{"id":2215,"date":"2026-04-15T02:54:20","date_gmt":"2026-04-15T02:54:20","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2215"},"modified":"2026-04-15T02:57:45","modified_gmt":"2026-04-15T02:57:45","slug":"wdp-1240-series-dry-polishing-machine","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/sv\/product\/wdp-1240-series-dry-polishing-machine\/","title":{"rendered":"WDP-1240-serien torrpolermaskin f\u00f6r avlastning och bearbetning av baksidor p\u00e5 300 mm wafers"},"content":{"rendered":"<p data-start=\"281\" data-end=\"650\"><img fetchpriority=\"high\" decoding=\"async\" class=\"alignright wp-image-2217\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-300x300.png\" alt=\"WDP-1240-serien torrpolermaskin f\u00f6r avlastning och bearbetning av baksidor p\u00e5 300 mm wafers\" width=\"290\" height=\"290\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing.png 1000w\" sizes=\"(max-width: 290px) 100vw, 290px\" \/>WDP-1240 Series Dry Polishing Machine \u00e4r ett avancerat precisionssystem som utvecklats f\u00f6r avsp\u00e4nning av waferbaksidan och borttagning av skadade skikt vid halvledartillverkning. Utrustningen \u00e4r speciellt utformad f\u00f6r bearbetning av 300 mm wafers och anv\u00e4nder en torrpoleringsprocess f\u00f6r att uppn\u00e5 h\u00f6gkvalitativ ytbehandling samtidigt som milj\u00f6p\u00e5verkan minimeras.<\/p>\n<p data-start=\"652\" data-end=\"959\">Detta system \u00e4r s\u00e4rskilt l\u00e4mpligt f\u00f6r avancerade f\u00f6rpackningsapplikationer d\u00e4r wafertunning och sp\u00e4nningskontroll \u00e4r kritiska. Genom att effektivt avl\u00e4gsna skadelager under ytan som orsakats av slipningsprocesser bidrar WDP-1240 till att f\u00f6rb\u00e4ttra waferintegriteten, minska skevheten och f\u00f6rb\u00e4ttra den mekaniska h\u00e5llfastheten.<\/p>\n<p data-start=\"961\" data-end=\"1182\">J\u00e4mf\u00f6rt med traditionella v\u00e5tpoleringssystem eliminerar den torra processen slurryrelaterade f\u00f6roreningar och minskar kraven p\u00e5 avfallshantering, vilket g\u00f6r den till en mer milj\u00f6v\u00e4nlig och kostnadseffektiv l\u00f6sning.<\/p>\n<hr data-start=\"1184\" data-end=\"1187\" \/>\n<h2 data-section-id=\"m7ukan\" data-start=\"1189\" data-end=\"1232\">Viktiga funktioner och tekniska f\u00f6rdelar<\/h2>\n<h3 data-section-id=\"capa5r\" data-start=\"1234\" data-end=\"1295\">Torrpoleringsteknik f\u00f6r l\u00e5g milj\u00f6p\u00e5verkan<\/h3>\n<p data-start=\"1296\" data-end=\"1491\">WDP-1240 anv\u00e4nder en helt torr poleringsprocess, vilket eliminerar behovet av kemisk slurry. Detta minskar milj\u00f6belastningen avsev\u00e4rt, f\u00f6renklar underh\u00e5llet och s\u00e4nker driftskostnaderna.<\/p>\n<h3 data-section-id=\"1awlizo\" data-start=\"1493\" data-end=\"1543\">Effektiv stressavlastning och skadeavhj\u00e4lpning<\/h3>\n<p data-start=\"1544\" data-end=\"1722\">Systemet \u00e4r utformat f\u00f6r att avl\u00e4gsna skadelagret p\u00e5 baksidan efter slipning av kiselskivor och frig\u00f6r effektivt inre sp\u00e4nningar, vilket ger f\u00f6rb\u00e4ttrad planhet och strukturell stabilitet hos kiselskivorna.