{"id":2021,"date":"2026-03-27T01:46:43","date_gmt":"2026-03-27T01:46:43","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2021"},"modified":"2026-03-27T01:46:45","modified_gmt":"2026-03-27T01:46:45","slug":"high-precision-wafer-bonding-equipment-for-si-si-sic-sic-heterogeneous-integration","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/tr\/product\/high-precision-wafer-bonding-equipment-for-si-si-sic-sic-heterogeneous-integration\/","title":{"rendered":"Si-Si, SiC-SiC ve Heterojen Entegrasyon i\u00e7in Y\u00fcksek Hassasiyetli Wafer Yap\u0131\u015ft\u0131rma Ekipman\u0131"},"content":{"rendered":"

Wafer Bonding Ekipman\u0131, geli\u015fmi\u015f yar\u0131 iletken paketleme, MEMS \u00fcretimi ve \u00fc\u00e7\u00fcnc\u00fc nesil yar\u0131 iletken entegrasyonu i\u00e7in tasarlanm\u0131\u015f y\u00fcksek performansl\u0131 bir sistemdir. 2 in\u00e7 ila 12 in\u00e7lik gofretleri destekler ve oda s\u0131cakl\u0131\u011f\u0131nda do\u011frudan yap\u0131\u015ft\u0131rma ve hidrofilik yap\u0131\u015ft\u0131rma sa\u011flar, bu da onu \u00f6zellikle Si-Si, SiC-SiC ve heterojen malzeme yap\u0131\u015ft\u0131rma (Si-SiC, GaN, Safir vb.) i\u00e7in uygun hale getirir.<\/p>\n

\"\"<\/p>\n

Hem Ar-Ge ortamlar\u0131 hem de seri \u00fcretim i\u00e7in tasarlanan sistem, ultra hassas hizalama, kapal\u0131 d\u00f6ng\u00fc bas\u0131n\u00e7 ve s\u0131cakl\u0131k kontrol\u00fc ve ultra y\u00fcksek vakumlu yap\u0131\u015ft\u0131rma ko\u015fullar\u0131n\u0131 entegre ederek y\u00fcksek yap\u0131\u015ft\u0131rma mukavemeti, m\u00fckemmel aray\u00fcz homojenli\u011fi ve d\u00fc\u015f\u00fck kusur yo\u011funlu\u011fu sa\u011flar.<\/p>\n

Temel \u00d6zellikler<\/span><\/h1>\n

\"\"1. Geli\u015fmi\u015f Oda S\u0131cakl\u0131\u011f\u0131nda Yap\u0131\u015ft\u0131rma Teknolojisi<\/span><\/h3>\n
    \n
  • Termal gerilimi ve yonga plakas\u0131 \u00e7arp\u0131lmas\u0131n\u0131 ortadan kald\u0131r\u0131r<\/li>\n
  • S\u0131cakl\u0131\u011fa duyarl\u0131 ve birbirine benzemeyen malzemelerin yap\u0131\u015ft\u0131r\u0131lmas\u0131n\u0131 sa\u011flar<\/li>\n
  • Hidrofilik yap\u0131\u015ft\u0131rmay\u0131 ve plazma ile aktive edilmi\u015f yap\u0131\u015ft\u0131rmay\u0131 destekler<\/li>\n<\/ul>\n

    2. Ultra Y\u00fcksek Hassasiyetli Hizalama<\/span><\/h3>\n
      \n
    • \u0130\u015faret hizalama do\u011frulu\u011fu: \u2264 \u00b12 \u03bcm<\/li>\n
    • Kenar hizalama hassasiyeti: \u2264 \u00b150 \u03bcm<\/li>\n
    • Mikron alt\u0131 hizalama sistemine iste\u011fe ba\u011fl\u0131 y\u00fckseltme<\/li>\n<\/ul>\n

      3. Y\u00fcksek Yap\u0131\u015fma Dayan\u0131m\u0131 ve Aray\u00fcz Kalitesi<\/span><\/h3>\n
        \n
      • \u2265 2,0 J\/m\u00b2 (oda s\u0131cakl\u0131\u011f\u0131nda Si-Si do\u011frudan ba\u011flanma)<\/li>\n
      • Plazma y\u00fczey aktivasyonu ile \u22655 J\/m\u00b2'ye kadar<\/li>\n
      • UHV ko\u015fullar\u0131 alt\u0131nda m\u00fckemmel aray\u00fcz temizli\u011fi<\/li>\n<\/ul>\n

