{"id":2143,"date":"2026-04-09T07:00:47","date_gmt":"2026-04-09T07:00:47","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2143"},"modified":"2026-04-09T07:03:21","modified_gmt":"2026-04-09T07:03:21","slug":"high-precision-12-inch-wafer-dicing-solution-for-advanced-semiconductor-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/tr\/product\/high-precision-12-inch-wafer-dicing-solution-for-advanced-semiconductor-processing\/","title":{"rendered":"Geli\u015fmi\u015f Yar\u0131 \u0130letken \u0130\u015fleme i\u00e7in Y\u00fcksek Hassasiyetli 12 in\u00e7 Wafer Kesme \u00c7\u00f6z\u00fcm\u00fc"},"content":{"rendered":"

\"\"HP-1221 Tam Otomatik Gofret Kesme Makinesi, yar\u0131 iletken gofret tekille\u015ftirme i\u015flemleri i\u00e7in tasarlanm\u0131\u015f y\u00fcksek verimli, hassas m\u00fchendislik \u00fcr\u00fcn\u00fc bir \u00e7\u00f6z\u00fcmd\u00fcr. En fazla 12 in\u00e7 (300 mm) gofretleri destekleyen bu sistem, \u00fcst\u00fcn kesim hassasiyeti, verim ve tutarl\u0131l\u0131k sa\u011flamak i\u00e7in geli\u015fmi\u015f otomasyon, \u00e7ift milli kesme teknolojisi ve ak\u0131ll\u0131 hizalama sistemlerini entegre eder.<\/p>\n

Modern yar\u0131 iletken \u00fcretim ortamlar\u0131 i\u00e7in tasarlanan HP-1221, gofret y\u00fckleme ve hizalamadan hassas k\u00fcplere ay\u0131rmaya ve ard\u0131ndan entegre temizleme ve kurutmaya kadar tam otomatik bir i\u015f ak\u0131\u015f\u0131 sa\u011flar. Bu, manuel m\u00fcdahaleyi \u00f6nemli \u00f6l\u00e7\u00fcde azalt\u0131r, verimi art\u0131r\u0131r ve tekrarlanabilir s\u00fcre\u00e7 kararl\u0131l\u0131\u011f\u0131 sa\u011flar.<\/p>\n

Kompakt ayak izi ve sa\u011flam yap\u0131sal tasar\u0131m\u0131 ile HP-1221, hem y\u00fcksek hacimli \u00fcretim hatlar\u0131 hem de y\u00fcksek hassasiyet ve g\u00fcvenilirlik gerektiren \u00f6zel uygulamalar i\u00e7in uygundur.<\/p>\n

Temel \u00d6zellikler<\/span><\/h2>\n

1. Y\u00fcksek Verimlilik i\u00e7in \u00c7ift Milli Kar\u015f\u0131l\u0131kl\u0131 Yap\u0131<\/span><\/h3>\n

Makine, geli\u015fmi\u015f bir kar\u015f\u0131t \u00e7ift i\u015f mili yap\u0131land\u0131rmas\u0131na sahiptir. Sistem, iki i\u015f mili aras\u0131ndaki mesafeyi azaltarak bo\u015fta \u00e7al\u0131\u015fma hareketini en aza indirir ve kesme verimlili\u011fini \u00f6nemli \u00f6l\u00e7\u00fcde art\u0131r\u0131r. Bu tasar\u0131m s\u00fcrekli \u00e7al\u0131\u015fmay\u0131 m\u00fcmk\u00fcn k\u0131lar ve d\u00f6ng\u00fc s\u00fcresini k\u0131saltarak y\u00fcksek verimli \u00fcretim ortamlar\u0131 i\u00e7in ideal hale getirir.<\/p>\n

2. Tam Otomatik Entegre S\u00fcre\u00e7<\/span><\/h3>\n

HP-1221, a\u015fa\u011f\u0131dakiler de dahil olmak \u00fczere eksiksiz bir otomatikle\u015ftirilmi\u015f s\u00fcreci destekler:<\/p>\n

