{"id":2253,"date":"2026-04-15T05:46:37","date_gmt":"2026-04-15T05:46:37","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2253"},"modified":"2026-04-20T01:22:42","modified_gmt":"2026-04-20T01:22:42","slug":"2-inch-quartz-wafer-dsp-ssp-polished-substrate-for-mems-semiconductor-optical-use","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/sv\/product\/2-inch-quartz-wafer-dsp-ssp-polished-substrate-for-mems-semiconductor-optical-use\/","title":{"rendered":"2-tums Quartz Wafer DSP\/SSP Polerat substrat f\u00f6r MEMS, halvledare och optisk anv\u00e4ndning"},"content":{"rendered":"

Produkt\u00f6versikt<\/strong><\/h2>\n

\"2-tumsDen 2-tums kvartsskivan \u00e4r ett substrat av halvledarkvalitet tillverkat av kiseldioxid (SiO\u2082) med h\u00f6g renhet. Den uppn\u00e5r planhet p\u00e5 mikroniv\u00e5 genom precisionsbearbetningstekniker som CNC-sk\u00e4rning och laserpolering. Dessa wafers uppfyller SEMI-standarder och st\u00f6der anpassning av dimensioner och tjocklek (\u00b10,02 mm tolerans), vilket g\u00f6r dem l\u00e4mpliga f\u00f6r optoelektronik, MEMS (Micro-Electro-Mechanical Systems) och halvledaremballage.<\/p>\n

Fuyao erbjuder kundanpassad produktion f\u00f6r icke-standardiserade geometrier, inklusive friformsformer, graderad tjocklek och avancerade ytbehandlingar som antireflexbel\u00e4ggningar (AR) och hydrofoba filmer. Kvalitetskontroll av hela processen s\u00e4kerst\u00e4ller total tjockleksvariation (TTV) <0,005 mm och ytj\u00e4mnhet Ra <1,5 nm. Prototyptillverkning i sm\u00e5 serier (minst 10 enheter) och snabba leveransalternativ finns tillg\u00e4ngliga f\u00f6r tidsk\u00e4nsliga projekt.<\/p>\n

Specifikationer<\/strong><\/h1>\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Parameter<\/th>\nSpecifikation<\/th>\n<\/tr>\n<\/thead>\n
Diameter<\/td>\n2 tum (50,8 mm)<\/td>\n<\/tr>\n
Tjocklek Intervall<\/td>\n0,1 mm - 1,0 mm<\/td>\n<\/tr>\n
Materialets renhet<\/td>\n\u226599,99%<\/td>\n<\/tr>\n
Ytj\u00e4mnhet (Ra)<\/td>\n\u22645 nm<\/td>\n<\/tr>\n
Total tjockleksvariation<\/td>\n\u226410 \u03bcm<\/td>\n<\/tr>\n
Transmittans (@193 nm)<\/td>\n>90%<\/td>\n<\/tr>\n
Koefficient f\u00f6r termisk expansion<\/td>\n~0.55\u00d710-\u2076\/\u00b0C<\/td>\n<\/tr>\n
Mjukg\u00f6rande punkt<\/td>\n~1665\u00b0C<\/td>\n<\/tr>\n
F\u00f6rpackning<\/td>\nRenrum p\u00e5 100 niv\u00e5er<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n
Viktiga egenskaper<\/strong><\/div>\n<\/div>\n

1 Optisk spetskompetens<\/p>\n

    \n
  • \n

    Transmittans \u00f6ver ett brett spektrum: >90% i det ultravioletta omr\u00e5det (185-3500 nm), med \u00f6verl\u00e4gsen kortv\u00e5gig UV-prestanda (185 nm).\"2<\/p>\n<\/li>\n

  • \n

    L\u00e5g termisk expansion: CTE ~0,52\u00d710-\u2076\/\u00b0C (5-35\u00b0C), t\u00e5l l\u00e5ngtidstemperaturer upp till 1100\u00b0C och korttidsexponering upp till 1450\u00b0C.<\/p>\n<\/li>\n<\/ul>\n

    2 Mekanisk och kemisk stabilitet<\/p>\n

      \n
    • \n

      H\u00f6g h\u00e5llfasthet: B\u00f6jh\u00e5llfasthet 2-3\u00d7 h\u00f6gre \u00e4n standardglas, Mohs h\u00e5rdhet 7.<\/p>\n<\/li>\n

    • \n

      Motst\u00e5ndskraft mot korrosion: 30\u00d7 h\u00f6gre syrabest\u00e4ndighet \u00e4n keramik, l\u00e4mplig f\u00f6r tuffa kemiska milj\u00f6er.<\/p>\n<\/li>\n<\/ul>\n

      3 Elektrisk isolering<\/p>\n

        \n
      • \n

        Resistivitet \u00f6ver 10\u00b9\u2078 \u03a9-cm med l\u00e5g dielektrisk f\u00f6rlust vid h\u00f6ga frekvenser, idealisk f\u00f6r RF-kretsar och sensorer.<\/p>\n<\/li>\n<\/ul>\n