        4. Geni\u015f Malzeme Uyumlulu\u011fu<\/span><\/h3>\n

        Ba\u011flanmas\u0131n\u0131 destekler:<\/p>\n

          \n
        • Yar\u0131 iletkenler: Si, SiC, GaN, GaAs, InP<\/li>\n
        • Optik malzemeler: Safir, Cam<\/li>\n
        • Fonksiyonel malzemeler: LiNbO\u2083, Elmas<\/li>\n<\/ul>\n

          5. Esnek S\u00fcre\u00e7 Yetene\u011fi<\/span><\/h3>\n
            \n
          • Gofret boyutu: 2\u2033 - 12\u2033<\/li>\n
          • D\u00fczensiz \u015fekilli numunelerle uyumlu<\/li>\n
          • Opsiyonel mod\u00fcller: \u00f6n \u0131s\u0131tma \/ tavlama (RT-500\u00b0C)<\/li>\n<\/ul>\n

            Teknik \u00d6zellikler<\/span><\/h1>\n
            \n
            \n\n\n\n\n\n\n\n\n\n\n\n\n
            Parametre<\/th>\n\u015eartname<\/th>\n<\/tr>\n<\/thead>\n
            Yap\u0131\u015ft\u0131rma Y\u00f6ntemleri<\/td>\nDo\u011frudan Yap\u0131\u015ft\u0131rma \/ Plazma Aktive Yap\u0131\u015ft\u0131rma<\/td>\n<\/tr>\n
            Gofret Boyutu<\/td>\n2\u2033 - 12\u2033<\/td>\n<\/tr>\n
            Bas\u0131n\u00e7 Aral\u0131\u011f\u0131<\/td>\n0 - 10 MPa<\/td>\n<\/tr>\n
            Maksimum Kuvvet<\/td>\n100 kN<\/td>\n<\/tr>\n
            S\u0131cakl\u0131k Aral\u0131\u011f\u0131<\/td>\nOda S\u0131cakl\u0131\u011f\u0131 - 500\u00b0C (Opsiyonel)<\/td>\n<\/tr>\n
            Vakum Seviyesi<\/td>\n\u2264 5 \u00d7 10-\u2076 Torr<\/td>\n<\/tr>\n
            Hizalama Do\u011frulu\u011fu<\/td>\n\u2264 \u00b12 \u03bcm (\u0130\u015faret), \u2264 \u00b150 \u03bcm (Kenar)<\/td>\n<\/tr>\n
            Yap\u0131\u015fma Dayan\u0131m\u0131<\/td>\n\u2265 2,0 J\/m\u00b2 (RT Si-Si)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

            \"\"Ak\u0131ll\u0131 Kontrol Sistemi<\/span><\/h1>\n
              \n
            • End\u00fcstriyel s\u0131n\u0131f dokunmatik ekranl\u0131 HMI<\/li>\n
            • 50'den fazla i\u015flem tarifinin depolanmas\u0131n\u0131 destekler<\/li>\n
            • Ger\u00e7ek zamanl\u0131 bas\u0131n\u00e7-s\u0131cakl\u0131k kapal\u0131 d\u00f6ng\u00fc kontrol\u00fc<\/li>\n
            • \u0130stikrarl\u0131 ve tekrarlanabilir s\u00fcre\u00e7 performans\u0131<\/li>\n<\/ul>\n

              G\u00fcvenlik ve G\u00fcvenilirlik<\/span><\/h1>\n
                \n
              • \u00dc\u00e7l\u00fc kilitleme korumas\u0131 (bas\u0131n\u00e7 \/ s\u0131cakl\u0131k \/ vakum)<\/li>\n
              • Acil durdurma sistemi<\/li>\n
              • S\u0131n\u0131f 100 temiz oda uyumlulu\u011fu i\u00e7in tasarlanm\u0131\u015ft\u0131r<\/li>\n<\/ul>\n

                Opsiyonel Konfig\u00fcrasyonlar<\/span><\/h1>\n
                  \n
                • Robotik gofret ta\u015f\u0131ma sistemi<\/li>\n
                • SECS\/GEM ileti\u015fim aray\u00fcz\u00fc (fab entegrasyonuna haz\u0131r)<\/li>\n
                • Inline denetim mod\u00fcl\u00fc<\/li>\n
                • Plazma y\u00fczey aktivasyon \u00fcnitesi<\/li>\n<\/ul>\n

                  Tipik Uygulamalar<\/span><\/h1>\n

                  1. MEMS Paketleme<\/span><\/h3>\n

                  \u0130vme\u00f6l\u00e7er ve jiroskop gibi sens\u00f6rler i\u00e7in hermetik s\u0131zd\u0131rmazl\u0131k<\/p>\n