<\/p>\n<h3 data-section-id=\"90fwyd\" data-start=\"1724\" data-end=\"1762\">F\u00f6rb\u00e4ttrat utbyte f\u00f6r tunna wafers<\/h3>\n<p data-start=\"1763\" data-end=\"1827\">Genom att minimera sp\u00e4nningskoncentrationen hj\u00e4lper maskinen till att f\u00f6rhindra:<\/p>\n<ul data-start=\"1828\" data-end=\"1876\">\n<li data-section-id=\"pus2hj\" data-start=\"1828\" data-end=\"1846\">Sprickbildning p\u00e5 wafer<\/li>\n<li data-section-id=\"wcbb49\" data-start=\"1847\" data-end=\"1864\">Kantflisning<\/li>\n<li data-section-id=\"bpnlvj\" data-start=\"1865\" data-end=\"1876\">Krigssida<\/li>\n<\/ul>\n<p data-start=\"1878\" data-end=\"1965\">Detta leder till ett h\u00f6gre utbyte, s\u00e4rskilt f\u00f6r stora och ultratunna wafers.<\/p>\n<h3 data-section-id=\"98a0im\" data-start=\"1967\" data-end=\"2017\">S\u00f6ml\u00f6s integration med gallringssystem<\/h3>\n<p data-start=\"2018\" data-end=\"2217\">WDP-1240 kan integreras med uppstr\u00f6msutrustning som t.ex. WG1251 Automatic Wafer Grinder, vilket m\u00f6jligg\u00f6r helautomatiska produktionslinjer med s\u00e4ker och stabil \u00f6verf\u00f6ring av wafers mellan processerna.<\/p>\n<h3 data-section-id=\"1pvq7tz\" data-start=\"2219\" data-end=\"2265\">Stabil och robust mekanisk struktur<\/h3>\n<p data-start=\"2266\" data-end=\"2435\">Utrustningen har en konfiguration med en enda spindel, en enda chuck och en dresserenhet, vilket garanterar konsekvent poleringsprestanda och l\u00e5ngsiktig driftsstabilitet.<\/p>\n<hr data-start=\"2437\" data-end=\"2440\" \/>\n<h2 data-section-id=\"8lu2ky\" data-start=\"2442\" data-end=\"2472\">\u00a0Tekniska specifikationer<\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2474\" data-end=\"2738\">\n<thead data-start=\"2474\" data-end=\"2498\">\n<tr data-start=\"2474\" data-end=\"2498\">\n<th class=\"\" data-start=\"2474\" data-end=\"2481\" data-col-size=\"sm\">F\u00f6rem\u00e5l<\/th>\n<th class=\"\" data-start=\"2481\" data-end=\"2498\" data-col-size=\"md\">Specifikation<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2522\" data-end=\"2738\">\n<tr data-start=\"2522\" data-end=\"2583\">\n<td data-start=\"2522\" data-end=\"2534\" data-col-size=\"sm\">Struktur<\/td>\n<td data-start=\"2534\" data-end=\"2583\" data-col-size=\"md\">Spindel \u00d71 \/ Chuckbord \u00d71 \/ Dresserenhet \u00d71<\/td>\n<\/tr>\n<tr data-start=\"2584\" data-end=\"2618\">\n<td data-start=\"2584\" data-end=\"2600\" data-col-size=\"sm\">Spindeleffekt<\/td>\n<td data-start=\"2600\" data-end=\"2618\" data-col-size=\"md\">7,5 kW \/ 11 kW<\/td>\n<\/tr>\n<tr data-start=\"2619\" data-end=\"2658\">\n<td data-start=\"2619\" data-end=\"2632\" data-col-size=\"sm\">Wafer-storlek<\/td>\n<td data-start=\"2632\" data-end=\"2658\" data-col-size=\"md\">Upp till 300 mm (12 tum)<\/td>\n<\/tr>\n<tr data-start=\"2659\" data-end=\"2691\">\n<td data-start=\"2659\" data-end=\"2674\" data-col-size=\"sm\">Typ av process<\/td>\n<td data-start=\"2674\" data-end=\"2691\" data-col-size=\"md\">Torrpolering<\/td>\n<\/tr>\n<tr