    \n
  • Otomatik gofret y\u00fckleme ve bo\u015faltma<\/li>\n
  • Y\u00fcksek hassasiyetli hizalama<\/li>\n
  • Kontroll\u00fc k\u00fcp kesme i\u015flemi<\/li>\n
  • Entegre temizleme ve kurutma<\/li>\n<\/ul>\n

    Bu otomasyon seviyesi yaln\u0131zca \u00fcretkenli\u011fi art\u0131rmakla kalmaz, ayn\u0131 zamanda operat\u00f6re ba\u011f\u0131ml\u0131l\u0131\u011f\u0131 ve insan kaynakl\u0131 hatalar\u0131 da azalt\u0131r.<\/p>\n

    3. Y\u00fcksek Hassasiyetli Hizalama ve Denetleme Sistemi<\/span><\/h3>\n

    \u00c7ift mikroskop konfig\u00fcrasyonu (y\u00fcksek ve d\u00fc\u015f\u00fck b\u00fcy\u00fctme) ile donat\u0131lm\u0131\u015f olan sistem \u015funlar\u0131 sa\u011flar:<\/p>\n

      \n
    • H\u0131zl\u0131 ve do\u011fru wafer hizalama<\/li>\n
    • Ger\u00e7ek zamanl\u0131 kesim yolu do\u011frulamas\u0131<\/li>\n
    • Y\u00fcksek \u00e7\u00f6z\u00fcn\u00fcrl\u00fckl\u00fc kerf denetimi<\/li>\n<\/ul>\n

      Bu \u00f6zellik, \u00f6zellikle geli\u015fmi\u015f yar\u0131 iletken cihazlarda s\u0131k\u0131 toleranslar\u0131 korumak ve tutarl\u0131 kesim kalitesi sa\u011flamak i\u00e7in kritik \u00f6neme sahiptir.<\/p>\n

      4. Sub-C\/T Destekli B\u0131\u00e7ak Pansuman Fonksiyonu<\/span><\/h3>\n

      Entegre Sub-C\/T b\u0131\u00e7ak pansuman fonksiyonu, \u00e7al\u0131\u015fma s\u0131ras\u0131nda optimum b\u0131\u00e7ak keskinli\u011finin korunmas\u0131na yard\u0131mc\u0131 olur. Bu sayede<\/p>\n

        \n
      • Geli\u015ftirilmi\u015f kesme y\u00fczeyi kalitesi<\/li>\n
      • Azalt\u0131lm\u0131\u015f ufalanma ve mikro \u00e7atlaklar<\/li>\n
      • Uzat\u0131lm\u0131\u015f b\u0131\u00e7ak \u00f6mr\u00fc<\/li>\n<\/ul>\n

        Sonu\u00e7ta bu, daha d\u00fc\u015f\u00fck operasyonel maliyetlere ve daha y\u00fcksek \u00fcr\u00fcn verimine katk\u0131da bulunur.<\/p>\n

        5. Opsiyonel \u0130ki Ak\u0131\u015fkanl\u0131 Temizleme Nozulu<\/span><\/h3>\n

        Kesme sonras\u0131 temizlik performans\u0131n\u0131 art\u0131rmak i\u00e7in kesme alan\u0131na iste\u011fe ba\u011fl\u0131 bir hava-su \u00e7ift ak\u0131\u015fkanl\u0131 nozul tak\u0131labilir. Bu, d\u00f6k\u00fcnt\u00fc ve partik\u00fcllerin etkili bir \u015fekilde uzakla\u015ft\u0131r\u0131lmas\u0131n\u0131 sa\u011flayarak gofret temizli\u011fini iyile\u015ftirir ve sonraki i\u015flemlerde kontaminasyon risklerini azalt\u0131r.<\/p>\n

