{"id":2226,"date":"2026-04-15T03:41:10","date_gmt":"2026-04-15T03:41:10","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2226"},"modified":"2026-04-15T04:01:00","modified_gmt":"2026-04-15T04:01:00","slug":"wp-301d-double-side-wafer-grinding-machine-for-6-inch-semiconductor-materials-and-precision-lapping","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/sv\/product\/wp-301d-double-side-wafer-grinding-machine-for-6-inch-semiconductor-materials-and-precision-lapping\/","title":{"rendered":"WP-301D dubbelsidig slipmaskin f\u00f6r 6-tums halvledarmaterial och precisionslappning"},"content":{"rendered":"<p data-start=\"284\" data-end=\"683\"><img fetchpriority=\"high\" decoding=\"async\" class=\"alignright wp-image-2229\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-300x300.png\" alt=\"WP-301D dubbelsidig slipmaskin f\u00f6r 6-tums halvledarmaterial och precisionslappning\" width=\"283\" height=\"283\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1.png 1000w\" sizes=\"(max-width: 283px) 100vw, 283px\" \/>WP-301D Double Side Wafer Grinding Machine \u00e4r ett h\u00f6gprecisionssystem som \u00e4r konstruerat f\u00f6r samtidig dubbelsidig slipning och polering av halvledarwafers och \u00f6mt\u00e5liga material. Med hj\u00e4lp av ett avancerat planetv\u00e4xeldrivet r\u00f6relsesystem m\u00f6jligg\u00f6r maskinen enhetlig materialavverkning p\u00e5 b\u00e5de den \u00f6vre och nedre ytan av wafern, vilket avsev\u00e4rt f\u00f6rb\u00e4ttrar planhet och parallellitet.<\/p>\n<p data-start=\"685\" data-end=\"996\">WP-301D \u00e4r konstruerad f\u00f6r 150 mm (6 tum) wafers och l\u00e4gre och anv\u00e4nds ofta f\u00f6r bearbetning av sammansatta halvledarmaterial som CdZnTe (CZT), HgCdTe (MCT), GaAs, InP och InSb. Dessa material \u00e4r kritiska i applikationer som infrar\u00f6d detektering, optoelektronik och h\u00f6gfrekvensenheter.<\/p>\n<p data-start=\"998\" data-end=\"1200\">Med sin robusta mekaniska struktur, sitt precisionsstyrsystem och sin optimerade spindeldesign garanterar WP-301D h\u00f6g effektivitet, utm\u00e4rkt ytkvalitet och stabil batchbearbetning.<\/p>\n<hr data-start=\"1202\" data-end=\"1205\" \/>\n<h2 data-section-id=\"m7ukan\" data-start=\"1207\" data-end=\"1250\">Viktiga funktioner och tekniska f\u00f6rdelar<\/h2>\n<h3 data-section-id=\"1ggl47b\" data-start=\"1252\" data-end=\"1296\">Dubbelsidig samtidig bearbetning<\/h3>\n<p data-start=\"1297\" data-end=\"1372\">Maskinen bearbetar b\u00e5da sidorna av wafern samtidigt, vilket s\u00e4kerst\u00e4ller:<\/p>\n<ul data-start=\"1373\" data-end=\"1463\">\n<li data-section-id=\"1i7ktds\" data-start=\"1373\" data-end=\"1406\">F\u00f6rb\u00e4ttrad j\u00e4mnhet i tjockleken<\/li>\n<li data-section-id=\"1da8f9g\" data-start=\"1407\" data-end=\"1429\">B\u00e4ttre parallellism<\/li>\n<li data-section-id=\"12e74mo\" data-start=\"1430\" data-end=\"1463\">Minskad total behandlingstid<\/li>\n<\/ul>\n<h3 data-section-id=\"2t7dsg\" data-start=\"1465\" data-end=\"1501\">R\u00f6relsesystem med planetv\u00e4xel<\/h3>\n<p data-start=\"1502\" data-end=\"1689\">Det integrerade sol- och ringv\u00e4xelsystemet kan arbeta antingen synkront eller oberoende av varandra, vilket m\u00f6jligg\u00f6r flexibel processtyrning och optimerade slipv\u00e4gar f\u00f6r olika material.