{"id":2555,"date":"2026-06-16T01:21:44","date_gmt":"2026-06-16T01:21:44","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2555"},"modified":"2026-06-16T01:21:50","modified_gmt":"2026-06-16T01:21:50","slug":"what-are-wafer-ttv-bow-and-warp","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/tr\/what-are-wafer-ttv-bow-and-warp\/","title":{"rendered":"Wafer TTV, E\u011frilik ve \u00c7arp\u0131kl\u0131k Nedir? Wafer D\u00fczl\u00fc\u011f\u00fcne \u0130li\u015fkin Pratik Bir K\u0131lavuz"},"content":{"rendered":"<p>\u0130\u00e7inde <a href=\"https:\/\/www.zmsh-semitech.com\/tr\/products\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">yar\u0131 iletken \u00fcretimi<\/mark><\/a>, yonga kalitesi sadece malzeme safl\u0131\u011f\u0131ndan ibaret de\u011fildir. M\u00fckemmel \u015fekilde \u00fcretilmi\u015f bir silikon, safir, kuvars veya silikon karb\u00fcr yongas\u0131 bile, geometrisi do\u011fru bir \u015fekilde kontrol edilmezse \u00fcretim sorunlar\u0131na yol a\u00e7abilir.<\/p>\n\n\n\n<p>En \u00f6nemli yonga geometri parametreleri aras\u0131nda TTV (Toplam Kal\u0131nl\u0131k De\u011fi\u015fimi), e\u011frilik ve b\u00fck\u00fclme yer almaktad\u0131r. Bu \u00f6l\u00e7\u00fcmler, m\u00fchendislerin bir yongan\u0131n litografi, yap\u0131\u015ft\u0131rma, inceltme ve paketleme gibi kritik i\u015flemlere girmeden \u00f6nce yonga kal\u0131nl\u0131\u011f\u0131n\u0131n homojenli\u011fini ve d\u00fczl\u00fc\u011f\u00fcn\u00fc de\u011ferlendirmelerine yard\u0131mc\u0131 olur.<\/p>\n\n\n\n<p>Bu makale, bu parametrelerin ne anlama geldi\u011fini, neden \u00f6nemli olduklar\u0131n\u0131 ve nas\u0131l \u00f6l\u00e7\u00fcld\u00fcklerini a\u00e7\u0131klamaktad\u0131r.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"683\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-1024x683.png\" alt=\"\" class=\"wp-image-2556\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-1024x683.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-300x200.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-768x512.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-18x12.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-600x400.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp.png 1536w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Wafer D\u00fczl\u00fc\u011f\u00fc Neden \u00d6nemlidir?<\/h2>\n\n\n\n<p>Modern yar\u0131 iletken cihazlar, son derece s\u0131k\u0131 toleranslarla \u00fcretilmektedir. Yonga kal\u0131nl\u0131\u011f\u0131nda veya d\u00fczl\u00fc\u011f\u00fcnde meydana gelen ufak bir sapma, a\u015fa\u011f\u0131dakileri etkileyebilir:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Fotolitografide odaklama hassasiyeti<\/li>\n\n\n\n<li>Yonga birle\u015ftirme kalitesi<\/li>\n\n\n\n<li>\u0130nce tabaka biriktirme homojenli\u011fi<\/li>\n\n\n\n<li>CMP (Kimyasal Mekanik Parlatma) performans\u0131<\/li>\n\n\n\n<li>K\u00fcpleme ve paketleme verimi<\/li>\n<\/ul>\n\n\n\n<p>Yonga \u00e7aplar\u0131 artt\u0131k\u00e7a ve cihaz yap\u0131lar\u0131 daha karma\u015f\u0131k hale geldik\u00e7e, yonga geometrisini kontrol etmek giderek daha \u00f6nemli hale gelmektedir.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">TTV (Toplam Kal\u0131nl\u0131k De\u011fi\u015fimi) Nedir?<\/h2>\n\n\n\n<p>TTV (Toplam Kal\u0131nl\u0131k De\u011fi\u015fimi), bir yonga plakas\u0131n\u0131n t\u00fcm y\u00fczeyi boyunca kal\u0131nl\u0131\u011f\u0131n\u0131n ne kadar homojen oldu\u011funu \u00f6l\u00e7er.<\/p>\n\n\n\n<p>Bu, yonga \u00fczerinde \u00f6l\u00e7\u00fclen maksimum ve minimum kal\u0131nl\u0131k aras\u0131ndaki fark olarak tan\u0131mlan\u0131r.