![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ti-Cu-Metal-Coated-Silicon-Wafer-Titanium-Copper-Sputtered-Wafer-for-MEMS-Microelectronics-1-300x300.png\")
Ti\/Cu Metal-Coated Silicon Wafer \u00e4r utformad som ett standardledande och processkompatibelt substrat f\u00f6r avancerad forskning och industriella applikationer. Genom att kombinera kiselskivans teknik med tunnfilmsbel\u00e4ggning av metall ger den en stabil plattform f\u00f6r elektriska, kemiska och mikrofabrikationsprocesser.<\/p>\n
Strukturen i Ti\/Cu-bel\u00e4ggningssystemet garanterar b\u00e5de mekanisk tillf\u00f6rlitlighet och funktionell ledningsf\u00f6rm\u00e5ga. Det \u00e4r s\u00e4rskilt l\u00e4mpligt f\u00f6r applikationer som kr\u00e4ver tillf\u00f6rlitliga metallgr\u00e4nssnitt, enhetlig ytledningsf\u00f6rm\u00e5ga och kompatibilitet med standardtekniker f\u00f6r halvledarbearbetning.<\/p>\n
Produkten st\u00f6der anpassning av waferstorlek, substrattyp och filmtjocklek, vilket g\u00f6r den l\u00e4mplig f\u00f6r b\u00e5de sm\u00e5skaliga forskningsexperiment och pilotproduktionsmilj\u00f6er.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ti-Cu-Metal-Coated-Silicon-Wafer-Titanium-Copper-Sputtered-Wafer-for-MEMS-Microelectronics-4-300x300.png\")
Viktiga funktioner<\/strong><\/span><\/h2>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ti-Cu-Metal-Coated-Silicon-Wafer-Titanium-Copper-Sputtered-Wafer-for-MEMS-Microelectronics-3-300x300.png\")
Typisk struktur<\/strong><\/span><\/h2>\nSubstrat + Adhesionsskikt av titan + Ledande skikt av koppar<\/strong><\/p>\n Ti-skiktet fungerar som ett gr\u00e4nssnittsbindande skikt mellan substratet och kopparfilmen, vilket s\u00e4kerst\u00e4ller strukturell stabilitet. Cu-skiktet ger en funktionellt ledande yta f\u00f6r elektriska applikationer och processapplikationer.<\/p>\n Den metallbelagda Ti\/Cu-wafern tillverkas med hj\u00e4lp av magnetronf\u00f6rstoftningsteknik i vakuum. F\u00f6rst deponeras ett titanskikt p\u00e5 den rengjorda kiselytan f\u00f6r att f\u00f6rb\u00e4ttra vidh\u00e4ftningen. Sedan deponeras ett kopparskikt ovanp\u00e5 titanfilmen f\u00f6r att bilda en enhetlig ledande yta.<\/p>\n F\u00f6r applikationer som kr\u00e4ver tjockare kopparfilmer kan det sputtrade kopparskiktet anv\u00e4ndas som ett fr\u00f6skikt f\u00f6r elektropl\u00e4tering, vilket m\u00f6jligg\u00f6r ytterligare metalltillv\u00e4xt f\u00f6r att uppn\u00e5 tjocklek p\u00e5 mikroniv\u00e5 samtidigt som stark vidh\u00e4ftning bibeh\u00e5lls.<\/p>\n Denna kombinationsprocess garanterar b\u00e5de h\u00f6g filmkvalitet och flexibel funktionell expansion.<\/p>\n J\u00e4mf\u00f6rt med direkt kopparbel\u00e4ggning p\u00e5 kisel ger Ti\/Cu-strukturen:<\/p>\n Detta g\u00f6r den till en mer tillf\u00f6rlitlig l\u00f6sning f\u00f6r b\u00e5de forskningslaboratorier och industriella FoU-milj\u00f6er.