{"id":2154,"date":"2026-04-09T07:52:50","date_gmt":"2026-04-09T07:52:50","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2154"},"modified":"2026-04-09T09:41:00","modified_gmt":"2026-04-09T09:41:00","slug":"hp-8201-fully-automatic-8-inch-wafer-dicing-machine","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/sv\/product\/hp-8201-fully-automatic-8-inch-wafer-dicing-machine\/","title":{"rendered":"HP-8201 Helautomatisk 8-tums skivt\u00e4rningsmaskin"},"content":{"rendered":"<p data-start=\"203\" data-end=\"763\"><img fetchpriority=\"high\" decoding=\"async\" class=\"size-medium wp-image-2157 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/HP-8201-Fully-Automatic-8-Inch-Wafer-Dicing-Machine-1-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/HP-8201-Fully-Automatic-8-Inch-Wafer-Dicing-Machine-1-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/HP-8201-Fully-Automatic-8-Inch-Wafer-Dicing-Machine-1-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/HP-8201-Fully-Automatic-8-Inch-Wafer-Dicing-Machine-1-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/HP-8201-Fully-Automatic-8-Inch-Wafer-Dicing-Machine-1-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/HP-8201-Fully-Automatic-8-Inch-Wafer-Dicing-Machine-1-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/HP-8201-Fully-Automatic-8-Inch-Wafer-Dicing-Machine-1-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/HP-8201-Fully-Automatic-8-Inch-Wafer-Dicing-Machine-1.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>HP-8201 \u00e4r en h\u00f6geffektiv, helautomatisk wafer dicing-maskin som \u00e4r konstruerad f\u00f6r precisionssk\u00e4rning av halvledare och kristallina material. Det h\u00e4r avancerade dikningssystemet \u00e4r utformat f\u00f6r att hantera wafers med en diameter p\u00e5 upp till 8 tum och st\u00f6der ett brett utbud av material, inklusive kisel (Si), kiselkarbid (SiC), litiumtantalat (LT) och litiumniobat (LN). HP-8201 kombinerar hastighet, noggrannhet och automatisering i en enda plattform och erbjuder en komplett l\u00f6sning f\u00f6r produktionsmilj\u00f6er med h\u00f6ga volymer och specialiserade behov av waferbearbetning.<\/p>\n<p data-start=\"765\" data-end=\"1153\">Maskinen integrerar alla kritiska steg i ett automatiserat arbetsfl\u00f6de: lastning och lossning av wafers, exakt uppriktning, t\u00e4rning, reng\u00f6ring och torkning. Genom att minska antalet manuella ingrepp s\u00e4kerst\u00e4ller den h\u00f6g genomstr\u00f6mning med bibeh\u00e5llen kvalitet, vilket g\u00f6r den idealisk f\u00f6r branscher som halvledartillverkning, MEMS-enheter, optoelektronik och avancerad sensorproduktion.<\/p>\n<h3 data-section-id=\"1q9yu5h\" data-start=\"1160\" data-end=\"1197\"><span role=\"text\">Viktiga funktioner och f\u00f6rdelar<\/span><\/h3>\n<ul data-start=\"1199\" data-end=\"2995\">\n<li data-section-id=\"57r6pe\" data-start=\"1199\" data-end=\"1499\">Struktur med dubbla motst\u00e5ende spindlar: HP-8201 har en dubbelspindeldesign med f\u00f6rkortat spindelavst\u00e5nd, vilket m\u00f6jligg\u00f6r samtidiga sk\u00e4roperationer. Denna konfiguration f\u00f6rb\u00e4ttrar avsev\u00e4rt produktionseffektiviteten och genomstr\u00f6mningen, vilket g\u00f6r den l\u00e4mplig f\u00f6r tillverkningsmilj\u00f6er med h\u00f6ga volymer.