<\/p>\n\n\n\n<p><strong>Form\u00fcl:<\/strong><\/p>\n\n\n\n<p>TTV = Maksimum Kal\u0131nl\u0131k \u2212 Minimum Kal\u0131nl\u0131k<\/p>\n\n\n\n<p>\u00d6rne\u011fin, bir yonga plakas\u0131n\u0131n en kal\u0131n noktas\u0131 726 \u03bcm ve en ince noktas\u0131 721 \u03bcm ise, TTV de\u011feri 5 \u03bcm\u2019dir.<\/p>\n\n\n\n<p>Daha d\u00fc\u015f\u00fck bir TTV de\u011feri genellikle daha iyi kal\u0131nl\u0131k homojenli\u011fi anlam\u0131na gelir; bu da hassas yar\u0131 iletken i\u015fleme i\u00e7in hayati \u00f6nem ta\u015f\u0131r.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">TTV Neden \u00d6nemlidir?<\/h3>\n\n\n\n<p>A\u015f\u0131r\u0131 TTV \u015fu sonu\u00e7lara yol a\u00e7abilir:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Litografi s\u0131ras\u0131nda odak hatalar\u0131<\/li>\n\n\n\n<li>D\u00fczensiz parlatma sonu\u00e7lar\u0131<\/li>\n\n\n\n<li>D\u00fc\u015f\u00fck yonga birle\u015ftirme performans\u0131<\/li>\n\n\n\n<li>Artan s\u00fcre\u00e7 de\u011fi\u015fkenli\u011fi<\/li>\n<\/ul>\n\n\n\n<p>\u00dcst d\u00fczey yar\u0131 iletken yonga plakalar\u0131 genellikle sadece birka\u00e7 mikron veya daha az TTV de\u011ferleri gerektirir.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Wafer Bow Nedir?<\/h2>\n\n\n\n<p>Bow, bir yongan\u0131n bir referans d\u00fczleme g\u00f6re genel e\u011frili\u011fini ifade eder.<\/p>\n\n\n\n<p>D\u00fcz bir y\u00fczeye bir yonga yerle\u015ftirdi\u011finizi hayal edin. Yongan\u0131n merkezi referans d\u00fczleminin \u00fczerine \u00e7\u0131karsa veya alt\u0131na inerse, yonga e\u011frilik g\u00f6sterir.<\/p>\n\n\n\n<p>B\u00fck\u00fclme genellikle a\u015fa\u011f\u0131daki durumlarda ortaya \u00e7\u0131kan i\u00e7 gerilimlerden kaynaklan\u0131r:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Epitaksiyel b\u00fcy\u00fcme<\/li>\n\n\n\n<li>\u0130nce tabaka biriktirme<\/li>\n\n\n\n<li>Termal i\u015fleme<\/li>\n\n\n\n<li>Yonga inceltme<\/li>\n<\/ul>\n\n\n\n<p>Pozitif e\u011frilik, yonga merkezinin referans d\u00fczleminden daha y\u00fcksekte oldu\u011funu, negatif e\u011frilik ise daha al\u00e7akta oldu\u011funu g\u00f6sterir.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Yay Neden \u00d6nemlidir?<\/h3>\n\n\n\n<p>Yay, a\u015fa\u011f\u0131dakileri etkileyebilir:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Yonga i\u015fleme<\/li>\n\n\n\n<li>Hizalama hassasiyeti<\/li>\n\n\n\n<li>Yap\u0131\u015ft\u0131rma i\u015flemleri<\/li>\n\n\n\n<li>\u0130nce tabaka gerilme de\u011ferlendirmesi<\/li>\n<\/ul>\n\n\n\n<p>M\u00fchendislik \u00fcr\u00fcn\u00fc yonga plakalar\u0131 ve geli\u015fmi\u015f alt tabakalar s\u00f6z konusu oldu\u011funda, e\u011frilik genellikle \u00fcretim s\u00fcreci boyunca izlenir.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Wafer Warp Nedir?<\/h2>\n\n\n\n<p>Warp, serbest duran bir yongan\u0131n genel deformasyonunu \u00f6l\u00e7er.<\/p>\n\n\n\n<p>Esas olarak tekd\u00fcze bir e\u011frili\u011fi ifade eden \u201cbow\u201ddan farkl\u0131 olarak, \u201cwarp\u201d hem genel b\u00fck\u00fclmeyi hem de yerel y\u00fczey bozulmalar\u0131n\u0131 i\u00e7erir.<\/p>\n\n\n\n<p>Sonu\u00e7 olarak, warp genellikle bir yongan\u0131n ger\u00e7ek \u015feklinin daha ger\u00e7ek\u00e7i bir temsilini sunar.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Warp Neden \u00d6nemlidir?