                  2. 3D IC Entegrasyonu<\/span><\/h3>\n

                  TSV ve geli\u015fmi\u015f paketleme i\u00e7in Wafer istifleme<\/p>\n

                  3. Bile\u015fik Yar\u0131 \u0130letken Cihazlar<\/span><\/h3>\n

                  GaN \/ SiC g\u00fc\u00e7 cihaz\u0131 ba\u011flama ve katman transferi<\/p>\n

                  4. CMOS G\u00f6r\u00fcnt\u00fc Sens\u00f6rleri (CIS)<\/span><\/h3>\n

                  CMOS gofretlerin ve optik alt tabakalar\u0131n d\u00fc\u015f\u00fck s\u0131cakl\u0131kta yap\u0131\u015ft\u0131r\u0131lmas\u0131<\/p>\n

                  5. Biyo\u00e7ipler ve Mikroak\u0131\u015fkanlar<\/span><\/h3>\n

                  \u00c7ip \u00fczerinde laboratuvar cihazlar\u0131 i\u00e7in g\u00fcvenilir ba\u011flama<\/p>\n

                  S\u00fcre\u00e7 \u00d6rne\u011fi<\/span><\/h1>\n

                  LiNbO\u2083 - SiC Wafer Yap\u0131\u015ft\u0131rma (Oda S\u0131cakl\u0131\u011f\u0131)<\/p>\n

                    \n
                  • G\u00fc\u00e7l\u00fc ve d\u00fczg\u00fcn yap\u0131\u015ft\u0131rma aray\u00fcz\u00fc sa\u011flar<\/li>\n
                  • Kesitsel TEM g\u00f6r\u00fcnt\u00fclemesi ile do\u011frulanm\u0131\u015ft\u0131r<\/li>\n
                  • Y\u00fcksek frekansl\u0131 ve optoelektronik uygulamalar i\u00e7in uygundur<\/li>\n<\/ul>\n

                    SORU-CEVAP<\/span><\/h1>\n

                    S1: Neden termal yap\u0131\u015ft\u0131rma yerine oda s\u0131cakl\u0131\u011f\u0131nda wafer yap\u0131\u015ft\u0131rmay\u0131 se\u00e7melisiniz?<\/span><\/h3>\n

                    Oda s\u0131cakl\u0131\u011f\u0131nda yap\u0131\u015ft\u0131rma, termal uyumsuzlu\u011fu ve gerilimi \u00f6nleyerek heterojen malzemeler i\u00e7in idealdir ve geli\u015fmi\u015f paketlemede verimi art\u0131r\u0131r.<\/p>\n

                    S2: Hangi malzemeler yap\u0131\u015ft\u0131r\u0131labilir?<\/span><\/h3>\n

                    Sistem, a\u015fa\u011f\u0131dakiler de dahil olmak \u00fczere geni\u015f bir malzeme yelpazesini desteklemektedir:<\/p>\n

                      \n
                    • Yar\u0131 iletkenler: Si, SiC, GaN<\/li>\n
                    • Oksitler: SiO\u2082, LiNbO\u2083<\/li>\n
                    • Metaller: Cu, Au<\/li>\n<\/ul>\n

                      Neden Bu Sistemi Se\u00e7melisiniz<\/span><\/h1>\n
                        \n
                      • SiC g\u00fc\u00e7 cihaz\u0131 \u00fcretiminde kan\u0131tlanm\u0131\u015f performans<\/li>\n
                      • Laboratuvar testleri ve TEM analizi ile do\u011frulanm\u0131\u015f yap\u0131\u015fma g\u00fcc\u00fc<\/li>\n
                      • Hem ara\u015ft\u0131rma enstit\u00fcleri hem de end\u00fcstriyel fabrikalar i\u00e7in tasarlanm\u0131\u015ft\u0131r<\/li>\n
                      • Mod\u00fcler mimari uzun vadeli \u00f6l\u00e7eklenebilirlik ve y\u00fckseltilebilirlik sa\u011flar<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

                        Wafer Bonding Ekipman\u0131, geli\u015fmi\u015f yar\u0131 iletken paketleme, MEMS \u00fcretimi ve \u00fc\u00e7\u00fcnc\u00fc nesil yar\u0131 iletken entegrasyonu i\u00e7in tasarlanm\u0131\u015f y\u00fcksek performansl\u0131 bir sistemdir.<\/p>","protected":false},"featured_media":2024,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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