<\/li>\n<li data-section-id=\"1qbjmd8\" data-start=\"1501\" data-end=\"1787\">Fullt automatiserat arbetsfl\u00f6de: Maskinen ger en helt\u00e4ckande automatisering, inklusive waferhantering, uppriktning, t\u00e4rning och reng\u00f6ring\/torkning. Operat\u00f6rerna kan uppn\u00e5 kontinuerlig produktion med minimal manuell inblandning, vilket minskar arbetskostnaderna och f\u00f6rb\u00e4ttrar den totala driftseffektiviteten.<\/li>\n<li data-section-id=\"499qor\" data-start=\"1789\" data-end=\"2157\">System med dubbla mikroskop: HP-8201 \u00e4r utrustad med mikroskop med b\u00e5de h\u00f6g och l\u00e5g f\u00f6rstoring och erbjuder exakt automatisk waferuppriktning och bladm\u00e4rkesdetektering med h\u00f6g noggrannhet. Dessutom st\u00f6der den Sub-C\/T-assisterad bladdressning, vilket s\u00e4kerst\u00e4ller konsekvent bladskick och optimal sk\u00e4rprestanda, vilket leder till f\u00f6rb\u00e4ttrat utbyte och ytkvalitet.<\/li>\n<li data-section-id=\"1pvlp5f\" data-start=\"2159\" data-end=\"2466\">Dubbelt munstycke f\u00f6r vatten och gas som tillval: F\u00f6r wafers som kr\u00e4ver \u00f6verl\u00e4gsen renhet efter dikning kan ett dubbelt vatten-gasmunstycke installeras som tillval. Denna funktion avl\u00e4gsnar effektivt skr\u00e4p och partiklar, vilket minskar risken f\u00f6r kontaminering och s\u00e4kerst\u00e4ller h\u00f6gkvalitativa waferytor f\u00f6r nedstr\u00f6msbearbetning.<\/li>\n<li data-section-id=\"1yt1cve\" data-start=\"2468\" data-end=\"2698\">Avancerade kapningsm\u00f6jligheter: Systemet kan konfigureras med alternativ f\u00f6r ringsk\u00e4rning och kanttrimning, vilket ger flexibilitet f\u00f6r specialiserade wafergeometrier eller applikationer som kr\u00e4ver precisionskantbearbetning.<\/li>\n<li data-section-id=\"14hno35\" data-start=\"2700\" data-end=\"2995\">M\u00e5ngsidiga material: HP-8201 \u00e4r kompatibel med ett brett utbud av material, inklusive spr\u00f6da substrat som Si, SiC, LT och LN. Dess anpassningsf\u00f6rm\u00e5ga s\u00e4kerst\u00e4ller att anv\u00e4ndarna kan bearbeta olika wafertyper utan att byta maskin, vilket \u00e4r viktigt f\u00f6r diversifierade produktionslinjer.<\/li>\n<\/ul>\n<h3 data-section-id=\"1880me3\" data-start=\"3002\" data-end=\"3036\"><span role=\"text\">Tekniska specifikationer<\/span><\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"3038\" data-end=\"3378\">\n<thead data-start=\"3038\" data-end=\"3067\">\n<tr data-start=\"3038\" data-end=\"3067\">\n<th class=\"\" data-start=\"3038\" data-end=\"3050\" data-col-size=\"sm\">Parameter<\/th>\n<th class=\"\" data-start=\"3050\" data-end=\"3067\" data-col-size=\"md\">Specifikation<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"3098\" data-end=\"3378\">\n<tr data-start=\"3098\" data-end=\"3167\">\n<td data-start=\"3098\" data-end=\"3122\" data-col-size=\"sm\">Spindeleffekt\/varvtal<\/td>\n<td data-col-size=\"md\" data-start=\"3122\" data-end=\"3167\">1,8 