{"id":2125,"date":"2026-04-08T05:30:39","date_gmt":"2026-04-08T05:30:39","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2125"},"modified":"2026-04-08T05:30:42","modified_gmt":"2026-04-08T05:30:42","slug":"wgp-1271-fully-automatic-wafer-thinning-polishing-integrated-machine","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/tr\/product\/wgp-1271-fully-automatic-wafer-thinning-polishing-integrated-machine\/","title":{"rendered":"WGP-1271 Tam Otomatik Gofret \u0130nceltme ve Parlatma Entegre Makinesi"},"content":{"rendered":"

\"\"WGP-1271 Tam Otomatik Gofret \u0130nceltme ve Parlatma Entegre Makinesi, geli\u015fmi\u015f yar\u0131 iletken paketlemede ultra ince gofret i\u015fleme i\u00e7in tasarlanm\u0131\u015f yeni nesil bir \u00e7\u00f6z\u00fcmd\u00fcr. Ta\u015flama, parlatma, temizleme ve bant i\u015flemeyi tek bir otomatik platforma entegre eden sistem, i\u015flem s\u00fcresini \u00f6nemli \u00f6l\u00e7\u00fcde azalt\u0131rken tutarl\u0131l\u0131\u011f\u0131 ve verimi art\u0131r\u0131r.<\/p>\n

300 mm'ye (12 in\u00e7) kadar gofretler i\u00e7in tasarlanan WGP-1271, gofretlerin 50 \u03bcm'nin alt\u0131na kadar istikrarl\u0131 bir \u015fekilde inceltilmesini sa\u011flayarak 3D IC, gofret d\u00fczeyinde paketleme (WLP) ve g\u00fc\u00e7 cihaz\u0131 entegrasyonu gibi geli\u015fmi\u015f paketleme teknolojilerinin kat\u0131 gereksinimlerini kar\u015f\u0131lar.<\/p>\n

Geleneksel \u00e7ok ad\u0131ml\u0131 sistemlerin aksine, bu makine geri ta\u015flama ve gerilim giderici parlatmay\u0131 birle\u015fik bir i\u015flemde birle\u015ftirerek yonga plakas\u0131 kullan\u0131m\u0131n\u0131 en aza indirir ve hasar riskini azalt\u0131r. Sonu\u00e7 olarak daha iyi yonga plakas\u0131 b\u00fct\u00fcnl\u00fc\u011f\u00fc, daha y\u00fcksek verim ve daha d\u00fc\u015f\u00fck toplam sahip olma maliyeti (TCO) elde edilir.<\/p>\n

\n

Temel \u00d6zellikler<\/strong><\/span><\/h2>\n

1. Entegre \u0130nceltme ve Parlatma S\u00fcreci<\/strong><\/span><\/h3>\n

WGP-1271 kaba ta\u015flama, ince ta\u015flama ve parlatmay\u0131 tek bir i\u015f ak\u0131\u015f\u0131nda birle\u015ftirir. Bu entegre tasar\u0131m, ara aktar\u0131m ad\u0131mlar\u0131n\u0131 ortadan kald\u0131rarak i\u015flem d\u0131\u015f\u0131 s\u00fcreyi \u00f6nemli \u00f6l\u00e7\u00fcde azalt\u0131r ve genel \u00fcretim verimlili\u011fini art\u0131r\u0131r.<\/p>\n

2. Ultra \u0130nce Gofret Kapasitesi (<50 \u03bcm)<\/strong><\/span><\/h3>\n

Sistem \u00f6zellikle ultra ince wafer uygulamalar\u0131 i\u00e7in tasarlanm\u0131\u015ft\u0131r. Tipik olarak k\u0131r\u0131lgan ve \u00e7arp\u0131lma veya \u00e7atlamaya e\u011filimli olan 50 mikronun alt\u0131ndaki gofretlerin istikrarl\u0131 bir \u015fekilde i\u015flenmesini ve g\u00fcvenli bir \u015fekilde kullan\u0131lmas\u0131n\u0131 sa\u011flar.<\/p>\n