<\/h3>\n\n\n\n<p>Y\u00fcksek \u00e7\u00f6zg\u00fc de\u011ferleri \u015fu sorunlara yol a\u00e7abilir:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Ekipman kullan\u0131m\u0131na ili\u015fkin sorunlar<\/li>\n\n\n\n<li>Vakumlu tutma sorunlar\u0131<\/li>\n\n\n\n<li>Ba\u011flanma veriminde azalma<\/li>\n\n\n\n<li>Ambalaj g\u00fcvenilirli\u011fi ile ilgili endi\u015feler<\/li>\n<\/ul>\n\n\n\n<p>Warp, farkl\u0131 termal genle\u015fme katsay\u0131lar\u0131na sahip birden fazla malzemenin bir araya getirildi\u011fi ileri d\u00fczey ambalajlama teknolojilerinde \u00f6zellikle \u00f6nem kazanm\u0131\u015ft\u0131r.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Bow ve Warp: Aralar\u0131ndaki Fark Nedir?<\/h2>\n\n\n\n<p>Bu terimler genellikle birlikte kullan\u0131lsa da, yonga geometrisinin farkl\u0131 y\u00f6nlerini tan\u0131mlamaktad\u0131r.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th>Parametre<\/th><th>Yay<\/th><th>\u00c7\u00f6zg\u00fc<\/th><\/tr><tr><td>\u00d6nlemler<\/td><td>Genel e\u011frilik<\/td><td>Toplam deformasyon<\/td><\/tr><tr><td>Yerel bozulmay\u0131 i\u00e7erir<\/td><td>Hay\u0131r<\/td><td>Evet<\/td><\/tr><tr><td>Tipik de\u011fer<\/td><td>Daha k\u00fc\u00e7\u00fck<\/td><td>Daha b\u00fcy\u00fck<\/td><\/tr><tr><td>Ana uygulama<\/td><td>Gerilme analizi<\/td><td>Ambalajlama ve yap\u0131\u015ft\u0131rma<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Bu fark\u0131 hat\u0131rlaman\u0131n basit bir yolu \u015fudur:<\/p>\n\n\n\n<p><strong>\u201cBow\u201d yonga plakas\u0131n\u0131n e\u011frili\u011fini, \u201cwarp\u201d ise ger\u00e7ek \u015feklini ifade eder.<\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">TTV, e\u011frilik ve \u00e7\u00f6zg\u00fc nas\u0131l \u00f6l\u00e7\u00fcl\u00fcr?<\/h2>\n\n\n\n<p>Modern yonga metrologisi, esas olarak temass\u0131z optik \u00f6l\u00e7\u00fcm tekniklerine dayanmaktad\u0131r.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Lazer Tarama Sistemleri<\/h3>\n\n\n\n<p>Lazer tabanl\u0131 sistemler, yonga plakalar\u0131n\u0131n her iki y\u00fczeyini de tarar ve ayr\u0131nt\u0131l\u0131 kal\u0131nl\u0131k ve d\u00fczl\u00fck haritalar\u0131 olu\u015fturur.<\/p>\n\n\n\n<p>Bu sistemler \u015funlar\u0131 \u00f6l\u00e7ebilir:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kal\u0131nl\u0131k<\/li>\n\n\n\n<li>TTV<\/li>\n\n\n\n<li>Yay<\/li>\n\n\n\n<li>\u00c7\u00f6zg\u00fc<\/li>\n<\/ul>\n\n\n\n<p>Silikon, safir, kuvars ve SiC yonga plakalar\u0131nda yayg\u0131n olarak kullan\u0131lmaktad\u0131r.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Optik Profilometreler<\/h3>\n\n\n\n<p>Optik profilometreler, y\u00fcksek hassasiyetle \u00fc\u00e7 boyutlu y\u00fczey profilleri olu\u015fturur.<\/p>\n\n\n\n<p>Genellikle \u015fu ama\u00e7larla kullan\u0131l\u0131rlar:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u00c7arp\u0131kl\u0131k analizi<\/li>\n\n\n\n<li>Y\u00fczey topografisi \u00f6l\u00e7\u00fcm\u00fc<\/li>\n\n\n\n<li>D\u00fczl\u00fck kontrol\u00fc<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Beyaz I\u015f\u0131k \u0130nterferometreleri<\/h3>\n\n\n\n<p>Ultra hassas uygulamalarda, beyaz \u0131\u015f\u0131k interferometrisi mikron alt\u0131 ve hatta nanometre d\u00fczeyinde \u00f6l\u00e7\u00fcm \u00e7\u00f6z\u00fcn\u00fcrl\u00fc\u011f\u00fc sa\u011flayabilir.<\/p>\n\n\n\n<p>Bu sistemler genellikle MEMS, fotonik ve ara\u015ft\u0131rma uygulamalar\u0131nda kullan\u0131l\u0131r.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Tipik Yonga Geometrisi \u00d6zellikleri<\/h2>\n\n\n\n<p>TTV, e\u011frilik ve b\u00fck\u00fclme i\u00e7in kabul edilebilir de\u011ferler, yonga malzemesine ve uygulamaya g\u00f6re de\u011fi\u015fiklik g\u00f6sterir.