{"id":2030,"date":"2026-03-27T01:57:48","date_gmt":"2026-03-27T01:57:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2030"},"modified":"2026-03-27T02:00:00","modified_gmt":"2026-03-27T02:00:00","slug":"semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/tr\/product\/semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing\/","title":{"rendered":"2-12 \u0130n\u00e7 Gofret \u0130\u015fleme i\u00e7in Yar\u0131 Otomatik Oda S\u0131cakl\u0131\u011f\u0131nda Gofret Yap\u0131\u015ft\u0131rma Makinesi"},"content":{"rendered":"

\"\"Yar\u0131 Otomatik Oda S\u0131cakl\u0131\u011f\u0131nda Wafer Yap\u0131\u015ft\u0131rma Makinesi, wafer seviyesinde ve \u00e7ip seviyesinde yap\u0131\u015ft\u0131rma i\u00e7in y\u00fcksek hassasiyetli bir sistemdir. Mekanik bas\u0131nc\u0131 in situ y\u00fczey aktivasyon teknolojisi ile birle\u015ftirerek, yap\u0131\u015ft\u0131r\u0131c\u0131 veya y\u00fcksek s\u0131cakl\u0131kta i\u015fleme olmadan oda s\u0131cakl\u0131\u011f\u0131nda (20-30\u00b0C) kal\u0131c\u0131 yap\u0131\u015ft\u0131rma sa\u011flar. Bu da termal stresi ve malzeme deformasyonunu en aza indirerek \u0131s\u0131ya duyarl\u0131 ve heterojen malzemeler i\u00e7in ideal hale getiriyor. Makine 2 in\u00e7ten 12 in\u00e7e kadar wafer boyutlar\u0131n\u0131 destekler ve ara\u015ft\u0131rma, pilot \u00fcretim ve k\u00fc\u00e7\u00fck ila orta \u00f6l\u00e7ekli \u00fcretim i\u00e7in uygundur.<\/p>\n

\"\"Temel \u00d6zellikler<\/strong><\/h2>\n
    \n
  1. Oda S\u0131cakl\u0131\u011f\u0131nda Yap\u0131\u015ft\u0131rma<\/strong> - Termal uyumsuzlu\u011fu ve yonga plakas\u0131 \u00e7arp\u0131lmas\u0131n\u0131 \u00f6nlemek i\u00e7in 25 \u00b1 5\u00b0C'de \u00e7al\u0131\u015f\u0131r.<\/li>\n
  2. Y\u00fczey Aktivasyonu<\/strong> - Plazma veya kimyasal aktivasyon ba\u011flanma g\u00fcc\u00fcn\u00fc art\u0131r\u0131r; iste\u011fe ba\u011fl\u0131 p\u00fcsk\u00fcrtme aray\u00fcz kalitesini art\u0131r\u0131r.<\/li>\n
  3. Y\u00fcksek Hassasiyetli Hizalama<\/strong> - G\u00f6rsel hizalama sistemi ve \u00b10,5 \u03bcm hassasiyete sahip hassas hareket platformu.<\/li>\n
  4. Geni\u015f Malzeme Uyumlulu\u011fu<\/strong> - Si, SiC, GaAs, GaN, InP, safir, cam, LiNbO\u2083, LiTaO\u2083, elmas ve se\u00e7ilmi\u015f polimerleri destekler.<\/li>\n
  5. Yar\u0131 Otomatik \u00c7al\u0131\u015fma<\/strong> - Otomatik yap\u0131\u015ft\u0131rma i\u015flemi ile manuel wafer y\u00fckleme; tekrarlanabilir sonu\u00e7lar i\u00e7in programlanabilir tarifler.<\/li>\n
  6. Temiz ve \u0130stikrarl\u0131 \u00c7evre<\/strong> - Dahili S\u0131n\u0131f 100 temiz sistem, d\u00fc\u015f\u00fck kontaminasyon ve <0,1% aray\u00fcz bo\u015fluk oran\u0131 sa\u011flar.<\/li>\n<\/ol>\n

    Teknik \u00d6zellikler<\/strong><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Parametre<\/th>\n\u015eartname<\/th>\n<\/tr>\n<\/thead>\n
    Gofret Boyutu<\/td>\n2\u2033 - 12\u2033, d\u00fczensiz numunelerle uyumlu<\/td>\n<\/tr>\n
    Yap\u0131\u015ft\u0131rma S\u0131cakl\u0131\u011f\u0131<\/td>\n20-30\u00b0C<\/td>\n<\/tr>\n
    Maksimum Bas\u0131n\u00e7<\/td>\n80 kN<\/td>\n<\/tr>\n
    Bas\u0131n\u00e7 Kontrol\u00fc<\/td>\n0-5000 N ayarlanabilir, \u00b11 N \u00e7\u00f6z\u00fcn\u00fcrl\u00fck<\/td>\n<\/tr>\n
    Hizalama Do\u011frulu\u011fu<\/td>\n\u00b10,5 \u03bcm<\/td>\n<\/tr>\n
    Ba\u011f Dayan\u0131m\u0131<\/td>\n\u22652,0 J\/m\u00b2<\/td>\n<\/tr>\n
    Y\u00fczey \u0130\u015flemleri<\/td>\nIn situ aktivasyon + p\u00fcsk\u00fcrtme biriktirme<\/td>\n<\/tr>\n
    Besleme Modu<\/td>\nEl Kitab\u0131<\/td>\n<\/tr>\n
    Temizlik Seviyesi<\/td>\nS\u0131n\u0131f 100<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    \u00c7ekirdek Teknoloji<\/strong><\/h2>\n
      \n
    1. Oda S\u0131cakl\u0131\u011f\u0131nda Do\u011frudan Yap\u0131\u015ft\u0131rma<\/strong> - Aktif y\u00fczeyler kontroll\u00fc bas\u0131n\u00e7 alt\u0131nda temas ederek termal tavlama olmadan kararl\u0131 ba\u011flar olu\u015fturur.<\/li>\n
    2. Y\u00fczey Aktivasyonu<\/strong> - Y\u00fczey enerjisini art\u0131r\u0131r, kirleticileri giderir ve malzemeler aras\u0131nda yap\u0131\u015ft\u0131rma homojenli\u011fini geli\u015ftirir.<\/li>\n<\/ol>\n