3. \u00dc\u00e7 \u0130\u011fli D\u00f6rt \u0130stasyonlu Mimari<\/strong><\/span><\/h3>\n

ile \u00fc\u00e7 i\u015f mili, d\u00f6rt mandren konfig\u00fcrasyonu<\/strong>, WGP-1271 paralel i\u015fleme ve y\u00fcksek verim sa\u011flar. Her bir i\u015f mili, s\u00fcrecin farkl\u0131 a\u015famalar\u0131 i\u00e7in optimize edilmi\u015ftir:<\/p>\n

    \n
  • Mil 1: Kaba ta\u015flama<\/li>\n
  • \u0130\u015f mili 2: \u0130nce ta\u015flama<\/li>\n
  • Mil 3: Parlatma \/ ultra hassas inceltme (iste\u011fe ba\u011fl\u0131 kuru parlatma)<\/li>\n<\/ul>\n

    Bu mod\u00fcler yakla\u015f\u0131m hem esneklik hem de hassasiyet sa\u011flar.<\/p>\n

    4. Geli\u015fmi\u015f Hat \u0130\u00e7i Kal\u0131nl\u0131k \u00d6l\u00e7\u00fcm\u00fc (NCG + Otomatik TTV)<\/strong><\/span><\/h3>\n

    Sistem entegrasyonu Swing NCG (Temass\u0131z G\u00f6sterge)<\/strong> Otomatik TTV kontrol\u00fc ile ger\u00e7ek zamanl\u0131, temass\u0131z yonga plakas\u0131 kal\u0131nl\u0131\u011f\u0131 \u00f6l\u00e7\u00fcm\u00fc sa\u011flar. Bu, proses boyunca kal\u0131nl\u0131k homojenli\u011finin s\u00fcrekli izlenmesini ve otomatik olarak ayarlanmas\u0131n\u0131 sa\u011flar.<\/p>\n

    5. Tam Otomatik U\u00e7tan Uca \u0130\u015fleme<\/strong><\/span><\/h3>\n

    WGP-1271, a\u015fa\u011f\u0131dakiler de dahil olmak \u00fczere eksiksiz bir otomatik i\u015f ak\u0131\u015f\u0131n\u0131 destekler:<\/p>\n

      \n
    • Ta\u015flama<\/li>\n
    • Parlatma<\/li>\n
    • Wafer transferi<\/li>\n
    • Temizlik<\/li>\n
    • Bant takma ve \u00e7\u0131karma<\/li>\n<\/ul>\n

      Bu, manuel m\u00fcdahaleyi azalt\u0131r, tekrarlanabilirli\u011fi art\u0131r\u0131r ve modern ak\u0131ll\u0131 \u00fcretim ortamlar\u0131yla uyumluluk sa\u011flar.<\/p>\n

      6. Opsiyonel Kuru Parlatma ve Ultra Hassas Ta\u015flama<\/strong><\/span><\/h3>\n

      \u00dc\u00e7\u00fcnc\u00fc i\u015f mili (Z3 ekseni) X ekseni hareketini destekler ve a\u015fa\u011f\u0131dakiler i\u00e7in yap\u0131land\u0131r\u0131labilir kuru parlatma veya ultra hassas ta\u015flama<\/strong>, M\u00fc\u015fteri gereksinimlerine ba\u011fl\u0131 olarak \u00e7e\u015fitli proses uygulamalar\u0131na olanak sa\u011flar.<\/p>\n

      \"\"Uygulamalar<\/strong><\/span><\/h2>\n

      WGP-1271, a\u015fa\u011f\u0131dakiler de dahil olmak \u00fczere geli\u015fmi\u015f yar\u0131 iletken \u00fcretim s\u00fcre\u00e7leri i\u00e7in idealdir:<\/p>\n

        \n
      • Ultra ince gofret i\u015fleme (\u2264 12 in\u00e7)<\/li>\n
      • Geli\u015fmi\u015f paketleme (WLP, Fan-out, 3D IC)<\/li>\n
      • IGBT ve g\u00fc\u00e7 yar\u0131 iletken cihazlar\u0131<\/li>\n
      • Silikon (Si) gofret inceltme<\/li>\n
      • Silisyum karb\u00fcr (SiC) yonga plakas\u0131 i\u015fleme<\/li>\n
      • Y\u00fcksek yo\u011funluklu entegre devre \u00fcretimi<\/li>\n<\/ul>\n