kW \/ 2,2 kW (tillval) \/ 6000-60000 rpm<\/td>\n<\/tr>\n<tr data-start=\"3168\" data-end=\"3188\">\n<td data-start=\"3168\" data-end=\"3182\" data-col-size=\"sm\">Fl\u00e4nsstorlek<\/td>\n<td data-col-size=\"md\" data-start=\"3182\" data-end=\"3188\">2\u2033<\/td>\n<\/tr>\n<tr data-start=\"3189\" data-end=\"3235\">\n<td data-start=\"3189\" data-end=\"3214\" data-col-size=\"sm\">Maximal storlek p\u00e5 arbetsstycket<\/td>\n<td data-col-size=\"md\" data-start=\"3214\" data-end=\"3235\">Cirkul\u00e4r: \u00f8200 mm<\/td>\n<\/tr>\n<tr data-start=\"3236\" data-end=\"3323\">\n<td data-start=\"3236\" data-end=\"3257\" data-col-size=\"sm\">Konfiguration av objektiv<\/td>\n<td data-col-size=\"md\" data-start=\"3257\" data-end=\"3323\">H\u00f6g f\u00f6rstoring: 7,5\u00d7 \/ L\u00e5g f\u00f6rstoring: 0,75\u00d7 (tillval)<\/td>\n<\/tr>\n<tr data-start=\"3324\" data-end=\"3378\">\n<td data-start=\"3324\" data-end=\"3353\" data-col-size=\"sm\">Maskinens m\u00e5tt (B\u00d7D\u00d7H)<\/td>\n<td data-col-size=\"md\" data-start=\"3353\" data-end=\"3378\">1190 \u00d7 1150 \u00d7 1850 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"xdxar3\" data-start=\"3385\" data-end=\"3407\"><span role=\"text\">Till\u00e4mpningar<\/span><\/h3>\n<p data-start=\"3409\" data-end=\"3545\">HP-8201 \u00e4r konstruerad f\u00f6r att uppfylla kraven f\u00f6r modern bearbetning av halvledare och kristallina material. Typiska applikationer inkluderar:<\/p>\n<ol data-start=\"3547\" data-end=\"4222\">\n<li data-section-id=\"5ewhyp\" data-start=\"3547\" data-end=\"3678\">Dicing av halvledarwafers: Sk\u00e4rning av kisel- och SiC-wafers f\u00f6r integrerade kretsar, kraftaggregat och MEMS-komponenter.<\/li>\n<li data-section-id=\"vngdi7\" data-start=\"3679\" data-end=\"3824\">Optoelektroniska enheter: Precisionssk\u00e4rning av LT- och LN-wafers som anv\u00e4nds i optiska modulatorer, akustiska enheter och piezoelektriska komponenter.<\/li>\n<li data-section-id=\"13045vh\" data-start=\"3825\" data-end=\"3955\">Kanttrimning och ringsk\u00e4rning: Specialiserad bearbetning f\u00f6r wafers som kr\u00e4ver anpassade former eller reducerade kantdefekter.<\/li>\n<li data-section-id=\"14a93cw\" data-start=\"3956\" data-end=\"4083\">Tillverkning av stora volymer: Automatiserad, kontinuerlig produktion med h\u00f6g repeterbarhet och minimal operat\u00f6rsintervention.<\/li>\n<li data-section-id=\"kp3x5v\" data-start=\"4084\" data-end=\"4222\">Forskning och utveckling: Flexibel bearbetning f\u00f6r experimentella wafers eller h\u00f6gprecisionsapplikationer i sm\u00e5 volymer i avancerade laboratorier.<\/li>\n<\/ol>\n<h3 data-section-id=\"14nwj98\" data-start=\"4229\" data-end=\"4258\"><span role=\"text\"><img decoding=\"async\" class=\"size-medium wp-image-2122 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Varf\u00f6r v\u00e4lja HP-8201?<\/span><\/h3>\n<ul data-start=\"4260\" data-end=\"4941\">\n<li data-section-id=\"9bxm8z\" data-start=\"4260\" data-end=\"4392\">F\u00f6rb\u00e4ttrad effektivitet: Dubbla motriktade spindlar och f\u00f6rkortat spindelavst\u00e5nd ger snabbare genomstr\u00f6mning och mer exakta snitt.