<\/p>\n\n\n\n<p>Tipik \u00f6rnekler aras\u0131nda \u015funlar say\u0131labilir:<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td>Gofret T\u00fcr\u00fc<\/td><td>Tipik TTV<\/td><\/tr><tr><td>Silikon Wafer<\/td><td>1\u20135 \u03bcm<\/td><\/tr><tr><td>Safir Yonga Plakas\u0131<\/td><td>3\u201310 \u03bcm<\/td><\/tr><tr><td>Kuvars Yonga Plakas\u0131<\/td><td>5\u201320 \u03bcm<\/td><\/tr><tr><td>SiC Wafer<\/td><td>2\u201310 \u03bcm<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Ger\u00e7ek teknik \u00f6zellikler, yonga \u00e7emberinin \u00e7ap\u0131na, kal\u0131nl\u0131\u011f\u0131na ve son kullan\u0131m gereksinimlerine ba\u011fl\u0131d\u0131r.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Sonu\u00e7<\/h2>\n\n\n\n<p>TTV, e\u011frilik ve \u00e7arp\u0131kl\u0131k, yonga geometrisini ve d\u00fczl\u00fc\u011f\u00fcn\u00fc de\u011ferlendirmek i\u00e7in kullan\u0131lan temel parametrelerdir.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>TTV<\/strong> kal\u0131nl\u0131k homojenli\u011fini \u00f6l\u00e7er.<\/li>\n\n\n\n<li><strong>Yay<\/strong> yonga plakas\u0131n\u0131n genel e\u011frili\u011fini \u00f6l\u00e7er.<\/li>\n\n\n\n<li><strong>\u00c7\u00f6zg\u00fc<\/strong> wafer\u0131n toplam deformasyonunu \u00f6l\u00e7er.<\/li>\n<\/ul>\n\n\n\n<p>Yar\u0131 iletken \u00fcretimi geli\u015fmeye devam ettik\u00e7e, daha y\u00fcksek verim, daha iyi cihaz performans\u0131 ve daha iyi proses kararl\u0131l\u0131\u011f\u0131 elde etmek i\u00e7in bu parametrelerin daha s\u0131k\u0131 bir \u015fekilde kontrol edilmesi hayati \u00f6nem ta\u015f\u0131maktad\u0131r.<\/p>\n\n\n\n<p>\u0130ster tedarik yap\u0131yor olun <a href=\"https:\/\/www.zmsh-semitech.com\/tr\/urun-kategori\/wafer\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">silikon levhalar, safir levhalar, kuvars levhalar veya silikon karb\u00fcr alt tabakalar<\/mark><\/a>, TTV, e\u011frilik ve b\u00fck\u00fclme kavramlar\u0131n\u0131 anlamak, uygulaman\u0131z i\u00e7in do\u011fru yonga \u00f6zelliklerini se\u00e7menize yard\u0131mc\u0131 olabilir.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>In semiconductor manufacturing, wafer quality is about much more than material purity. Even a perfectly grown silicon, sapphire, quartz, or silicon carbide wafer can cause production issues if its geometry is not properly controlled. Among the most important wafer geometry parameters are TTV (Total Thickness Variation), Bow, and Warp. These measurements help engineers evaluate wafer [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2556,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[25],"tags":[44,1514,639,36,1509,637,1090,1518,372,1515,1516,1517,873,131],"class_list":["post-2555","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technology-applications","tag-advanced-packaging","tag-quartz-wafer","tag-sapphire-wafer","tag-semiconductor-manufacturing","tag-semiconductor-wafer","tag-sic-wafer","tag-silicon-wafer","tag-wafer-bow","tag-wafer-flatness","tag-wafer-geometry","tag-wafer-measurement","tag-wafer-metrology","tag-wafer-ttv","tag-wafer-warp"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/posts\/2555","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/comments?post=2555"}],"version-history":[{"count":1,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/posts\/2555\/revisions"}],"predecessor-version":[{"id":2557,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/posts\/2555\/revisions\/2557"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/media\/2556"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/media?parent=2555"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/categories?post=2555"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/tags?post=2555"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}