        Ultra ince gofretleri i\u015fleyebilme \u00f6zelli\u011fi, onu kompakt boyut ve y\u00fcksek performans gerektiren yeni nesil elektronik cihazlar i\u00e7in \u00f6zellikle uygun hale getirmektedir.<\/p>\n

        Teknik \u00d6zellikler<\/strong><\/span><\/h2>\n
        \n
        \n\n\n\n\n\n\n\n\n\n\n\n
        Parametre<\/th>\n\u015eartname<\/th>\n<\/tr>\n<\/thead>\n
        Yap\u0131<\/td>\n3 \u0130\u015f Mili \/ 4 Ayna \/ 1 \u0130\u015f \u0130stasyonu \/ Otomatik Transfer ve Temizleme Sistemi \/ Bant Takma ve \u00c7\u0131karma Sistemi<\/td>\n<\/tr>\n
        Gofret Boyutu<\/td>\n8 in\u00e7 \/ 12 in\u00e7 (300 mm'ye kadar)<\/td>\n<\/tr>\n
        \u0130\u015f Mili G\u00fcc\u00fc<\/td>\n7,5 kW \/ 11 kW (Opsiyonel)<\/td>\n<\/tr>\n
        \u00d6zel \u00d6zellik<\/td>\nX ekseni hareketi ile Z3 Ekseni<\/td>\n<\/tr>\n
        \u0130\u015fleme Kapasitesi<\/td>\nTa\u015flama + Parlatma + Temizleme + Bant \u0130\u015fleme<\/td>\n<\/tr>\n
        Minimum Kal\u0131nl\u0131k<\/td>\n< 50 \u03bcm<\/td>\n<\/tr>\n
        Boyutlar (G\u00d7D\u00d7Y)<\/td>\n4050 \u00d7 3530 \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

        Performans Avantajlar\u0131<\/strong><\/span><\/h2>\n

        Daha Y\u00fcksek Verimlilik<\/strong><\/span><\/h3>\n

        Entegre tasar\u0131m, proses ad\u0131mlar\u0131n\u0131 ve i\u015fleme s\u00fcresini azaltarak geleneksel ayr\u0131 sistemlere k\u0131yasla \u00f6nemli \u00f6l\u00e7\u00fcde daha y\u00fcksek verim sa\u011flar.<\/p>\n

        Geli\u015ftirilmi\u015f Verim<\/strong><\/span><\/h3>\n

        Temass\u0131z \u00f6l\u00e7\u00fcm ve d\u00fc\u015f\u00fck gerilimli i\u015fleme, yonga plakas\u0131 hasar\u0131n\u0131 en aza indirerek daha y\u00fcksek verim ve daha iyi cihaz g\u00fcvenilirli\u011fi sa\u011flar.<\/p>\n

        \u00dcst\u00fcn Kal\u0131nl\u0131k Kontrol\u00fc<\/strong><\/span><\/h3>\n

        Ger\u00e7ek zamanl\u0131 TTV ayar\u0131, geli\u015fmi\u015f paketleme uygulamalar\u0131 i\u00e7in kritik olan m\u00fckemmel kal\u0131nl\u0131k homojenli\u011fini sa\u011flar.<\/p>\n

        Azalt\u0131lm\u0131\u015f Kirlenme Riski<\/strong><\/span><\/h3>\n

        Daha az transfer ad\u0131m\u0131 ve kontroll\u00fc bir proses ortam\u0131, yonga plakas\u0131 temizli\u011finin korunmas\u0131na ve kusur oranlar\u0131n\u0131n azalt\u0131lmas\u0131na yard\u0131mc\u0131 olur.<\/p>\n

        Geli\u015ftirilmi\u015f S\u00fcre\u00e7 Esnekli\u011fi<\/strong><\/span><\/h3>\n

        \u0130ste\u011fe ba\u011fl\u0131 kuru parlatma ve ultra hassas ta\u015flama, farkl\u0131 malzemeler ve uygulamalar i\u00e7in \u00f6zelle\u015ftirmeye olanak tan\u0131r.<\/p>\n