<\/li>\n<li data-section-id=\"1obg754\" data-start=\"4393\" data-end=\"4533\">\u00d6verl\u00e4gsen precision: Dubbla mikroskopsystem garanterar noggrann uppriktning och exakt detektering av bladm\u00e4rken f\u00f6r j\u00e4mn wafer-kvalitet.<\/li>\n<li data-section-id=\"1lrcp5y\" data-start=\"4534\" data-end=\"4659\">M\u00e5ngsidig och flexibel: St\u00f6djer en m\u00e4ngd olika material och tillvalsmoduler f\u00f6r kantsk\u00e4rning och ringsk\u00e4rning.<\/li>\n<li data-section-id=\"i1ymyp\" data-start=\"4660\" data-end=\"4799\">Integrerad reng\u00f6ring och torkning: Minskar antalet efterbehandlingssteg och s\u00e4kerst\u00e4ller rena waferytor, vilket \u00e4r avg\u00f6rande f\u00f6r h\u00f6gproduktiv produktion.<\/li>\n<li data-section-id=\"1baebkj\" data-start=\"4800\" data-end=\"4941\">P\u00e5litlig automatisering: Helautomatisk lastning, t\u00e4rning och reng\u00f6ring minimerar m\u00e4nskliga fel och f\u00f6rb\u00e4ttrar den totala produktionstillf\u00f6rlitligheten.<\/li>\n<\/ul>\n<p data-start=\"4943\" data-end=\"5191\">HP-8201 \u00e4r en helt\u00e4ckande l\u00f6sning f\u00f6r wafer-dicing, som kombinerar hastighet, precision och m\u00e5ngsidighet. Den \u00e4r utformad f\u00f6r tillverkare som vill optimera produktionseffektiviteten och samtidigt uppr\u00e4tth\u00e5lla h\u00f6gsta standard f\u00f6r waferkvalitet.<\/p>\n<h3 data-section-id=\"1vvukxy\" data-start=\"70\" data-end=\"128\"><span role=\"text\">VANLIGA FR\u00c5GOR\u00a0<\/span><\/h3>\n<p data-start=\"130\" data-end=\"313\">1. Vilka material kan HP-8201 bearbeta?<br data-start=\"176\" data-end=\"179\" \/>Den st\u00f6der wafers p\u00e5 upp till 8 tum, inklusive Si, SiC, LT och LN, som passar f\u00f6r halvledare, MEMS och optoelektroniska enheter.<\/p>\n<p data-start=\"315\" data-end=\"494\">2. Hur s\u00e4kerst\u00e4lls h\u00f6g precision?<br data-start=\"352\" data-end=\"355\" \/>Dubbla spindlar, dubbla mikroskop och Sub-C\/T-assisterad klingdressning ger exakt uppriktning, exakt kapning och j\u00e4mn kvalitet.<\/p>\n<p data-start=\"496\" data-end=\"735\">3. Vilka automations- och tillvalsfunktioner finns tillg\u00e4ngliga?<br data-start=\"555\" data-end=\"558\" \/>Full automatisering omfattar lastning, uppriktning, t\u00e4rning, reng\u00f6ring och torkning. Kantsk\u00e4rning, ringsk\u00e4rning och reng\u00f6ring med dubbla munstycken som tillval \u00f6kar flexibiliteten och effektiviteten.<\/p>","protected":false},"excerpt":{"rendered":"<p>HP-8201 \u00e4r en h\u00f6geffektiv, helautomatisk wafer dicing-maskin som \u00e4r konstruerad f\u00f6r precisionssk\u00e4rning av halvledare och kristallina material. Det h\u00e4r avancerade dikningssystemet \u00e4r utformat f\u00f6r att hantera wafers med en diameter p\u00e5 upp till 8 tum och st\u00f6der ett brett utbud av material, inklusive kisel (Si), kiselkarbid (SiC), litiumtantalat (LT) och litiumniobat (LN).<\/p>","protected":false},"featured_media":2155,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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