        Teknik \u00d6zellikler<\/span><\/h2>\n
        \n
        \n\n\n\n\n\n\n\n\n\n
        Parametre<\/th>\n\u015eartname<\/th>\n<\/tr>\n<\/thead>\n
        \u0130\u015f Mili G\u00fcc\u00fc \/ H\u0131z\u0131<\/td>\n1,8 kW \/ 2,2 kW (Opsiyonel), 6000-60000 rpm<\/td>\n<\/tr>\n
        Flan\u015f \u00d6l\u00e7\u00fcs\u00fc<\/td>\n2 in\u00e7<\/td>\n<\/tr>\n
        Maksimum \u0130\u015f Par\u00e7as\u0131 Boyutu<\/td>\nYuvarlak: \u00d8300 mm \/ Kare: 254 mm \u00d7 254 mm<\/td>\n<\/tr>\n
        Mikroskop Konfig\u00fcrasyonu<\/td>\nY\u00fcksek b\u00fcy\u00fctme: 7,5\u00d7 \/ D\u00fc\u015f\u00fck b\u00fcy\u00fctme: 0,75\u00d7 (Opsiyonel)<\/td>\n<\/tr>\n
        Makine Boyutlar\u0131 (G \u00d7 D \u00d7 Y)<\/td>\n1285 mm \u00d7 1590 mm \u00d7 1860 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

        Uygulamalar<\/span><\/h2>\n

        HP-1221, a\u015fa\u011f\u0131dakiler dahil olmak \u00fczere \u00e7e\u015fitli yar\u0131 iletken ve geli\u015fmi\u015f malzeme uygulamalar\u0131n\u0131n zorlu gereksinimlerini kar\u015f\u0131lamak \u00fczere tasarlanm\u0131\u015ft\u0131r:<\/p>\n

          \n
        • Entegre devreler (IC'ler) i\u00e7in silikon yonga plakas\u0131 kesme<\/li>\n
        • G\u00fc\u00e7 cihaz\u0131 yonga plakas\u0131 i\u015fleme (\u00f6rn. SiC, GaN)<\/li>\n
        • MEMS cihaz \u00fcretimi<\/li>\n
        • LED ve optoelektronik wafer kesimi<\/li>\n
        • Geli\u015fmi\u015f paketleme ve wafer seviyesinde paketleme s\u00fcre\u00e7leri<\/li>\n<\/ul>\n

          Wafer'larla 12 in\u00e7'e kadar uyumlulu\u011fu, onu hem olgun hem de geli\u015fmi\u015f \u00fcretim d\u00fc\u011f\u00fcmleri i\u00e7in uygun hale getirir.<\/p>\n

          \"\"<\/p>\n

          Performans Avantajlar\u0131<\/span><\/h2>\n

          Geli\u015ftirilmi\u015f Verim ve G\u00fcvenilirlik<\/span><\/h3>\n

          Hassas hizalama ve istikrarl\u0131 i\u015f mili performans\u0131, minimum kenar tala\u015flanmas\u0131 ve y\u00fcksek kaliteli kesim y\u00fczeyleri sa\u011flayarak cihaz veriminin artmas\u0131na do\u011frudan katk\u0131da bulunur.<\/p>\n

          Y\u00fcksek Verim<\/span><\/h3>\n

          \u00c7ift i\u015f mili tasar\u0131m\u0131 ve azalt\u0131lm\u0131\u015f d\u00f6ng\u00fc s\u00fcresi, do\u011fruluktan \u00f6d\u00fcn vermeden daha h\u0131zl\u0131 i\u015fleme olana\u011f\u0131 sa\u011flayarak sistemi b\u00fcy\u00fck \u00f6l\u00e7ekli \u00fcretim i\u00e7in ideal hale getiriyor.<\/p>\n

          S\u00fcre\u00e7 Kararl\u0131l\u0131\u011f\u0131<\/span><\/h3>\n

          Entegre otomasyon ve ak\u0131ll\u0131 kontrol sistemleri, uzun \u00fcretim d\u00f6ng\u00fcleri boyunca tutarl\u0131 performans sa\u011flayarak de\u011fi\u015fkenli\u011fi azalt\u0131r ve tekrarlanabilirli\u011fi art\u0131r\u0131r.<\/p>\n

          Maliyet Verimlili\u011fi<\/span><\/h3>\n

          B\u0131\u00e7ak sarg\u0131s\u0131 ve etkin temizlik gibi \u00f6zellikler sarf malzemesi kullan\u0131m\u0131n\u0131 ve bak\u0131m s\u0131kl\u0131\u011f\u0131n\u0131 azaltarak genel i\u015fletme maliyetlerini d\u00fc\u015f\u00fcr\u00fcr.<\/p>\n

