{"id":2773,"date":"2026-08-07T09:29:52","date_gmt":"2026-08-07T09:29:52","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2773"},"modified":"2026-08-22T09:56:03","modified_gmt":"2026-08-22T09:56:03","slug":"semiconductor-wafer-wire-saw-machine","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/sv\/product\/semiconductor-wafer-wire-saw-machine\/","title":{"rendered":"Semiconductor Wafer Precision Wire Saw Machine for Thin Wafer Slicing"},"content":{"rendered":"

The ZMSH Semiconductor Wafer Precision Wire Saw Machine is designed for precision slicing applications where stable wire motion, controlled feed, fine cutting wire and reliable mechanical accuracy are required.<\/p>\n

The machine integrates the complete slicing process into one industrial platform, including wire supply and take-up, wire traversing, tension control, guide wheels, main roller drive, precision workpiece feed, slurry circulation, heat exchange and electrical control.<\/p>\n

According to the supplied equipment specification, the system is intended for semiconductor wafer cutting and supports cutting accuracy of \u00b10.01 mm, with a stated minimum slicing thickness below 0.05 mm under suitable process conditions.<\/p>\n

For semiconductor material manufacturers, wafer processing companies and R&D facilities, the system provides a configurable solution for converting crystal or ingot materials into thin wafer sections before subsequent grinding, lapping, polishing or other wafer finishing processes.<\/p>\n

\n

Key Performance Highlights<\/h2>\n

The equipment is designed around high-speed fine-wire cutting.<\/p>\n

Its maximum specified wire speed is:<\/p>\n

2200 m\/min<\/p>\n

Supported wire diameter:<\/p>\n

0.014\u20130.10 mm<\/p>\n

Adjustable wire tension:<\/p>\n

0\u201315 N<\/p>\n

Maximum wire storage:<\/p>\n

100 km<\/p>\n

These parameters provide flexibility when selecting different wire sizes and cutting conditions for precision wafer slicing.<\/p>\n

The feed system also provides variable cutting-speed control between 0.01 and 5 mm\/min, allowing the cutting recipe to be adjusted according to the material, workpiece size and required slicing conditions.<\/p>\n

\n

Tekniska specifikationer<\/h1>\n
\n
\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Parameter<\/th>\nSpecifikation<\/th>\n<\/tr>\n<\/thead>\n
Maximal storlek p\u00e5 arbetsstycket<\/td>\nW90 \u00d7 H220 \u00d7 L450 mm<\/td>\n<\/tr>\n
Maximum Workpiece Length<\/td>\n450 mm<\/td>\n<\/tr>\n
Maximum Wire Speed<\/td>\n2200 m\/min<\/td>\n<\/tr>\n
Wire Diameter Range<\/td>\n0.014\u20130.10 mm<\/td>\n<\/tr>\n
Maximum Wire Storage<\/td>\n100 km<\/td>\n<\/tr>\n
Wire Tension Range<\/td>\n0\u201315 N<\/td>\n<\/tr>\n
Wire Operation Mode<\/td>\nReciprocating \/ Unidirectional<\/td>\n<\/tr>\n
Feed Travel<\/td>\n\u2264220 mm<\/td>\n<\/tr>\n
Sk\u00e4rande matningshastighet<\/td>\n0.01\u20135 mm\/min<\/td>\n<\/tr>\n
Rapid Feed Speed<\/td>\n200 mm\/min<\/td>\n<\/tr>\n
Sk\u00e4rmetod<\/td>\nDownward feed<\/td>\n<\/tr>\n
Workpiece Clamping<\/td>\nAutomatic hydraulic clamping<\/td>\n<\/tr>\n
Slurry Tank Capacity<\/td>\n300 L<\/td>\n<\/tr>\n
Wire Break Detection<\/td>\nIncluded<\/td>\n<\/tr>\n
Main Roller Speed<\/td>\n<4500 r\/min<\/td>\n<\/tr>\n
Maximum Main Roller Diameter<\/td>\n\u00d8160 mm<\/td>\n<\/tr>\n
Main Roller Quantity<\/td>\n3 pcs + 3 spare<\/td>\n<\/tr>\n
Str\u00f6mf\u00f6rs\u00f6rjning<\/td>\nAC 380 V \u00b110%, 50\/60 Hz<\/td>\n<\/tr>\n
Maskinens m\u00e5tt<\/td>\nApprox. L1750 \u00d7 W1600 \u00d7 H2900 mm<\/td>\n<\/tr>\n
Maskinens vikt<\/td>\nApprox. 8 tons<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