data-start=\"2692\" data-end=\"2738\">\n<td data-start=\"2692\" data-end=\"2713\" data-col-size=\"sm\">Maskinens m\u00e5tt<\/td>\n<td data-start=\"2713\" data-end=\"2738\" data-col-size=\"md\">1450 \u00d7 3380 \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<hr data-start=\"2740\" data-end=\"2743\" \/>\n<h2 data-section-id=\"13yq5fc\" data-start=\"2745\" data-end=\"2768\">Arbetsprincip<\/h2>\n<p data-start=\"2812\" data-end=\"2954\">WDP-1240 arbetar med kontrollerad mekanisk polering av waferbaksidan med hj\u00e4lp av en h\u00f6ghastighetsspindel och ett precisionschucksystem.<\/p>\n<p data-start=\"2956\" data-end=\"3193\">Efter gallring av wafern finns ofta ett skadat skikt kvar under ytan, vilket ger upphov till inre sp\u00e4nningar. Torrpoleringsprocessen avl\u00e4gsnar detta lager samtidigt som den uppr\u00e4tth\u00e5ller strikt kontroll \u00f6ver tryck och materialavverkningshastighet. Detta resulterar i:<\/p>\n<ul data-start=\"3195\" data-end=\"3278\">\n<li data-section-id=\"1r1ex1w\" data-start=\"3195\" data-end=\"3222\">Enhetlig ytkvalitet<\/li>\n<li data-section-id=\"bhqqr1\" data-start=\"3223\" data-end=\"3250\">Minskad restsp\u00e4nning<\/li>\n<li data-section-id=\"1iz8bdx\" data-start=\"3251\" data-end=\"3278\">F\u00f6rb\u00e4ttrad planhet hos wafern<\/li>\n<\/ul>\n<p data-start=\"3280\" data-end=\"3392\">Den integrerade dresserenheten s\u00e4kerst\u00e4ller att polerverktygen h\u00e5ller j\u00e4mn prestanda under hela processen.<\/p>\n<hr data-start=\"3394\" data-end=\"3397\" \/>\n<h2 data-section-id=\"1mpxdoq\" data-start=\"3399\" data-end=\"3422\"><img decoding=\"async\" class=\"size-medium wp-image-2171 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-300x300.webp\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-768x768.webp 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers.webp 800w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Applikationsomr\u00e5de<\/h2>\n<p data-start=\"3424\" data-end=\"3462\">WDP-1240-serien anv\u00e4nds ofta i:<\/p>\n<ul data-start=\"3464\" data-end=\"3675\">\n<li data-section-id=\"thioxr\" data-start=\"3464\" data-end=\"3507\">Bearbetning av halvledarskivans baksida<\/li>\n<li data-section-id=\"1b52adm\" data-start=\"3508\" data-end=\"3557\">Avancerad paketering (WLCSP, fan-out-paketering)<\/li>\n<li data-section-id=\"1lhtczs\" data-start=\"3558\" data-end=\"3590\">Polering av kiselskivor (Si)<\/li>\n<li data-section-id=\"zqmbwb\" data-start=\"3591\" data-end=\"3633\">Bearbetning av kiselkarbidskivor (SiC)<\/li>\n<li data-section-id=\"1xtbjfg\" data-start=\"3634\" data-end=\"3675\">Sp\u00e4nningsavlastande applikationer f\u00f6r tunna skivor<\/li>\n<\/ul>\n<p data-start=\"3677\" data-end=\"3828\">Den st\u00f6der wafers p\u00e5 12 tum och mindre, vilket g\u00f6r den l\u00e4mplig f\u00f6r b\u00e5de vanlig halvledarproduktion och nya avancerade f\u00f6rpackningstekniker.