<\/p>\n<h3 data-section-id=\"dbg2ti\" data-start=\"1691\" data-end=\"1728\">Spindelsystem med h\u00f6g precision<\/h3>\n<p data-start=\"1729\" data-end=\"1901\">WP-301D \u00e4r utrustad med en inbyggd spindel med h\u00f6g precision som garanterar stabil rotation och minimal vibration, vilket \u00e4r avg\u00f6rande f\u00f6r att uppn\u00e5 j\u00e4mn ytkvalitet.<\/p>\n<h3 data-section-id=\"bbwmxj\" data-start=\"1903\" data-end=\"1944\">Tryckkontrollsystem i realtid<\/h3>\n<p data-start=\"1945\" data-end=\"2030\">Maskinen har ett avancerat tryckkontrollsystem med sluten slinga, vilket g\u00f6r det m\u00f6jligt:<\/p>\n<ul data-start=\"2031\" data-end=\"2200\">\n<li data-section-id=\"5pkops\" data-start=\"2031\" data-end=\"2077\">Noggrann tryckjustering (0,1 - 50 kg)<\/li>\n<li data-section-id=\"18clroc\" data-start=\"2078\" data-end=\"2200\">\u00d6vervakning i realtid och automatisk korrigering<br data-start=\"2125\" data-end=\"2128\" \/>Detta garanterar en j\u00e4mn materialavverkning och f\u00f6rhindrar \u00f6verpolering.<\/li>\n<\/ul>\n<h3 data-section-id=\"mqy6u6\" data-start=\"2202\" data-end=\"2237\">Flytande \u00f6vre plattkonstruktion<\/h3>\n<p data-start=\"2238\" data-end=\"2440\">Den \u00f6vre plattan har en flytande anslutningsstruktur som s\u00e4kerst\u00e4ller att den f\u00f6rblir parallell med den nedre plattan under bearbetningen. Detta f\u00f6rb\u00e4ttrar waferns planhet avsev\u00e4rt och minskar tjockleksvariationen.<\/p>\n<h2 data-section-id=\"8lu2ky\" data-start=\"2447\" data-end=\"2477\">Tekniska specifikationer<\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2479\" data-end=\"2829\">\n<thead data-start=\"2479\" data-end=\"2503\">\n<tr data-start=\"2479\" data-end=\"2503\">\n<th class=\"\" data-start=\"2479\" data-end=\"2486\" data-col-size=\"sm\">F\u00f6rem\u00e5l<\/th>\n<th class=\"\" data-start=\"2486\" data-end=\"2503\" data-col-size=\"sm\">Specifikation<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2527\" data-end=\"2829\">\n<tr data-start=\"2527\" data-end=\"2570\">\n<td data-start=\"2527\" data-end=\"2544\" data-col-size=\"sm\">Storlek p\u00e5 arbetsstycke<\/td>\n<td data-start=\"2544\" data-end=\"2570\" data-col-size=\"sm\">Upp till \u00d8150 mm (6 tum)<\/td>\n<\/tr>\n<tr data-start=\"2571\" data-end=\"2605\">\n<td data-start=\"2571\" data-end=\"2591\" data-col-size=\"sm\">L\u00e4gre hastighet p\u00e5 plattan<\/td>\n<td data-start=\"2591\" data-end=\"2605\" data-col-size=\"sm\">0 - 30 varv per minut<\/td>\n<\/tr>\n<tr data-start=\"2606\" data-end=\"2658\">\n<td data-start=\"2606\" data-end=\"2624\" data-col-size=\"sm\">Slipmetod<\/td>\n<td data-start=\"2624\" data-end=\"2658\" data-col-size=\"sm\">Dubbelsidig planetarisk slipning<\/td>\n<\/tr>\n<tr data-start=\"2659\" data-end=\"2683\">\n<td data-start=\"2659\" data-end=\"2678\" data-col-size=\"sm\">Transport\u00f6r Antal<\/td>\n<td data-start=\"2678\" data-end=\"2683\" data-col-size=\"sm\">5<\/td>\n<\/tr>\n<tr data-start=\"2684\" data-end=\"2716\">\n<td data-start=\"2684\" data-end=\"2701\" data-col-size=\"sm\">Tryckomr\u00e5de<\/td>\n<td data-start=\"2701\" data-end=\"2716\" data-col-size=\"sm\">0,1 - 50 kg<\/td>\n<\/tr>\n<tr data-start=\"2717\" data-end=\"2753\">\n<td data-start=\"2717\" data-end=\"2734\" data-col-size=\"sm\">Plattans