{"id":2125,"date":"2026-04-08T05:30:39","date_gmt":"2026-04-08T05:30:39","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2125"},"modified":"2026-04-08T05:30:42","modified_gmt":"2026-04-08T05:30:42","slug":"wgp-1271-fully-automatic-wafer-thinning-polishing-integrated-machine","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/th\/product\/wgp-1271-fully-automatic-wafer-thinning-polishing-integrated-machine\/","title":{"rendered":"WGP-1271 Fully Automatic Wafer Thinning & Polishing Integrated Machine"},"content":{"rendered":"

\"\"The WGP-1271 Fully Automatic Wafer Thinning & Polishing Integrated Machine is a next-generation solution designed for ultra-thin wafer processing in advanced semiconductor packaging. By integrating grinding, polishing, cleaning, and tape handling into a single automated platform, the system significantly reduces process time while improving consistency and yield.<\/p>\n

Engineered for wafers up to 300 mm (12 inches), the WGP-1271 enables stable thinning of wafers to below 50 \u03bcm, meeting the stringent requirements of advanced packaging technologies such as 3D IC, wafer-level packaging (WLP), and power device integration.<\/p>\n

Unlike conventional multi-step systems, this machine combines back grinding and stress relief polishing into a unified process, minimizing wafer handling and reducing the risk of damage. The result is improved wafer integrity, higher throughput, and lower total cost of ownership (TCO).<\/p>\n

\n

\u0e04\u0e38\u0e13\u0e2a\u0e21\u0e1a\u0e31\u0e15\u0e34\u0e40\u0e14\u0e48\u0e19<\/strong><\/span><\/h2>\n

1. Integrated Thinning and Polishing Process<\/strong><\/span><\/h3>\n

The WGP-1271 combines coarse grinding, fine grinding, and polishing into a single workflow. This integrated design eliminates intermediate transfer steps, significantly reducing non-processing time and improving overall production efficiency.<\/p>\n

2. Ultra-Thin Wafer Capability (<50 \u03bcm)<\/strong><\/span><\/h3>\n

The system is specifically designed for ultra-thin wafer applications. It ensures stable processing and safe handling of wafers below 50 microns, which are typically fragile and prone to warpage or cracking.<\/p>\n

3. Three-Spindle Four-Station Architecture<\/strong><\/span><\/h3>\n

With a three-spindle, four-chuck configuration<\/strong>, the WGP-1271 enables parallel processing and high throughput. Each spindle is optimized for different stages of the process:<\/p>\n

    \n
  • Spindle 1: Coarse grinding<\/li>\n
  • Spindle 2: Fine grinding<\/li>\n
  • Spindle 3: Polishing \/ ultra-precision thinning (optional dry polishing)<\/li>\n<\/ul>\n

    This modular approach ensures both flexibility and precision.<\/p>\n

    4. Advanced In-Line Thickness Measurement (NCG + Auto TTV)<\/strong><\/span><\/h3>\n

    The system integrates Swing NCG (Non-Contact Gauge)<\/strong> with Auto TTV control, enabling real-time, non-contact wafer thickness measurement. This allows continuous monitoring and automatic adjustment of thickness uniformity throughout the process.<\/p>\n

    5. Fully Automated End-to-End Processing<\/strong><\/span><\/h3>\n

    The WGP-1271 supports a complete automated workflow, including:<\/p>\n

      \n
    • Grinding<\/li>\n
    • Polishing<\/li>\n
    • Wafer transfer<\/li>\n
    • Cleaning<\/li>\n
    • Tape mounting and removal<\/li>\n<\/ul>\n

      This reduces manual intervention, improves repeatability, and ensures compatibility with modern smart manufacturing environments.<\/p>\n

      6. Optional Dry Polishing & Ultra-Precision Grinding<\/strong><\/span><\/h3>\n

      The third spindle (Z3 axis) supports X-axis movement and can be configured for dry polishing or ultra-precision grinding<\/strong>, enabling diverse process applications depending on customer requirements.<\/p>\n

      \"\"\u0e01\u0e32\u0e23\u0e1b\u0e23\u0e30\u0e22\u0e38\u0e01\u0e15\u0e4c\u0e43\u0e0a\u0e49<\/strong><\/span><\/h2>\n

      The WGP-1271 is ideal for advanced semiconductor manufacturing processes, including:<\/p>\n

        \n
      • Ultra-thin wafer processing (\u2264 12 inch)<\/li>\n
      • Advanced packaging (WLP, Fan-out, 3D IC)<\/li>\n
      • IGBT and power semiconductor devices<\/li>\n
      • Silicon (Si) wafer thinning<\/li>\n
      • Silicon carbide (SiC) wafer processing<\/li>\n
      • High-density integrated circuit manufacturing<\/li>\n<\/ul>\n

        Its capability to handle ultra-thin wafers makes it particularly suitable for next-generation electronic devices requiring compact size and high performance.<\/p>\n