<\/p>\n<hr data-start=\"3830\" data-end=\"3833\" \/>\n<h2 data-section-id=\"1116wfg\" data-start=\"3835\" data-end=\"3856\"><img decoding=\"async\" class=\"size-medium wp-image-2122 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Centrala f\u00f6rdelar<\/h2>\n<ul data-start=\"3858\" data-end=\"4293\">\n<li data-section-id=\"6czk3i\" data-start=\"3858\" data-end=\"3942\">L\u00e5g milj\u00f6p\u00e5verkan<br data-start=\"3888\" data-end=\"3891\" \/>Torr process eliminerar uppslamning och minskar avfallet<\/li>\n<li data-section-id=\"7ceake\" data-start=\"3944\" data-end=\"4024\">F\u00f6rb\u00e4ttring av h\u00f6g avkastning<br data-start=\"3972\" data-end=\"3975\" \/>Minimerar sprickbildning och skevhet i tunna wafers<\/li>\n<li data-section-id=\"aztc7d\" data-start=\"4026\" data-end=\"4104\">H\u00f6g processtabilitet<br data-start=\"4054\" data-end=\"4057\" \/>Robust struktur ger konsekventa resultat<\/li>\n<li data-section-id=\"1viz6br\" data-start=\"4106\" data-end=\"4194\">Integration av produktionslinjer<br data-start=\"4139\" data-end=\"4142\" \/>Kompatibel med automatiserade system f\u00f6r gallring av wafers<\/li>\n<li data-section-id=\"vz1nvb\" data-start=\"4196\" data-end=\"4293\">Optimerad f\u00f6r avancerade f\u00f6rpackningar<br data-start=\"4234\" data-end=\"4237\" \/>Utformad f\u00f6r n\u00e4sta generations halvledarprocesser<\/li>\n<\/ul>\n<hr data-start=\"4295\" data-end=\"4298\" \/>\n<h2 data-section-id=\"w1cnyx\" data-start=\"4300\" data-end=\"4309\">VANLIGA FR\u00c5GOR<\/h2>\n<p data-start=\"4311\" data-end=\"4563\">Q1: Vilken \u00e4r den st\u00f6rsta f\u00f6rdelen med torrpolering j\u00e4mf\u00f6rt med v\u00e5tpolering?<br data-start=\"4389\" data-end=\"4392\" \/>A: Torrpolering eliminerar anv\u00e4ndningen av slurry, vilket minskar milj\u00f6p\u00e5verkan, f\u00f6renklar underh\u00e5llet och s\u00e4nker driftskostnaderna samtidigt som ytkvaliteten bibeh\u00e5lls p\u00e5 en h\u00f6g niv\u00e5.<\/p>\n<p data-start=\"4565\" data-end=\"4700\">F2: Vilka waferstorlekar st\u00f6ds?<br data-start=\"4604\" data-end=\"4607\" \/>S: WDP-1240 st\u00f6der wafers upp till 300 mm (12 tum), inklusive Si- och SiC-material.<\/p>\n<p data-start=\"4702\" data-end=\"4916\">F3: Kan den h\u00e4r maskinen integreras i en produktionslinje?<br data-start=\"4764\" data-end=\"4767\" \/>Svar: Ja, det st\u00e4mmer. Den kan s\u00f6ml\u00f6st anslutas till utrustning f\u00f6r gallring av wafers, t.ex. WG1251, vilket m\u00f6jligg\u00f6r automatiserad wafer\u00f6verf\u00f6ring och kontinuerlig bearbetning.<\/p>","protected":false},"excerpt":{"rendered":"<p>WDP-1240 Series Dry Polishing Machine \u00e4r ett avancerat precisionssystem som utvecklats f\u00f6r avsp\u00e4nning av waferbaksidan och borttagning av skadade skikt vid halvledartillverkning. Utrustningen \u00e4r speciellt utformad f\u00f6r bearbetning av 300 mm wafers och anv\u00e4nder en torrpoleringsprocess f\u00f6r att uppn\u00e5 h\u00f6gkvalitativ ytbehandling samtidigt som milj\u00f6p\u00e5verkan minimeras.<\/p>","protected":false},"featured_media":2217,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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