material<\/td>\n<td data-start=\"2734\" data-end=\"2753\" data-col-size=\"sm\">Glas \/ keramik<\/td>\n<\/tr>\n<tr data-start=\"2754\" data-end=\"2800\">\n<td data-start=\"2754\" data-end=\"2775\" data-col-size=\"sm\">Maskinens m\u00e5tt<\/td>\n<td data-start=\"2775\" data-end=\"2800\" data-col-size=\"sm\">1572 \u00d7 1053 \u00d7 2533 mm<\/td>\n<\/tr>\n<tr data-start=\"2801\" data-end=\"2829\">\n<td data-start=\"2801\" data-end=\"2810\" data-col-size=\"sm\">Vikt<\/td>\n<td data-start=\"2810\" data-end=\"2829\" data-col-size=\"sm\">Cirka 2300 kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<hr data-start=\"2831\" data-end=\"2834\" \/>\n<h2 data-section-id=\"13yq5fc\" data-start=\"2836\" data-end=\"2859\">Arbetsprincip<\/h2>\n<p data-start=\"2903\" data-end=\"3050\">WP-301D arbetar med en planetarisk r\u00f6relsemekanism d\u00e4r wafers placeras i h\u00e5llare som \u00e4r placerade mellan den \u00f6vre och den nedre plattan.<\/p>\n<p data-start=\"3052\" data-end=\"3069\">Under drift:<\/p>\n<ul data-start=\"3071\" data-end=\"3205\">\n<li data-section-id=\"307xpo\" data-start=\"3071\" data-end=\"3115\">Den nedre plattan roterar kontinuerligt<\/li>\n<li data-section-id=\"155dzsx\" data-start=\"3116\" data-end=\"3156\">Solv\u00e4xeln driver medbringarna<\/li>\n<li data-section-id=\"1h7nv9d\" data-start=\"3157\" data-end=\"3205\">Ringv\u00e4xeln styr rotationsr\u00f6relsen<\/li>\n<\/ul>\n<p data-start=\"3207\" data-end=\"3357\">Denna kombination skapar en komplex relativ r\u00f6relse mellan wafern och polerplattorna, vilket ger en j\u00e4mn materialavverkning \u00f6ver b\u00e5da ytorna.<\/p>\n<p data-start=\"3359\" data-end=\"3527\">Samtidigt uppr\u00e4tth\u00e5ller tryckkontrollsystemet en j\u00e4mn kraft, medan den flytande \u00f6vre plattan anpassar sig dynamiskt f\u00f6r att uppr\u00e4tth\u00e5lla parallell kontakt. Detta resulterar i:<\/p>\n<ul data-start=\"3529\" data-end=\"3598\">\n<li data-section-id=\"5m7g9e\" data-start=\"3529\" data-end=\"3546\">H\u00f6g planhet<\/li>\n<li data-section-id=\"1uescvu\" data-start=\"3547\" data-end=\"3568\">Enhetlig tjocklek<\/li>\n<li data-section-id=\"19qiivl\" data-start=\"3569\" data-end=\"3598\">Minimala skador under markytan<\/li>\n<\/ul>\n<hr data-start=\"3600\" data-end=\"3603\" \/>\n<h2 data-section-id=\"4t5b8m\" data-start=\"3605\" data-end=\"3623\"><img decoding=\"async\" class=\"size-medium wp-image-2176 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-300x300.webp\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-768x768.webp 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3.webp 800w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Till\u00e4mpningar<\/h2>\n<p data-start=\"3625\" data-end=\"3684\">WP-301D dubbelsidig slipmaskin anv\u00e4nds ofta i..:<\/p>\n<ul data-start=\"3686\" data-end=\"3896\">\n<li data-section-id=\"lsdmsu\" data-start=\"3686\" data-end=\"3729\">Bearbetning av halvledarskivor av sammansatta halvledare<\/li>\n<li data-section-id=\"1re9cdn\" data-start=\"3730\" data-end=\"3763\">Infrar\u00f6da material (CZT, MCT)<\/li>\n<li data-section-id=\"1kwz9qu\" data-start=\"3764\" data-end=\"3801\">III-V-material (GaAs, InP, InSb)<\/li>\n<li data-section-id=\"qagg2f\" data-start=\"3802\" data-end=\"3849\">Optiska substrat och precisionskomponenter<\/li>\n<li data-section-id=\"ir3gdc\" data-start=\"3850\" data-end=\"3896\">Forskningslaboratorier och serieproduktion<\/li>\n<\/ul>\n<p data-start=\"3898\" data-end=\"4021\">Den \u00e4r s\u00e4rskilt l\u00e4mplig f\u00f6r \u00f6mt\u00e5liga material p\u00e5 6 tum och l\u00e4gre, d\u00e4r precision och ytintegritet \u00e4r avg\u00f6rande.