e7ek zamanl\u0131 s\u00fcre\u00e7 izleme ve g\u00fcnl\u00fck kayd\u0131<\/li>\n
                    • Hem Ar-Ge hem de seri \u00fcretim ortamlar\u0131yla uyumlu<\/li>\n<\/ul>\n
                      \n

                      \u00d6zelle\u015ftirme Se\u00e7enekleri<\/span><\/h2>\n

                      Farkl\u0131 end\u00fcstriyel ihtiya\u00e7lar i\u00e7in esnek \u00f6zelle\u015ftirme sa\u011fl\u0131yoruz:<\/p>\n

                        \n
                      • \u00d6zel gofret aynalar\u0131 (d\u00fczensiz \u015fekiller)<\/li>\n
                      • Geni\u015fletilmi\u015f kal\u0131nl\u0131k \u00f6l\u00e7\u00fcm aral\u0131\u011f\u0131 (40 mm'ye kadar)<\/li>\n
                      • S\u00fcre\u00e7 tarifi \u00f6zelle\u015ftirme<\/li>\n
                      • Yukar\u0131 ak\u0131\u015f\/a\u015fa\u011f\u0131 ak\u0131\u015f ekipman\u0131 ile otomasyon entegrasyonu<\/li>\n<\/ul>\n
                        \n

                        SSS<\/span><\/h2>\n

                        S1: Bu sistem SiC gofretleri i\u015fleyebilir mi?<\/span><\/h3>\n

                        Evet, \u00f6zellikle SiC gofret inceltme ve arka y\u00fcz ta\u015flama i\u00e7in optimize edilmi\u015ftir, g\u00fc\u00e7 cihaz\u0131 uygulamalar\u0131 i\u00e7in uygundur.<\/p>\n

                        S2: Ula\u015f\u0131labilir kal\u0131nl\u0131k hassasiyeti nedir?<\/span><\/h3>\n

                        Standart modeller \u00b11 \u03bcm'ye ula\u015f\u0131r ve \u00fcst d\u00fczey konfig\u00fcrasyonlar TTV \u22641 \u03bcm ile \u00b10,5 \u03bcm'ye ula\u015fabilir.<\/p>\n

                        S3: Tam otomasyonu destekliyor mu?<\/span><\/h3>\n

                        Evet, \u00fcretim gereksinimlerine ba\u011fl\u0131 olarak hem tam otomatik hem de yar\u0131 otomatik modlar mevcuttur.<\/p>","protected":false},"excerpt":{"rendered":"

                        Wafer \u0130nceltme Sistemi Hassas Geri Ta\u015flama Ekipman\u0131, geli\u015fmi\u015f yar\u0131 iletken \u00fcretimi i\u00e7in tasarlanm\u0131\u015f y\u00fcksek hassasiyetli bir wafer i\u015fleme \u00e7\u00f6z\u00fcm\u00fcd\u00fcr. Silikon (Si), silikon karb\u00fcr (SiC), galyum arsenit (GaAs), safir ve di\u011fer k\u0131r\u0131lgan bile\u015fik yar\u0131 iletken malzemeler dahil olmak \u00fczere 4 in\u00e7 ila 12 in\u00e7 gofretleri destekler Bu sistem, m\u00fckemmel y\u00fczey b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc korurken kal\u0131nl\u0131\u011f\u0131n mikron ve mikron alt\u0131 seviyelere indirilmesini sa\u011flayan ultra hassas gofret arka taraf\u0131 inceltme i\u00e7in tasarlanm\u0131\u015ft\u0131r.<\/p>","protected":false},"featured_media":2330,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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