        Prim\u00e4ra till\u00e4mpningar<\/strong><\/h1>\n

        1 Halvledartillverkning<\/p>\n

          \n
        • \n

          Substrat f\u00f6r CMOS-bildsensorer och f\u00f6rpackning av RFID-chip, som st\u00f6der WLP (wafer-level packaging) f\u00f6r h\u00f6gre integration.<\/p>\n<\/li>\n

        • \n

          Substrat f\u00f6r MEMS-enheter (t.ex. trycksensorer, accelerometrar) som s\u00e4kerst\u00e4ller strukturell stabilitet f\u00f6r mikrokomponenter.<\/p>\n<\/li>\n<\/ul>\n

          2 Optoelektroniska system<\/p>\n

            \n
          • \n

            UV-laserf\u00f6nster och fiberoptiska kommunikationskopplare som utnyttjar utm\u00e4rkt UV-transmission.<\/p>\n<\/li>\n

          • \n

            Optiska f\u00f6nster f\u00f6r flyg- och rymdindustrin som \u00e4r resistenta mot str\u00e5lning och termisk cykling.<\/p>\n<\/li>\n<\/ul>\n

            3 Medicin och forskning<\/p>\n

              \n
            • \n

              Optiska komponenter f\u00f6r h\u00f6g temperatur f\u00f6r endoskopiska bildsystem.<\/p>\n<\/li>\n

            • \n

              V\u00e4rmebest\u00e4ndiga observationsf\u00f6nster f\u00f6r laboratoriereaktorer.<\/p>\n<\/li>\n<\/ul>\n

              4 specialiserade f\u00f6nsterplattor av kvarts<\/p>\n

                \n
              • \n

                Friformade ytor, asymmetriska \u00f6ppningar, graderad tjocklek.<\/p>\n<\/li>\n

              • \n

                Vinklade f\u00f6nster f\u00f6r att minimera reflektionsf\u00f6rluster.<\/p>\n<\/li>\n

              • \n

                Genomg\u00e5ende f\u00f6nsterh\u00e5l f\u00f6r integrering av flera sensorer.<\/p>\n<\/li>\n

              • \n

                Snabb prototyptillverkning: 3-5 dagar f\u00f6r prover, sm\u00e5 serier p\u00e5 <500 enheter, valfria vakuumbel\u00e4ggningar (AR-bel\u00e4ggningar eller reflekterande bel\u00e4ggningar) f\u00f6r forskning och milit\u00e4ra till\u00e4mpningar.<\/p>\n<\/li>\n<\/ul>\n

                VANLIGA FR\u00c5GOR<\/strong><\/h1>\n

                1 Varf\u00f6r v\u00e4lja 2-tums kvartsskivor?<\/strong>
                2-tums kvartsskivor \u00e4r halvledarkvalitetssubstrat tillverkade av kiseldioxid (SiO\u2082) med h\u00f6g renhet. De uppn\u00e5r planhet p\u00e5 mikroniv\u00e5 med hj\u00e4lp av CNC-precisionssk\u00e4rning och laserpolering. Dessa wafers st\u00f6der anpassning i dimensioner och tjocklek (\u00b10,02 mm) och uppfyller SEMI-standarder, vilket g\u00f6r dem idealiska f\u00f6r optoelektronik, MEMS och halvledarf\u00f6rpackningar.<\/p>\n

                2 Vilka \u00e4r de prim\u00e4ra anv\u00e4ndningsomr\u00e5dena f\u00f6r 2-tums kvartsskivor?<\/strong>
                De anv\u00e4nds fr\u00e4mst inom halvledartillverkning (CMOS-bildsensorer, f\u00f6rpackning av RFID-chip), UV-laserf\u00f6nster, fiberoptiska kommunikationskopplare och optiska komponenter inom flygindustrin. Anpassade ytbehandlingar, t.ex. antireflexbel\u00e4ggningar, f\u00f6rb\u00e4ttrar prestandan i h\u00f6gprecisionssystem.<\/p>","protected":false},"excerpt":{"rendered":"

                Den 2-tums kvartsskivan \u00e4r ett substrat av halvledarkvalitet tillverkat av kiseldioxid (SiO\u2082) med h\u00f6g renhet. Den uppn\u00e5r planhet p\u00e5 mikroniv\u00e5 genom precisionsbearbetningstekniker som CNC-sk\u00e4rning och laserpolering. Dessa wafers uppfyller SEMI-standarder och st\u00f6der anpassning av dimensioner och tjocklek (\u00b10,02 mm tolerans), vilket g\u00f6r dem l\u00e4mpliga f\u00f6r optoelektronik, MEMS (Micro-Electro-Mechanical Systems) och halvledaremballage.<\/p>","protected":false},"featured_media":2272,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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