          Neden HP-1221'i Se\u00e7melisiniz<\/span><\/h2>\n

          HP-1221, yonga plakas\u0131 kesmek isteyen \u00fcreticiler i\u00e7in g\u00fcvenilir ve \u00f6l\u00e7eklenebilir bir \u00e7\u00f6z\u00fcm olarak \u00f6ne \u00e7\u0131k\u0131yor:<\/p>\n

            \n
          • Gofret tekille\u015ftirmede y\u00fcksek hassasiyet<\/li>\n
          • Otomatikle\u015ftirilmi\u015f, operat\u00f6rden ba\u011f\u0131ms\u0131z s\u00fcre\u00e7ler<\/li>\n
          • Geli\u015fmi\u015f malzemelerle uyumluluk<\/li>\n
          • Uzun vadeli maliyet verimlili\u011fi ve istikrarl\u0131 performans<\/li>\n<\/ul>\n

            Geli\u015fmi\u015f m\u00fchendislik, otomasyon ve kullan\u0131c\u0131 odakl\u0131 tasar\u0131m\u0131n birle\u015fimi, onu herhangi bir yar\u0131 iletken \u00fcretim hatt\u0131na de\u011ferli bir katk\u0131 haline getirir.<\/p>\n

            SSS<\/strong><\/span><\/h2>\n

            1. HP-1221 ne t\u00fcr gofretleri i\u015fleyebilir?<\/strong><\/span><\/h3>\n

            HP-1221, yar\u0131 iletken ve geli\u015fmi\u015f elektronik \u00fcretiminde kullan\u0131lan \u00e7ok \u00e7e\u015fitli yonga plakas\u0131 malzemelerini i\u015flemek i\u00e7in tasarlanm\u0131\u015ft\u0131r. Bunlar aras\u0131nda silikon (Si), silikon karb\u00fcr (SiC), galyum nitr\u00fcr (GaN) ve di\u011fer bile\u015fik yar\u0131 iletken malzemeler bulunur.<\/p>\n

            Y\u00fcksek i\u015f mili h\u0131z\u0131 (60.000 rpm'ye kadar) ve istikrarl\u0131 kesme performans\u0131 ile sistem, m\u00fckemmel kenar kalitesini ve minimum tala\u015flanmay\u0131 korurken hem standart hem de sert, k\u0131r\u0131lgan malzemeleri i\u015fleyebilmektedir.<\/p>\n

            2. \u00c7ift i\u015f mili sistemi \u00fcretim verimlili\u011fini nas\u0131l art\u0131r\u0131r?<\/strong><\/span><\/h3>\n

            Kar\u015f\u0131l\u0131kl\u0131 \u00e7ift i\u015f mili yap\u0131s\u0131, \u00e7al\u0131\u015fma s\u0131ras\u0131nda \u00fcretken olmayan hareketi \u00f6nemli \u00f6l\u00e7\u00fcde azalt\u0131r. Kesme eksenleri aras\u0131ndaki mesafeyi en aza indirerek, sistem daha h\u0131zl\u0131 ge\u00e7i\u015fler ve s\u00fcrekli kesme i\u015flemleri ger\u00e7ekle\u015ftirebilir.<\/p>\n

            Bu da \u015fu sonucu do\u011furur:<\/p>\n

              \n
            • Daha k\u0131sa d\u00f6ng\u00fc s\u00fcreleri<\/li>\n
            • Daha y\u00fcksek verim<\/li>\n
            • Geli\u015ftirilmi\u015f ekipman kullan\u0131m\u0131<\/li>\n<\/ul>\n

              Tek milli sistemlerle kar\u015f\u0131la\u015ft\u0131r\u0131ld\u0131\u011f\u0131nda HP-1221, y\u00fcksek hacimli yonga plakas\u0131 k\u00fcpleme uygulamalar\u0131 i\u00e7in daha verimli bir \u00e7\u00f6z\u00fcm sunar.<\/p>\n