<\/p>\n<hr data-start=\"4023\" data-end=\"4026\" \/>\n<h2 data-section-id=\"1116wfg\" data-start=\"4028\" data-end=\"4049\"><img decoding=\"async\" class=\"size-medium wp-image-2122 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Centrala f\u00f6rdelar<\/h2>\n<ul data-start=\"4051\" data-end=\"4440\">\n<li data-section-id=\"1ar7oz7\" data-start=\"4051\" data-end=\"4131\">H\u00f6g effektivitet<br data-start=\"4072\" data-end=\"4075\" \/>Dubbelsidig bearbetning minskar den totala bearbetningstiden<\/li>\n<li data-section-id=\"1wr2j5g\" data-start=\"4133\" data-end=\"4202\">H\u00f6g precision<br data-start=\"4153\" data-end=\"4156\" \/>S\u00e4kerst\u00e4ller utm\u00e4rkt planhet och parallellitet<\/li>\n<li data-section-id=\"esn72i\" data-start=\"4204\" data-end=\"4283\">Processtabilitet<br data-start=\"4227\" data-end=\"4230\" \/>Sluten tryckreglering f\u00f6rb\u00e4ttrar j\u00e4mnheten<\/li>\n<li data-section-id=\"1crbhdt\" data-start=\"4285\" data-end=\"4356\">Flexibel drift<br data-start=\"4309\" data-end=\"4312\" \/>Oberoende eller synkroniserad v\u00e4xelstyrning<\/li>\n<li data-section-id=\"1hbjrp7\" data-start=\"4358\" data-end=\"4440\">Optimerad f\u00f6r \u00f6mt\u00e5liga material<br data-start=\"4395\" data-end=\"4398\" \/>Minimerar p\u00e5frestningar och f\u00f6rhindrar sprickbildning<\/li>\n<\/ul>\n<hr data-start=\"4442\" data-end=\"4445\" \/>\n<h2 data-section-id=\"w1cnyx\" data-start=\"4447\" data-end=\"4456\">VANLIGA FR\u00c5GOR<\/h2>\n<p data-start=\"4458\" data-end=\"4662\">F1: Vad \u00e4r den st\u00f6rsta f\u00f6rdelen med dubbelsidig slipning?<br data-start=\"4517\" data-end=\"4520\" \/>A: Den m\u00f6jligg\u00f6r samtidig bearbetning av b\u00e5da waferytorna, vilket f\u00f6rb\u00e4ttrar planhet, parallellitet och effektivitet j\u00e4mf\u00f6rt med enkelsidig slipning.<\/p>\n<p data-start=\"4664\" data-end=\"4820\">Q2: Vilka material kan bearbetas?<br data-start=\"4704\" data-end=\"4707\" \/>A: Maskinen \u00e4r l\u00e4mplig f\u00f6r CZT, MCT, GaAs, InP, InSb och andra mjuka och spr\u00f6da halvledarmaterial.<\/p>\n<p data-start=\"4822\" data-end=\"4924\">F3: Vilken wafer-storlek st\u00f6der WP-301D?<br data-start=\"4871\" data-end=\"4874\" \/>A: Den st\u00f6der wafers upp till 150 mm (6 tum).<\/p>","protected":false},"excerpt":{"rendered":"<p>WP-301D Double Side Wafer Grinding Machine \u00e4r ett h\u00f6gprecisionssystem som \u00e4r konstruerat f\u00f6r samtidig dubbelsidig slipning och polering av halvledarwafers och \u00f6mt\u00e5liga material. Med hj\u00e4lp av ett avancerat planetv\u00e4xeldrivet r\u00f6relsesystem m\u00f6jligg\u00f6r maskinen enhetlig materialavverkning p\u00e5 b\u00e5de den \u00f6vre och nedre ytan av wafern, vilket avsev\u00e4rt f\u00f6rb\u00e4ttrar planhet och parallellitet.<\/p>","protected":false},"featured_media":2229,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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