{"id":2327,"date":"2026-04-21T06:21:20","date_gmt":"2026-04-21T06:21:20","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2327"},"modified":"2026-04-21T06:21:21","modified_gmt":"2026-04-21T06:21:21","slug":"wafer-thinning-system-precision-back-grinding-equipment-for-si-sic-and-4-to-12-inch-semiconductor-wafers","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/sv\/product\/wafer-thinning-system-precision-back-grinding-equipment-for-si-sic-and-4-to-12-inch-semiconductor-wafers\/","title":{"rendered":"Wafer Thinning System Precision Back Grinding Equipment f\u00f6r Si SiC och 4 till 12 tums halvledarwafers"},"content":{"rendered":"

\"WaferWafer Thinning System Precision Back Grinding Equipment \u00e4r en l\u00f6sning f\u00f6r bearbetning av wafers med h\u00f6g noggrannhet som \u00e4r utformad f\u00f6r avancerad halvledartillverkning. Den st\u00f6der 4-tums till 12-tums wafers, inklusive kisel (Si), kiselkarbid (SiC), galliumarsenid (GaAs), safir och andra spr\u00f6da sammansatta halvledarmaterial.<\/p>\n

Systemet \u00e4r konstruerat f\u00f6r ultraprecis gallring av wafers baksida, vilket m\u00f6jligg\u00f6r tjockleksreduktion till mikron- och submikronniv\u00e5er samtidigt som utm\u00e4rkt ytintegritet bibeh\u00e5lls. Det spelar en avg\u00f6rande roll vid tillverkning av avancerade f\u00f6rpackningar, kraftelektronik, MEMS och sammansatta halvledare.<\/p>\n

Genom att integrera mekanisk design med h\u00f6g styvhet, precisionsstyrning av Z-axeln och tjockleks\u00f6vervakning i realtid s\u00e4kerst\u00e4ller utrustningen stabil och repeterbar bearbetningsprestanda f\u00f6r produktion i industriell skala.<\/p>\n

\n

Viktiga tekniska egenskaper<\/span><\/h2>\n

Tjocklekskontroll med h\u00f6g precision<\/span><\/h3>\n
    \n
  • Tjockleksnoggrannhet: \u00b11 \u03bcm<\/li>\n
  • Total tjockleksvariation (TTV): \u22642 \u03bcm<\/li>\n
  • Avancerade modeller uppn\u00e5r submikronkontroll upp till \u00b10,5 \u03bcm<\/li>\n<\/ul>\n

    \"\"Bred materialkompatibilitet<\/span><\/h3>\n

    St\u00f6der ett brett utbud av halvledare och spr\u00f6da material:<\/p>\n

      \n
    • Kisel (Si)<\/li>\n
    • Kiselkarbid (SiC)<\/li>\n
    • Galliumarsenid (GaAs)<\/li>\n
    • Safir (Al\u2082O\u2083)<\/li>\n
    • Andra sammansatta halvledarskivor<\/li>\n<\/ul>\n

      Kompatibilitet med waferstorlek<\/span><\/h3>\n
        \n
      • 4-tums \/ 6-tums \/ 8-tums \/ 10-tums \/ 12-tums r\u00e5n<\/li>\n
      • Flexibel hantering av b\u00e5de standard- och kundanpassade substrat<\/li>\n<\/ul>\n

        Mekaniskt system med h\u00f6g stabilitet<\/span><\/h3>\n
          \n
        • Luftlagrad spindel med h\u00f6g styvhet<\/li>\n
        • Precisionsslipningsplattform med l\u00e5g vibration<\/li>\n
        • Importerad kulskruv + linj\u00e4rt styrsystem<\/li>\n
        • Servomotorstyrning med h\u00f6g precision (uppl\u00f6sning p\u00e5 0,1 \u03bcm)<\/li>\n<\/ul>\n

          Avancerat kylsystem<\/span><\/h3>\n
            \n
          • Vattenkylt spindelsystem s\u00e4kerst\u00e4ller termisk stabilitet<\/li>\n
          • F\u00f6rhindrar deformation under h\u00f6ghastighetsslipning<\/li>\n<\/ul>\n
            \n

            Systemkonfiguration<\/span><\/h2>\n

            Systemet f\u00f6r gallring av wafers integrerar flera funktionella moduler:<\/p>\n

            1. Modul f\u00f6r precisionsslipning<\/span><\/h3>\n

            Utf\u00f6r kontrollerad materialavverkning med h\u00f6g ytj\u00e4mnhet.<\/p>\n

            2. Precisionskontrollsystem f\u00f6r Z-axeln<\/span><\/h3>\n

            M\u00f6jligg\u00f6r ultrafin vertikal justering f\u00f6r j\u00e4mn wafertjocklek.<\/p>\n

            3. System f\u00f6r m\u00e4tning av tjocklek<\/span><\/h3>\n

            Kontakt-\/kontaktl\u00f6s m\u00e4tning i realtid s\u00e4kerst\u00e4ller processtabilitet.<\/p>\n

            4. Chuck f\u00f6r vakuumskivor<\/span><\/h3>\n

            S\u00e4ker fixering av wafers, inklusive anpassade l\u00f6sningar f\u00f6r oregelbundna wafers.<\/p>\n

            5. Automationskontrollsystem<\/span><\/h3>\n
              \n
            • Full-auto \/ Semi-auto driftl\u00e4gen<\/li>\n
            • Registrering av driftlogg<\/li>\n
            • Receptbaserad processtyrning<\/li>\n<\/ul>\n
              \n