The above equipment configuration is based on the technical data supplied for this machine.<\/p>\n

\n

Precision Feed for Controlled Wafer Thickness<\/h1>\n

Consistent wafer slicing requires more than high wire speed. The movement of the material through the wire field must also remain stable.<\/p>\n

The machine therefore uses a servo-controlled feed unit with a maximum stroke of approximately 220 mm.<\/p>\n

The standard cutting feed speed can be adjusted from:<\/p>\n

0.01 to 5 mm\/min<\/p>\n

while the rapid movement speed reaches:<\/p>\n

200 mm\/min.<\/p>\n

This controlled feed architecture allows users to establish different process conditions according to workpiece material, target wafer thickness and wire specification.<\/p>\n

\n

Automatic Hydraulic Workpiece Clamping<\/h1>\n

Workpiece stability directly influences cutting repeatability.<\/p>\n

The equipment uses an automatic hydraulic clamping system to secure the material during processing.<\/p>\n

The processing envelope supports workpieces up to approximately:<\/p>\n

W90 \u00d7 H220 \u00d7 L450 mm<\/p>\n

with a maximum length of 450 mm.<\/p>\n

This configuration can support different semiconductor material shapes provided they remain within the specified mechanical envelope and suitable fixtures are used.<\/p>\n

\n

Integrated Wire Control System<\/h1>\n

The wire system is composed of several coordinated mechanical units.<\/p>\n

The machine documentation identifies the following main modules:<\/p>\n

    \n
  • Wire winding unit<\/li>\n
  • Wire traversing unit<\/li>\n
  • Tension arm<\/li>\n
  • Guide wheels<\/li>\n
  • Main spindle unit<\/li>\n
  • Workpiece feed unit<\/li>\n
  • Heat exchanger<\/li>\n
  • Slurry tank<\/li>\n
  • Electrical cabinet<\/li>\n
  • Operator control panel<\/li>\n<\/ul>\n

    The winding unit supplies and stores the cutting wire, while the traversing unit helps maintain smooth payout and even winding.<\/p>\n

    The tension arm keeps the wire running under a controlled tension, and the guide-wheel system assists with wire routing and stable movement through the cutting area.<\/p>\n

    \n

    Direct-Drive Main Roller System<\/h1>\n

    The equipment uses a direct-drive architecture.<\/p>\n

    According to the machine specification, the direct connection between the drive system and mechanical components is intended to provide:<\/p>\n

      \n
    • Lower operating noise<\/li>\n
    • Lower wear-component consumption<\/li>\n
    • Improved drive precision<\/li>\n<\/ul>\n

      The main rollers are also equipped with direct motor drive.<\/p>\n

      This design reduces the load generated when the cutting wire drives the rollers and is intended to reduce both wire-break risk and roller-groove wear.<\/p>\n

      \n

      270 mm Roller Spacing Design<\/h1>\n

      The specified main roller spacing is approximately:<\/p>\n

      270 mm<\/p>\n

      The machine documentation describes the reduced roller spacing as a design intended to improve cutting conditions while reducing cutting time and wire consumption.<\/p>\n

      For fine-wire cutting, reducing unsupported wire length in the processing area can be particularly useful when process stability is important.<\/p>\n

      \n

      Wire Break Detection and Alarm<\/h1>\n

      Wire breakage is one of the major risks during precision wafer slicing, especially when processing valuable semiconductor materials.<\/p>\n

      The machine therefore includes standard wire-break detection.<\/p>\n

      The equipment documentation also specifies a dual-side wire-break alarm system intended to improve detection sensitivity.<\/p>\n

      This provides an additional layer of process monitoring during extended cutting cycles.<\/p>\n

