{"id":2466,"date":"2026-05-14T06:21:48","date_gmt":"2026-05-14T06:21:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2466"},"modified":"2026-05-14T06:22:03","modified_gmt":"2026-05-14T06:22:03","slug":"wafer-notching-and-coring-processes","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/tr\/wafer-notching-and-coring-processes\/","title":{"rendered":"300mm Yar\u0131 \u0130letken \u00dcretiminde Wafer \u00c7entik A\u00e7ma ve Karotlama \u0130\u015flemleri"},"content":{"rendered":"<p>300 mm yar\u0131 iletken \u00fcretiminde, gofret \u00e7entikleme ve karotlama, silikon gofretleri sonraki \u00fcretim ad\u0131mlar\u0131na haz\u0131rlamak i\u00e7in kullan\u0131lan kritik mekanik i\u015flemlerdir. Bu i\u015flemler, geli\u015fmi\u015f fabrikalarda do\u011fru gofret oryantasyonunu, yap\u0131sal b\u00fct\u00fcnl\u00fc\u011f\u00fc ve otomatik ta\u015f\u0131ma sistemleriyle uyumlulu\u011fu sa\u011flar.<\/p>\n\n\n\n<p>Yonga plakas\u0131 boyutlar\u0131 artmaya devam ettik\u00e7e ve i\u015flem d\u00fc\u011f\u00fcmleri daha geli\u015fmi\u015f hale geldik\u00e7e, mekanik yonga plakas\u0131 \u015fekillendirmedeki hassasiyet, verim kontrol\u00fc ve ekipman uyumlulu\u011fu i\u00e7in giderek daha \u00f6nemli hale gelmi\u015ftir.<\/p>\n\n\n\n<p>Bu makalede gofret \u00e7entikleme ve karotlaman\u0131n ne oldu\u011fu, nas\u0131l ger\u00e7ekle\u015ftirildi\u011fi ve modern yar\u0131 iletken \u00fcretiminde neden gerekli oldu\u011fu a\u00e7\u0131klanmaktad\u0131r.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"533\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH.jpg\" alt=\"\" class=\"wp-image-2467\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH.jpg 800w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-300x200.jpg 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-768x512.jpg 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-18x12.jpg 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-600x400.jpg 600w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Gofret \u00c7entikleme Nedir?<\/h2>\n\n\n\n<p>Gofret \u00e7entikleme, bir silikon gofretin kenar\u0131nda k\u00fc\u00e7\u00fck, hassas bir \u015fekilde konumland\u0131r\u0131lm\u0131\u015f bir kesim (\u00e7entik) olu\u015fturma i\u015flemidir. Bu \u00e7entik, otomatik sistemler i\u00e7in bir oryantasyon referans\u0131 g\u00f6revi g\u00f6r\u00fcr.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Gofret \u00c7entik A\u00e7man\u0131n Amac\u0131<\/h3>\n\n\n\n<p>Gofret \u00e7entiklemenin birincil i\u015flevleri \u015funlard\u0131r:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Kristal y\u00f6nelim hizalamas\u0131<\/strong> (\u00f6rne\u011fin,  veya  silikon y\u00f6nelimi)<\/li>\n\n\n\n<li><strong>Ekipman konumland\u0131rma referans\u0131<\/strong> robotik ta\u015f\u0131ma sistemleri i\u00e7in<\/li>\n\n\n\n<li><strong>Litografi, a\u015f\u0131nd\u0131rma ve biriktirme ad\u0131mlar\u0131 aras\u0131nda s\u00fcre\u00e7 tutarl\u0131l\u0131\u011f\u0131<\/strong><\/li>\n\n\n\n<li><strong>300mm fabrikalarda otomasyon uyumlulu\u011fu<\/strong><\/li>\n<\/ul>\n\n\n\n<p>300 mm gofretlerde \u00e7entik, ekipman\u0131n manuel m\u00fcdahale olmadan gofret y\u00f6n\u00fcn\u00fc belirlemesini sa\u011flayan standartla\u015ft\u0131r\u0131lm\u0131\u015f bir \u00f6zelliktir.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Gofret Karotlama Nedir?