              \"\" Kapacitet f\u00f6r bearbetning<\/span><\/h2>\n

              Systemet \u00e4r konstruerat f\u00f6r h\u00f6gpresterande baksidesbearbetning av wafers:<\/p>\n

                \n
              • Slipning av kiselskivor<\/li>\n
              • Gallring av SiC-wafers f\u00f6r kraftelektronik<\/li>\n
              • Gallring av GaN- och GaAs-substrat<\/li>\n
              • Precisionstunnning av safirskivor<\/li>\n
              • F\u00f6rberedelse av ultratunna wafers f\u00f6r 3D-f\u00f6rpackning<\/li>\n<\/ul>\n
                \n

                Till\u00e4mpningar<\/span><\/h2>\n

                1. Krafthalvledarkomponenter<\/span><\/h3>\n

                Anv\u00e4nds i SiC MOSFETs, IGBTs och h\u00f6gsp\u00e4nningsenheter som kr\u00e4ver ultratunna wafers.<\/p>\n

                \"\"2. Avancerade f\u00f6rpackningar<\/span><\/h3>\n

                St\u00f6der wafer-tunning f\u00f6r:<\/p>\n

                  \n
                • F\u00f6rpackning av flip-chip<\/li>\n
                • 2,5D \/ 3D IC-integration<\/li>\n
                • TSV-processer (Through Silicon Via)<\/li>\n<\/ul>\n

                  3. Sammansatta halvledare<\/span><\/h3>\n

                  Till\u00e4mplig f\u00f6r tillverkning av GaN-, GaAs- och InP-enheter.<\/p>\n

                  4. LED och optoelektronik<\/span><\/h3>\n

                  Safir- och compoundskivor f\u00f6r LED-chips och optiska enheter.<\/p>\n

                  \n

                  F\u00f6rdelar<\/span><\/h2>\n
                    \n
                  • Mogen och stabil teknik f\u00f6r gallring av wafers<\/li>\n
                  • Slipningssystem f\u00f6r inmatning med h\u00f6g precision<\/li>\n
                  • Utm\u00e4rkt kontroll av ytj\u00e4mnhet<\/li>\n
                  • H\u00f6g UPH (upp till 30 wafers\/timme f\u00f6r standardprocesser)<\/li>\n
                  • H\u00f6g anpassningsf\u00f6rm\u00e5ga f\u00f6r spr\u00f6da och h\u00e5rda material<\/li>\n
                  • Fullt automatiserad processintegration<\/li>\n<\/ul>\n
                    \n

                    Prestationsh\u00f6jdpunkter<\/span><\/h2>\n
                      \n
                    • Minsta uppl\u00f6sning: 0,1 \u03bcm\/s Styrning av Z-axel<\/li>\n
                    • Tjocklekens enhetlighet: \u22641-2 \u03bcm TTV<\/li>\n
                    • H\u00f6ghastighetsspindel med extremt l\u00e5g vibration<\/li>\n
                    • \u00d6vervakning och loggning av processer i realtid<\/li>\n
                    • Kompatibel med b\u00e5de FoU- och massproduktionsmilj\u00f6er<\/li>\n<\/ul>\n
                      \n

                      Anpassningsalternativ<\/span><\/h2>\n

                      Vi erbjuder flexibel anpassning f\u00f6r olika industriella behov:<\/p>\n

                        \n
                      • Kundanpassade waferchuckar (oregelbundna former)<\/li>\n
                      • Ut\u00f6kat m\u00e4tomr\u00e5de f\u00f6r tjocklek (upp till 40 mm)<\/li>\n
                      • Anpassning av processrecept<\/li>\n
                      • Automationsintegration med utrustning uppstr\u00f6ms\/nedstr\u00f6ms<\/li>\n<\/ul>\n
                        \n

                        VANLIGA FR\u00c5GOR<\/span><\/h2>\n

                        Q1: Kan detta system bearbeta SiC-wafers?<\/span><\/h3>\n

                        Ja, den \u00e4r speciellt optimerad f\u00f6r gallring av SiC-wafers och slipning av baksidan, l\u00e4mplig f\u00f6r applikationer inom kraftelektronik.<\/p>\n

                        Q2: Vad \u00e4r den uppn\u00e5eliga tjockleksnoggrannheten?<\/span><\/h3>\n

                        Standardmodeller uppn\u00e5r \u00b11 \u03bcm, och avancerade konfigurationer kan n\u00e5 \u00b10,5 \u03bcm med TTV \u22641 \u03bcm.<\/p>\n

                        F3: St\u00f6djer den fullst\u00e4ndig automatisering?<\/span><\/h3>\n

                        Ja, b\u00e5de hel- och halvautomatiska l\u00e4gen finns tillg\u00e4ngliga beroende p\u00e5 produktionskrav.<\/p>","protected":false},"excerpt":{"rendered":"

                        Wafer Thinning System Precision Back Grinding Equipment \u00e4r en l\u00f6sning f\u00f6r bearbetning av wafers med h\u00f6g noggrannhet som \u00e4r utformad f\u00f6r avancerad halvledartillverkning. Den st\u00f6der 4-tums till 12-tums wafers, inklusive kisel (Si), kiselkarbid (SiC), galliumarsenid (GaAs), safir och andra spr\u00f6da sammansatta halvledarmaterial. Detta system \u00e4r konstruerat f\u00f6r ultraexakt gallring av wafers baksida, vilket m\u00f6jligg\u00f6r tjockleksminskning till mikron- och submikronniv\u00e5er samtidigt som utm\u00e4rkt ytintegritet bibeh\u00e5lls.<\/p>","protected":false},"featured_media":2330,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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