      \n

      Mechanical Accuracy Requirements<\/h1>\n

      The machine’s acceptance criteria include several mechanical accuracy checks.<\/p>\n

      \n
      \n\n\n\n\n\n\n\n\n\n\n\n\n
      Mechanical Item<\/th>\nRequirement<\/th>\n<\/tr>\n<\/thead>\n
      Main Roller Runout<\/td>\n\u22640.02 mm<\/td>\n<\/tr>\n
      Spindle Taper Radial Runout<\/td>\n\u22640.005 mm<\/td>\n<\/tr>\n
      Spindle Core Axial Runout<\/td>\n\u22640.005 mm<\/td>\n<\/tr>\n
      Taper Contact Ratio<\/td>\n\u226570%<\/td>\n<\/tr>\n
      Vertical Feed Straightness<\/td>\n\u22640.005 mm \/ 150 mm<\/td>\n<\/tr>\n
      Wire Twist<\/td>\n<5 turns\/m<\/td>\n<\/tr>\n
      Supply\/Take-Up Spindle Vibration<\/td>\n\u22645 m\/s\u00b2<\/td>\n<\/tr>\n
      Supply\/Take-Up Roller Runout<\/td>\n\u22640.15 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

      These values define the documented mechanical acceptance requirements of the equipment.<\/p>\n

      \n

      Slurry Circulation and Temperature Management<\/h1>\n

      The cutting system includes a 300 L slurry tank for supplying cutting and cooling fluid during operation.<\/p>\n

      The integrated heat exchanger controls slurry temperature using external chilled water.<\/p>\n

      Recommended chilled-water conditions are:<\/p>\n

      \n
      \n\n\n\n\n\n\n\n\n
      Utility Requirement<\/th>\nSpecifikation<\/th>\n<\/tr>\n<\/thead>\n
      Cooling Water Temperature<\/td>\n11 \u00b11\u00b0C<\/td>\n<\/tr>\n
      Cooling Water Flow<\/td>\n20\u201350 L\/min<\/td>\n<\/tr>\n
      Cooling Water Pressure<\/td>\n0.2\u20130.4 MPa<\/td>\n<\/tr>\n
      Cooling Capacity<\/td>\n\u22655 kW<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

      The cooling-water circuit is insulated to help prevent condensation.<\/p>\n

      \n

      Rigid Integrated Machine Construction<\/h1>\n

      Mechanical rigidity is important when controlling vibration and maintaining stable wire geometry.<\/p>\n

      The equipment uses a high-strength steel enclosure and an integrated cast machine base.<\/p>\n

      The machine also includes a bottom tray intended to prevent liquid leakage onto the installation floor, while a pneumatic safety mechanism is provided at the upper section of the equipment to support safe lifting-platform operation.<\/p>\n

      \n

      Electrical and Factory Requirements<\/h1>\n

      Standard power requirement:<\/p>\n

      Three-phase four-wire AC 380 V \u00b110%, 50\/60 Hz<\/p>\n

      The technical documentation specifies installation using copper cable of 16 mm\u00b2 or above.<\/p>\n

      Referenced operating power consumption is approximately:<\/p>\n

      5 kWh<\/p>\n

      although actual consumption will depend on the process and operating condition.<\/p>\n

      \n

      Recommended Operating Environment<\/h1>\n

      Recommended environmental conditions include:<\/p>\n

      \n
      \n\n\n\n\n\n\n\n
      F\u00f6rem\u00e5l<\/th>\nRequirement<\/th>\n<\/tr>\n<\/thead>\n
      Room Temperature<\/td>\n18\u201328\u00b0C<\/td>\n<\/tr>\n
      Relative Humidity<\/td>\n\u226475%<\/td>\n<\/tr>\n
      Environmental Vibration<\/td>\n\u22640.5 G<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

      The supplied documentation additionally specifies hydraulic workpiece clamping, a 300 L slurry tank and six guide wheels in the referenced configuration.<\/p>\n

      \n

      Semiconductor Wafer Slicing Application<\/h1>\n

      The stated industry application for the machine is:<\/p>\n

      Semiconductor Wafer Cutting.<\/p>\n

      Depending on project requirements, the machine may be evaluated for semiconductor and hard-brittle material slicing projects where fine wire and precision feed are required.<\/p>\n