<\/h2>\n\n\n\n<p>Yonga plakas\u0131 karotlama, \u00f6zel uygulamalar veya i\u015flem gereksinimleri i\u00e7in bir yonga plakas\u0131n\u0131n merkezi b\u00f6lgesinin veya kenar b\u00f6l\u00fcmlerinin \u00e7\u0131kar\u0131lmas\u0131 veya \u015fekillendirilmesi anlam\u0131na gelir. \u00c7entik a\u00e7maya k\u0131yasla daha az tart\u0131\u015f\u0131lsa da, karotlama belirli geli\u015fmi\u015f \u00fcretim ve ara\u015ft\u0131rma uygulamalar\u0131nda rol oynar.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Wafer Karotlaman\u0131n Temel \u0130\u015flevleri<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Merkezi hizalama veya mekanik rahatlama yap\u0131lar\u0131 olu\u015fturma<\/li>\n\n\n\n<li>\u00d6zel yap\u0131\u015ft\u0131rma veya istifleme i\u015flemleri i\u00e7in gofretlerin haz\u0131rlanmas\u0131<\/li>\n\n\n\n<li>Deneysel s\u00fcre\u00e7lerde stresli veya kusurlu merkezi b\u00f6lgelerin \u00e7\u0131kar\u0131lmas\u0131<\/li>\n\n\n\n<li>Ara\u015ft\u0131rma ve prototipleme i\u00e7in \u00f6zel yonga plakas\u0131 geometrilerini destekleme<\/li>\n<\/ul>\n\n\n\n<p>Geli\u015fmi\u015f yar\u0131 iletken ortamlarda karot alma i\u015flemi tipik olarak y\u00fcksek hassasiyetli elmas aletler veya lazer destekli sistemlerle ger\u00e7ekle\u015ftirilir.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">\u00c7entik A\u00e7ma ve Karotlamada Kullan\u0131lan Ekipmanlar<\/h2>\n\n\n\n<p>Y\u00fcksek hassasiyetli yonga plakas\u0131 \u015fekillendirme, mikron d\u00fczeyinde hassasiyet ve minimum hasar i\u00e7in tasarlanm\u0131\u015f \u00f6zel ekipman gerektirir.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">1. Hassas Gofret \u00c7entikleme Sistemleri<\/h3>\n\n\n\n<p>Bu sistemler, yonga plakas\u0131 kenarlar\u0131nda do\u011fru \u00e7entikler olu\u015fturmak i\u00e7in elmas ta\u015flama ta\u015flar\u0131 veya lazer tabanl\u0131 kesme kafalar\u0131 kullan\u0131r.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">2. Elmas Tel Testereler<\/h3>\n\n\n\n<p>Baz\u0131 karot ve \u015fekillendirme uygulamalar\u0131nda, \u00f6zellikle sert malzemelerle veya kal\u0131n yonga levhalarla \u00e7al\u0131\u015f\u0131rken kullan\u0131l\u0131r.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3. Lazer Mikro \u0130\u015fleme Sistemleri<\/h3>\n\n\n\n<p>Geli\u015fmi\u015f fabrikalar, mekanik gerilimi azaltmak amac\u0131yla temass\u0131z \u00e7entik a\u00e7ma ve karotlama i\u00e7in lazer tabanl\u0131 ara\u00e7lar kullanabilir.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">4. CNC Hassas Ta\u015flama Makinalar\u0131<\/h3>\n\n\n\n<p>Yonga plakas\u0131 kenar i\u015fleme i\u00e7in y\u00fcksek tekrarlanabilirlik ve s\u0131k\u0131 boyut kontrol\u00fc sa\u011flar.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">300mm Gofret \u00dcretiminde S\u00fcre\u00e7 Ak\u0131\u015f\u0131<\/h2>\n\n\n\n<p>Gofret \u00e7entikleme ve karotlama i\u00e7in basitle\u015ftirilmi\u015f bir s\u00fcre\u00e7 ak\u0131\u015f\u0131 \u015funlar\u0131 i\u00e7erir:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Gofret Denetimi<\/strong>\n<ul class=\"wp-block-list\">\n<li>Y\u00fczey kusur tespiti<\/li>\n\n\n\n<li>Kal\u0131nl\u0131k ve d\u00fczl\u00fck \u00f6l\u00e7\u00fcm\u00fc<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Oryantasyon Hizalama<\/strong>\n<ul class=\"wp-block-list\">\n<li>Kristal eksen y\u00f6n\u00fcn\u00fc belirleme<\/li>\n\n\n\n<li>\u00c7entik referans konumunun ayarlanmas\u0131<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Mekanik veya Lazer \u0130\u015fleme<\/strong>\n<ul class=\"wp-block-list\">\n<li>Gofret kenar\u0131nda \u00e7entik kesme<\/li>\n\n\n\n<li>Karotlama veya merkezi \u015fekillendirme (gerekirse)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>\u00c7apak Alma ve Y\u00fczey \u0130\u015flemleri<\/strong>\n<ul class=\"wp-block-list\">\n<li>Mikro \u00e7atlaklar\u0131n ve d\u00f6k\u00fcnt\u00fclerin giderilmesi<\/li>\n\n\n\n<li>Stresi azaltmak i\u00e7in kenar parlatma<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Proses Sonras\u0131 Denetim<\/strong>\n<ul class=\"wp-block-list\">\n<li>Optik metroloji<\/li>\n\n\n\n<li>Boyutsal do\u011frulama<\/li>\n\n\n\n<li>Y\u00fczey b\u00fct\u00fcnl\u00fc\u011f\u00fc kontrol\u00fc<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">300mm Yar\u0131 \u0130letken \u00dcretimindeki \u00d6nemi<\/h2>\n\n\n\n<p>Yonga plakas\u0131 \u00e7ap\u0131 300 mm ve \u00f6tesine y\u00fckseldik\u00e7e, mekanik hassasiyet daha kritik hale gelir:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">1. Otomasyon Gereksinimleri<\/h3>\n\n\n\n<p>Modern fabrikalar b\u00fcy\u00fck \u00f6l\u00e7\u00fcde robotik yonga plakas\u0131 i\u015flemeye g\u00fcvenmektedir. Hafif bir yanl\u0131\u015f hizalama bile neden olabilir:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Gofret k\u0131r\u0131lmas\u0131<\/li>\n\n\n\n<li>Litografi ara\u00e7lar\u0131nda yanl\u0131\u015f yerle\u015ftirme<\/li>\n\n\n\n<li>Sonraki s\u00fcre\u00e7lerde verim kayb\u0131<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">2. Stres Duyarl\u0131l\u0131\u011f\u0131<\/h3>\n\n\n\n<p>B\u00fcy\u00fck gofretler, kenar i\u015fleme s\u0131ras\u0131nda ortaya \u00e7\u0131kan mekanik gerilime kar\u015f\u0131 daha hassast\u0131r. K\u00f6t\u00fc \u00e7entikleme veya karotlama \u015funlara yol a\u00e7abilir:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mikro \u00e7atlaklar<\/li>\n\n\n\n<li>Kenar yontma<\/li>\n\n\n\n<li>Termal d\u00f6ng\u00fc s\u0131ras\u0131nda delaminasyon<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3. S\u00fcre\u00e7 Entegrasyonu<\/h3>\n\n\n\n<p>\u00c7entikler tam olarak hizalanmal\u0131d\u0131r:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Litografi hizalama sistemleri<\/li>\n\n\n\n<li>A\u015f\u0131nd\u0131rma tak\u0131m\u0131 y\u00f6n\u00fc<\/li>\n\n\n\n<li>Metroloji referans \u00e7er\u00e7eveleri<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Gofret \u00c7entik A\u00e7ma ve Karotlamada S\u0131k Kar\u015f\u0131la\u015f\u0131lan Zorluklar<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">1. Kenar Yontma<\/h3>\n\n\n\n<p>Uygun olmayan kesme parametreleri yonga plakas\u0131 kenar\u0131nda mikro k\u0131r\u0131lmalara neden olarak mekanik mukavemeti etkileyebilir.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">2. Y\u00fczey Alt\u0131 Hasar\u0131<\/h3>\n\n\n\n<p>A\u015f\u0131r\u0131 mekanik kuvvet, \u0131s\u0131l i\u015flem s\u0131ras\u0131nda yay\u0131lan gizli kusurlar\u0131 ortaya \u00e7\u0131karabilir.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3. Hizalama Hatalar\u0131<\/h3>\n\n\n\n<p>\u00c7entik konumundaki k\u00fc\u00e7\u00fck sapmalar bile t\u00fcm fabrika otomasyon sistemlerini etkileyebilir.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">4. Alet A\u015f\u0131nmas\u0131<\/h3>\n\n\n\n<p>Elmas aletler zamanla bozulur, tutarl\u0131l\u0131\u011f\u0131 etkiler ve s\u0131k\u0131 bak\u0131m kontrol\u00fc gerektirir.