      \"\"Uygulamalar<\/strong><\/h2>\n
        \n
      1. Geli\u015fmi\u015f Yar\u0131 \u0130letken Paketleme<\/strong> - 3D IC istifleme, TSV ba\u011flama, mant\u0131k ve bellek yongalar\u0131n\u0131n heterojen entegrasyonu.<\/li>\n
      2. MEMS \u00dcretimi<\/strong> - \u0130vme\u00f6l\u00e7er ve jiroskop gibi sens\u00f6rler i\u00e7in Wafer d\u00fczeyinde vakumlu paketleme.<\/li>\n
      3. Optoelektronik ve Ekranlar<\/strong> - LED yap\u0131\u015ft\u0131rma, safir ve cam substrat yap\u0131\u015ft\u0131rma, AR\/VR optik mod\u00fcl montaj\u0131.<\/li>\n
      4. Mikroak\u0131\u015fkanlar ve Biyo\u00e7ipler<\/strong> - Biyolojik aktiviteyi korurken PDMS ve cam yap\u0131\u015ft\u0131rma.<\/li>\n
      5. Ara\u015ft\u0131rma ve Geli\u015fmekte Olan Cihazlar<\/strong> - Esnek elektronikler, kuantum cihazlar\u0131 ve heterojen malzeme entegrasyonu.<\/li>\n<\/ol>\n

        Servis ve Destek<\/strong><\/h2>\n
          \n
        1. S\u00fcre\u00e7 Geli\u015ftirme<\/strong> - Farkl\u0131 malzemeler i\u00e7in ba\u011flanma parametresi optimizasyonu ve y\u00fczey aktivasyon \u00e7\u00f6z\u00fcmleri.<\/li>\n
        2. Ekipman \u00d6zelle\u015ftirme<\/strong> - Y\u00fcksek hassasiyetli hizalama mod\u00fclleri, vakum veya kontroll\u00fc atmosfer odalar\u0131.<\/li>\n
        3. Teknik E\u011fitim<\/strong> - Yerinde operasyon rehberli\u011fi ve s\u00fcre\u00e7 hata ay\u0131klama.<\/li>\n
        4. Sat\u0131\u015f Sonras\u0131 Destek<\/strong> - 12 ayl\u0131k garanti, temel bile\u015fenlerin h\u0131zl\u0131 de\u011fi\u015fimi, uzaktan tan\u0131lama ve yaz\u0131l\u0131m g\u00fcncellemeleri.<\/li>\n<\/ol>\n

          SSS<\/h2>\n

          S: Oda s\u0131cakl\u0131\u011f\u0131nda yap\u0131\u015ft\u0131rman\u0131n temel avantaj\u0131 nedir?
          C: Termal gerilimi ortadan kald\u0131r\u0131r ve \u0131s\u0131ya duyarl\u0131 ve heterojen malzemelerin g\u00fcvenilir bir \u015fekilde yap\u0131\u015ft\u0131r\u0131lmas\u0131n\u0131 sa\u011flar.<\/p>\n

          S: Hangi malzemeler yap\u0131\u015ft\u0131r\u0131labilir?
          A: Silikon, silikon karb\u00fcr, galyum nitr\u00fcr, galyum arsenit, indiyum fosfit, safir, cam, lityum niobat, elmas ve se\u00e7ilmi\u015f polimerler.<\/p>","protected":false},"excerpt":{"rendered":"

          Yar\u0131 Otomatik Oda S\u0131cakl\u0131\u011f\u0131nda Wafer Yap\u0131\u015ft\u0131rma Makinesi, wafer seviyesinde ve \u00e7ip seviyesinde yap\u0131\u015ft\u0131rma i\u00e7in y\u00fcksek hassasiyetli bir sistemdir. Mekanik bas\u0131nc\u0131 in situ y\u00fczey aktivasyon teknolojisi ile birle\u015ftirerek, yap\u0131\u015ft\u0131r\u0131c\u0131 veya y\u00fcksek s\u0131cakl\u0131kta i\u015fleme olmadan oda s\u0131cakl\u0131\u011f\u0131nda (20-30\u00b0C) kal\u0131c\u0131 yap\u0131\u015ft\u0131rma sa\u011flar.<\/p>","protected":false},"featured_media":2031,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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