      Typical customer requirements may include:<\/p>\n

        \n
      • Semiconductor crystal slicing<\/li>\n
      • Thin wafer preparation<\/li>\n
      • Research wafer cutting<\/li>\n
      • Pilot-line wafer production<\/li>\n
      • Custom wafer thickness development<\/li>\n
      • Pre-grinding wafer preparation<\/li>\n
      • Pre-polishing wafer preparation<\/li>\n<\/ul>\n

        For specific materials, final process feasibility should be evaluated according to material properties, workpiece geometry, target thickness, tolerance and downstream processing requirements.<\/p>\n

        \n

        Valfria konfigurationer<\/h1>\n

        Available optional items listed in the technical configuration include:<\/p>\n

        SECS II communication<\/p>\n

        Cooling water chiller<\/p>\n

        Workpiece clamping temperature adjustment<\/p>\n

        and other process-related configurations.<\/p>\n

        These functions can be selected according to the customer’s production line and factory automation requirements.<\/p>\n

        \n

        Varf\u00f6r v\u00e4lja ZMSH<\/h1>\n

        ZMSH provides semiconductor materials, wafers, precision components and related processing solutions.<\/p>\n

        For a wafer slicing project, the equipment itself is only one part of the process.<\/p>\n

        A complete technical evaluation should normally consider:<\/p>\n

        Material \u2192 Ingot Size \u2192 Cutting Wire \u2192 Target Thickness \u2192 Thickness Tolerance \u2192 Cutting Condition \u2192 Surface Condition \u2192 Grinding \u2192 Lapping \u2192 Polishing<\/p>\n

        Customers can therefore provide both the raw material condition and final wafer requirements when requesting a quotation.<\/p>\n

        This helps ensure the recommended equipment configuration matches the actual semiconductor processing process rather than only the nominal machine specifications.<\/p>\n

        \n

        Uppgifter som kr\u00e4vs f\u00f6r offert<\/h1>\n

        Please provide the following information when requesting a quotation:<\/p>\n

          \n
        1. Material type<\/li>\n
        2. Workpiece or ingot dimensions<\/li>\n
        3. Target wafer dimensions<\/li>\n
        4. Target thickness<\/li>\n
        5. Thickness tolerance<\/li>\n
        6. Quantity per batch<\/li>\n
        7. Required production capacity<\/li>\n
        8. Wire diameter, if specified<\/li>\n
        9. Cutting accuracy requirement<\/li>\n
        10. Required surface condition after slicing<\/li>\n
        11. Factory power supply<\/li>\n
        12. Cooling-water conditions<\/li>\n
        13. Required SECS II or other automation interfaces<\/li>\n<\/ol>\n

          ZMSH can evaluate the appropriate equipment configuration based on these parameters.<\/p>\n

          \n

          VANLIGA FR\u00c5GOR<\/h1>\n

          What is the maximum wire speed?<\/h3>\n

          The maximum specified cutting wire speed is 2200 m\/min.<\/p>\n

          What wire diameter does the machine support?<\/h3>\n

          The specified range is 0.014\u20130.10 mm.<\/p>\n

          What is the cutting accuracy?<\/h3>\n

          The supplied equipment documentation specifies cutting accuracy of \u00b10.01 mm.<\/p>\n

          What is the minimum slicing thickness?<\/h3>\n

          The documented minimum slicing thickness is less than 0.05 mm, subject to suitable cutting conditions.<\/p>\n

          Does the equipment detect wire breakage?<\/h3>\n

          Yes. Wire-break detection is included in the equipment specification.<\/p>\n

          Can the system connect to semiconductor factory automation?<\/h3>\n

          SECS II communication is listed as an optional configuration.<\/p>","protected":false},"excerpt":{"rendered":"

          High precision wire saw machine for semiconductor wafer slicing, featuring up to 2200 m\/min wire speed, 0.014\u20130.10 mm fine-wire compatibility, 0\u201315 N tension control, hydraulic clamping and precision servo feed. Suitable for semiconductor wafer cutting and thin slicing applications.<\/p>\n

          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