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Kalite Kontrol ve Muayene Y\u00f6ntemleri<\/h2>\n\n\n\n<p>Yar\u0131 iletken \u00fcretiminde g\u00fcvenilirli\u011fi sa\u011flamak i\u00e7in yonga plakas\u0131 \u00e7entikleme ve karotlama i\u015flemleri s\u0131k\u0131 bir \u015fekilde kontrol edilir:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Optik mikroskopi incelemesi<\/li>\n\n\n\n<li>Lazer tarama metrolojisi<\/li>\n\n\n\n<li>Kenar profili \u00f6l\u00e7\u00fcm sistemleri<\/li>\n\n\n\n<li>Y\u00fczey p\u00fcr\u00fczl\u00fcl\u00fc\u011f\u00fc analizi (ileri durumlarda AFM\/SEM)<\/li>\n<\/ul>\n\n\n\n<p>Bu y\u00f6ntemler yar\u0131 iletken s\u0131n\u0131f\u0131 standartlara uygunlu\u011fu sa\u011flar.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">End\u00fcstri Uygulamalar\u0131<\/h2>\n\n\n\n<p>Gofret \u00e7entikleme ve karotlama yayg\u0131n olarak kullan\u0131lmaktad\u0131r:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>300 mm silikon gofret \u00fcretimi<\/li>\n\n\n\n<li>Geli\u015fmi\u015f mant\u0131k ve bellek fabrikalar\u0131<\/li>\n\n\n\n<li>Ara\u015ft\u0131rma ve geli\u015ftirme wafer prototipleme<\/li>\n\n\n\n<li>\u00d6zel yar\u0131 iletken malzemeler (SiC, safir, cam gofretler)<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Sonu\u00e7<\/h2>\n\n\n\n<p>Gofret \u00e7entikleme ve karotlama, gofret \u00fcretiminde \u00f6nemli hassas s\u00fcre\u00e7lerdir.<mark style=\"background-color:rgba(0, 0, 0, 0);color:#0693e3\" class=\"has-inline-color\"> 300 mm yar\u0131 iletken \u00fcretimi<\/mark>. Litografi veya biriktirme ile kar\u015f\u0131la\u015ft\u0131r\u0131ld\u0131\u011f\u0131nda \u00f6nemsiz g\u00f6r\u00fcnseler de, bu mekanik ad\u0131mlar yonga plakas\u0131 i\u015fleme hassasiyetini, proses stabilitesini ve genel verimi do\u011frudan etkiler.<\/p>\n\n\n\n<p>Yar\u0131 iletken teknolojisi ilerlemeye devam ettik\u00e7e, ultra hassas kenar i\u015flemeye olan talep artmaya devam edecek ve bu s\u00fcre\u00e7ler yeni nesil fabrikalarda giderek daha \u00f6nemli hale gelecektir.<\/p>","protected":false},"excerpt":{"rendered":"<p>In 300mm semiconductor manufacturing, wafer notching and coring are critical mechanical processes used to prepare silicon wafers for downstream fabrication steps. These processes ensure proper wafer orientation, structural integrity, and compatibility with automated handling systems in advanced fabs. As wafer sizes continue to increase and process nodes become more advanced, precision in mechanical wafer shaping [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2467,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[24],"tags":[1367,1370,185,1327,1369,1365,1366,1337,1368],"class_list":["post-2466","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-300mm-wafer-manufacturing","tag-precision-wafer-processing","tag-semiconductor-manufacturing-equipment","tag-semiconductor-wafer-processing","tag-silicon-wafer-alignment","tag-wafer-coring","tag-wafer-edge-notching","tag-wafer-handling-systems","tag-wafer-notching"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/posts\/2466","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/comments?post=2466"}],"version-history":[{"count":1,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/posts\/2466\/revisions"}],"predecessor-version":[{"id":2468,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/posts\/2466\/revisions\/2468"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/media\/2467"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/media?parent=2466"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/categories?post=2466"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/tr\/wp-json\/wp\/v2\/tags?post=2466"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}