<\/p>\n F1: Varf\u00f6r anv\u00e4nds titan under kopparbel\u00e4ggning?<\/strong> Q2: Kan koppartjockleken \u00f6kas?<\/strong> F3: Kan b\u00e5da sidorna av wafern bel\u00e4ggas?<\/strong> Q4: Vilka substratalternativ finns tillg\u00e4ngliga?<\/strong> Ti\/Cu Metal-Coated Silicon Wafer \u00e4r en h\u00f6gkvalitativ funktionell wafer som framst\u00e4lls genom att ett vidh\u00e4ftande titanskikt och ett ledande kopparskikt deponeras p\u00e5 ett kiselsubstrat med hj\u00e4lp av magnetronsputterteknik. Titanskiktet f\u00f6rb\u00e4ttrar filmens vidh\u00e4ftning och stabilitet, medan kopparskiktet ger utm\u00e4rkt elektrisk ledningsf\u00f6rm\u00e5ga. Denna produkt anv\u00e4nds ofta inom mikroelektronik, MEMS-tillverkning, laboratorieforskning och utveckling av tunnfilmsprocesser.<\/p>","protected":false},"featured_media":2428,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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\nSpecifikationer<\/strong><\/span><\/h2>\n
\n\n\n\n
\n \nF\u00f6rem\u00e5l<\/th>\n Beskrivning<\/th>\n<\/tr>\n<\/thead>\n \n Wafer-storlek<\/td>\n 2\u2033, 4\u2033, 6\u2033, 8\u2033, anpassade storlekar<\/td>\n<\/tr>\n \n Substratmaterial<\/td>\n Kisel, kvarts, BF33-glas (tillval)<\/td>\n<\/tr>\n \n Kristallorientering<\/td>\n , , etc.<\/td>\n<\/tr>\n \n Resistivitet<\/td>\n L\u00e5g \/ Medium \/ H\u00f6g (anpassningsbar)<\/td>\n<\/tr>\n \n Ti Tjocklek<\/td>\n 10-50 nm (typiskt intervall)<\/td>\n<\/tr>\n \n Cu Tjocklek<\/td>\n 50 nm - 1 \u00b5m (sputtrad), tjockare via elektropl\u00e4tering<\/td>\n<\/tr>\n \n Bel\u00e4ggningsmetod<\/td>\n Magnetronf\u00f6rstoftning<\/td>\n<\/tr>\n \n Bel\u00e4ggningssida<\/td>\n Enkelsidig eller dubbelsidig<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ti-Cu-Metal-Coated-Silicon-Wafer-Titanium-Copper-Sputtered-Wafer-for-MEMS-Microelectronics-2-300x300.png\")
Tillverkningsprocess<\/strong><\/span><\/h2>\n
\nTill\u00e4mpningar<\/strong><\/span><\/h2>\n
\n
\nF\u00f6rdelar j\u00e4mf\u00f6rt med enkel metallbel\u00e4ggning<\/strong><\/span><\/h2>\n
\n
\nVANLIGA FR\u00c5GOR<\/strong><\/span><\/h2>\n
Titan fungerar som ett vidh\u00e4ftningsskikt som f\u00f6rb\u00e4ttrar bindningen mellan koppar- och kiselsubstrat, vilket f\u00f6rhindrar delaminering under bearbetning och anv\u00e4ndning.<\/p>\n
Ja. Sputtrad koppar kan anv\u00e4ndas som startlager f\u00f6r elektropl\u00e4tering f\u00f6r att uppn\u00e5 tjockare metallskikt beroende p\u00e5 applikationskrav.<\/p>\n
Ja, alternativ med enkelsidig eller dubbelsidig bel\u00e4ggning finns tillg\u00e4ngliga p\u00e5 beg\u00e4ran.<\/p>\n
Standardkisel \u00e4r vanligast, men kvarts- och glassubstrat finns ocks\u00e5 tillg\u00e4ngliga f\u00f6r speciella optiska eller kemiska till\u00e4mpningar.<\/p>","protected":false},"excerpt":{"rendered":"