              3. Makine kesim hassasiyetini ve kalitesini nas\u0131l sa\u011fl\u0131yor?<\/strong><\/span><\/h3>\n

              HP-1221, hassasiyeti ve tutarl\u0131l\u0131\u011f\u0131 garanti etmek i\u00e7in a\u015fa\u011f\u0131dakiler de dahil olmak \u00fczere bir\u00e7ok \u00f6zelli\u011fi bir araya getirir:<\/p>\n

                \n
              • Do\u011fru hizalama ve ger\u00e7ek zamanl\u0131 denetim i\u00e7in \u00e7ift mikroskop sistemi<\/li>\n
              • Stabil kesim i\u00e7in y\u00fcksek h\u0131zl\u0131, d\u00fc\u015f\u00fck titre\u015fimli i\u015f mili<\/li>\n
              • B\u0131\u00e7ak keskinli\u011fini korumak i\u00e7in Sub-C\/T b\u0131\u00e7ak sarma fonksiyonu<\/li>\n
              • Kal\u0131nt\u0131lar\u0131 gidermek ve kirlenmeyi \u00f6nlemek i\u00e7in iste\u011fe ba\u011fl\u0131 \u00e7ift ak\u0131\u015fkanl\u0131 temizleme sistemi<\/li>\n<\/ul>\n

                Bu birle\u015fik teknolojiler, yar\u0131 iletken \u00fcretiminde verimi korumak i\u00e7in gerekli olan s\u0131k\u0131 toleranslar\u0131n, temiz \u00e7entik hatlar\u0131n\u0131n ve y\u00fcksek tekrarlanabilirli\u011fin sa\u011flanmas\u0131na yard\u0131mc\u0131 olur.<\/p>","protected":false},"excerpt":{"rendered":"

                HP-1221 Tam Otomatik Gofret Kesme Makinesi, yar\u0131 iletken gofret tekille\u015ftirme i\u015flemleri i\u00e7in tasarlanm\u0131\u015f y\u00fcksek verimli, hassas m\u00fchendislik \u00fcr\u00fcn\u00fc bir \u00e7\u00f6z\u00fcmd\u00fcr. En fazla 12 in\u00e7 (300 mm) gofretleri destekleyen bu sistem, \u00fcst\u00fcn kesim hassasiyeti, verim ve tutarl\u0131l\u0131k sa\u011flamak i\u00e7in geli\u015fmi\u015f otomasyon, \u00e7ift milli kesme teknolojisi ve ak\u0131ll\u0131 hizalama sistemlerini entegre eder.<\/p>","protected":false},"featured_media":2144,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[878],"product_tag":[541,888,882,880,440,883,887,885,447,881,739,683,884,879,886],"class_list":{"0":"post-2143","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-dicing-equipment","7":"product_tag-12-inch-wafer-cutting","8":"product_tag-blade-dicing-machine","9":"product_tag-dual-spindle-dicing-saw","10":"product_tag-fully-automatic-dicing-machine","11":"product_tag-gan-wafer-cutting","12":"product_tag-high-precision-wafer-dicing","13":"product_tag-ic-wafer-singulation","14":"product_tag-led-wafer-cutting","15":"product_tag-mems-wafer-dicing","16":"product_tag-semiconductor-dicing-equipment","17":"product_tag-semiconductor-manufacturing-equipment","18":"product_tag-sic-wafer-dicing","19":"product_tag-silicon-wafer-cutting","20":"product_tag-wafer-dicing-machine","21":"product_tag-wafer-level-packaging-dicing","22":"desktop-align-left","23":"tablet-align-left","24":"mobile-align-left","25":"ast-product-gallery-layout-horizontal-slider","26":"ast-product-tabs-layout-horizontal","28":"first","29":"instock","30":"shipping-taxable","31":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product\/2143","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/comments?post=2143"}],"version-history":[{"count":2,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product\/2143\/revisions"}],"predecessor-version":[{"id":2148,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product\/2143\/revisions\/2148"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/media\/2144"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/media?parent=2143"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product_brand?post=2143"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product_cat?post=2143"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/product_tag?post=2143"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}