        \"\"M\u00fchendislik De\u011feri ve Sekt\u00f6rel \u00d6nem<\/strong><\/span><\/h2>\n

        Yar\u0131 iletken cihazlar daha y\u00fcksek performansa ve daha k\u00fc\u00e7\u00fck form fakt\u00f6rlerine do\u011fru geli\u015fmeye devam ettik\u00e7e, ultra ince gofretler kritik bir gereksinim haline gelmi\u015ftir. Ancak, gofretlerin 50 \u03bcm'nin alt\u0131na inceltilmesi ta\u015f\u0131ma, stres kontrol\u00fc ve kusur \u00f6nleme konular\u0131nda \u00f6nemli zorluklar\u0131 beraberinde getirmektedir.<\/p>\n

        WGP-1271, birden fazla proses ad\u0131m\u0131n\u0131 tek bir otomatik sistemde birle\u015ftiren entegre m\u00fchendislik tasar\u0131m\u0131yla bu zorluklar\u0131n \u00fcstesinden gelir. Bu sadece \u00fcretim verimlili\u011fini art\u0131rmakla kalmaz, ayn\u0131 zamanda proses g\u00fcvenilirli\u011fini de geli\u015ftirerek geli\u015fmi\u015f paketleme teknolojilerine ge\u00e7i\u015f yapan yar\u0131 iletken \u00fcreticileri i\u00e7in de\u011ferli bir varl\u0131k haline getirir.<\/p>\n

        SSS<\/strong><\/span><\/h2>\n

        1. Entegre inceltme ve parlatma sisteminin ana avantaj\u0131 nedir?<\/strong><\/span><\/h3>\n

        Gofret i\u015fleme ad\u0131mlar\u0131n\u0131 azalt\u0131r, i\u015flem s\u00fcresini k\u0131salt\u0131r ve gofret hasar\u0131 riskini en aza indirerek daha y\u00fcksek verimlilik ve verim sa\u011flar.<\/p>\n

        2. WGP-1271, 50 \u03bcm'nin alt\u0131ndaki ultra ince gofretleri i\u015fleyebilir mi?<\/strong><\/span><\/h3>\n

        Evet, sistem \u00f6zellikle 50 \u03bcm'den daha ince gofretleri y\u00fcksek stabilite ve hassasiyetle i\u015flemek i\u00e7in tasarlanm\u0131\u015ft\u0131r.<\/p>\n

        3. Ne t\u00fcr gofretler desteklenmektedir?<\/strong><\/span><\/h3>\n

        Makine silikon (Si), silikon karb\u00fcr (SiC) ve 300 mm'ye kadar di\u011fer yar\u0131 iletken gofretleri destekler.<\/p>\n

        4. Kal\u0131nl\u0131k homojenli\u011fi nas\u0131l kontrol edilir?<\/strong><\/span><\/h3>\n

        Ger\u00e7ek zamanl\u0131 kontrol i\u00e7in Otomatik TTV ayar\u0131 ile birle\u015ftirilmi\u015f entegre temass\u0131z \u00f6l\u00e7\u00fcm sistemi (NCG) sayesinde.<\/p>\n

        5. Makine tam otomatik \u00fcretimi destekliyor mu?<\/strong><\/span><\/h3>\n

        Evet, y\u00fcksek hacimli otomatik fabrikalar i\u00e7in uygun hale getiren otomatik transfer, temizleme ve bant i\u015fleme sistemleri i\u00e7erir.<\/p>","protected":false},"excerpt":{"rendered":"

        WGP-1271 Tam Otomatik Gofret \u0130nceltme ve Parlatma Entegre Makinesi, ultra ince gofret i\u015fleme i\u00e7in kapsaml\u0131 bir \u00e7\u00f6z\u00fcm sunar. Geli\u015fmi\u015f otomasyonu, hassas kontrol\u00fc ve entegre i\u015f ak\u0131\u015f\u0131 ile performans, verim ve verimlili\u011fin kritik oldu\u011fu \u00fcst d\u00fczey yar\u0131 iletken uygulamalar\u0131 i\u00e7in idealdir.<\/p>","protected":false},"featured_media":2126,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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