        \u0e02\u0e49\u0e2d\u0e21\u0e39\u0e25\u0e08\u0e33\u0e40\u0e1e\u0e32\u0e30\u0e17\u0e32\u0e07\u0e40\u0e17\u0e04\u0e19\u0e34\u0e04<\/strong><\/span><\/h2>\n
        \n
        \n\n\n\n\n\n\n\n\n\n\n\n
        \u0e1e\u0e32\u0e23\u0e32\u0e21\u0e34\u0e40\u0e15\u0e2d\u0e23\u0e4c<\/th>\n\u0e02\u0e49\u0e2d\u0e01\u0e33\u0e2b\u0e19\u0e14<\/th>\n<\/tr>\n<\/thead>\n
        Structure<\/td>\n3 Spindles \/ 4 Chucks \/ 1 Workstation \/ Automatic Transfer & Cleaning System \/ Tape Mounting & Removal System<\/td>\n<\/tr>\n
        \u0e02\u0e19\u0e32\u0e14\u0e40\u0e27\u0e40\u0e1f\u0e2d\u0e23\u0e4c<\/td>\n8 inch \/ 12 inch (Up to 300 mm)<\/td>\n<\/tr>\n
        Spindle Power<\/td>\n7.5 kW \/ 11 kW (Optional)<\/td>\n<\/tr>\n
        Special Feature<\/td>\nZ3 Axis with X-axis movement<\/td>\n<\/tr>\n
        Processing Capability<\/td>\nGrinding + Polishing + Cleaning + Tape Handling<\/td>\n<\/tr>\n
        Minimum Thickness<\/td>\n< 50 \u03bcm<\/td>\n<\/tr>\n
        Dimensions (W\u00d7D\u00d7H)<\/td>\n4050 \u00d7 3530 \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

        Performance Advantages<\/strong><\/span><\/h2>\n

        Higher Efficiency<\/strong><\/span><\/h3>\n

        The integrated design reduces process steps and handling time, leading to significantly higher throughput compared to traditional separate systems.<\/p>\n

        Improved Yield<\/strong><\/span><\/h3>\n

        Non-contact measurement and low-stress processing minimize wafer damage, resulting in higher yield and better device reliability.<\/p>\n

        Superior Thickness Control<\/strong><\/span><\/h3>\n

        Real-time TTV adjustment ensures excellent thickness uniformity, which is critical for advanced packaging applications.<\/p>\n

        Reduced Risk of Contamination<\/strong><\/span><\/h3>\n

        Fewer transfer steps and a controlled process environment help maintain wafer cleanliness and reduce defect rates.<\/p>\n

        Enhanced Process Flexibility<\/strong><\/span><\/h3>\n

        Optional dry polishing and ultra-precision grinding allow customization for different materials and applications.<\/p>\n

        \"\"Engineering Value & Industry Significance<\/strong><\/span><\/h2>\n

        As semiconductor devices continue to evolve toward higher performance and smaller form factors, ultra-thin wafers have become a critical requirement. However, thinning wafers below 50 \u03bcm introduces significant challenges in handling, stress control, and defect prevention.<\/p>\n

        The WGP-1271 addresses these challenges through integrated engineering design, combining multiple process steps into a single automated system. This not only improves production efficiency but also enhances process reliability, making it a valuable asset for semiconductor manufacturers transitioning to advanced packaging technologies.<\/p>\n

        \u0e04\u0e33\u0e16\u0e32\u0e21\u0e17\u0e35\u0e48\u0e1e\u0e1a\u0e1a\u0e48\u0e2d\u0e22<\/strong><\/span><\/h2>\n

        1. What is the main advantage of an integrated thinning and polishing system?<\/strong><\/span><\/h3>\n

        It reduces wafer handling steps, shortens processing time, and minimizes the risk of wafer damage, leading to higher efficiency and yield.<\/p>\n

        2. Can the WGP-1271 process ultra-thin wafers below 50 \u03bcm?<\/strong><\/span><\/h3>\n

        Yes, the system is specifically designed to handle and process wafers thinner than 50 \u03bcm with high stability and precision.<\/p>\n

        3. What types of wafers are supported?<\/strong><\/span><\/h3>\n

        The machine supports silicon (Si), silicon carbide (SiC), and other semiconductor wafers up to 300 mm.<\/p>\n

        4. How is thickness uniformity controlled?<\/strong><\/span><\/h3>\n

        Through an integrated non-contact measurement system (NCG) combined with Auto TTV adjustment for real-time control.<\/p>\n

        5. Does the machine support fully automated production?<\/strong><\/span><\/h3>\n

        Yes, it includes automatic transfer, cleaning, and tape handling systems, making it suitable for high-volume automated fabs.<\/p>","protected":false},"excerpt":{"rendered":"

        The WGP-1271 Fully Automatic Wafer Thinning & Polishing Integrated Machine offers a comprehensive solution for ultra-thin wafer processing. With its advanced automation, precision control, and integrated workflow, it is ideally suited for high-end semiconductor applications where performance, yield, and efficiency are critical.<\/p>","protected":false},"featured_media":2126,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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