![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-300x300.png\")
WG-1261-serien \u00e4r en helautomatisk skivtunnningsmaskin med h\u00f6g precision som \u00e4r avsedd f\u00f6r 12-tums och mindre SiC-skivor samt safir-, kvarts- och keramiska material. Som en helt\u00e4ckande l\u00f6sning fr\u00e5n en p\u00e5litlig leverant\u00f6r av halvledarutrustning integrerar denna serie avancerad spindelteknik, h\u00f6gbelastade skivb\u00e4rare och automatiseringsfunktioner f\u00f6r att s\u00e4kerst\u00e4lla stabil, exakt och effektiv skivtunning.<\/p>\n
WG-1261 \u00e4r utrustad med h\u00f6geffektiva luftlagrade spindlar med h\u00f6g precision och en ny generation luftlagrad waferb\u00e4rare med h\u00f6g belastning och l\u00e5ga vibrationer, vilket ger \u00f6verl\u00e4gsen styvhet och f\u00f6rb\u00e4ttrad processtabilitet. Dess omslutande spindeldrivning med h\u00f6g styvhet \u00f6kar maskinens styvhet ytterligare, vilket m\u00f6jligg\u00f6r exakt kontroll \u00e4ven f\u00f6r utmanande material som SiC och safir.<\/p>\n
Tack vare Autosetup-funktionen kan maskinen automatiskt slutf\u00f6ra hjulbearbetningen efter byte, vilket eliminerar manuella ingrepp och f\u00f6rb\u00e4ttrar b\u00e5de produktivitet och konsekvens. Dessutom s\u00e4kerst\u00e4ller en online-m\u00e4tenhet (intervall 0-1800 \u03bcm) exakt tjocklekskontroll, medan SECS\/GEM-anslutning m\u00f6jligg\u00f6r s\u00f6ml\u00f6s integration i moderna smarta fabriker.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-300x300.png\")
Tekniska egenskaper<\/span><\/h2>\nWG-1261-serien \u00e4r idealisk f\u00f6r:<\/p>\n
| F\u00f6rem\u00e5l<\/th>\n | Specifikation<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|
| Struktur<\/td>\n | Spindel \u00d72 \/ Wafer Carrier \u00d73 \/ Arbetsbord \u00d71 \/ Helautomatiskt \u00f6verf\u00f6rings- och reng\u00f6ringssystem \u00d71<\/td>\n<\/tr>\n |
| Spindeleffekt<\/td>\n | 7,5 kW \/ 11 kW (tillval)<\/td>\n<\/tr>\n |
| Slipdiameter<\/td>\n | \u03c66\u2033, \u03c68\u2033, \u03c612\u2033<\/td>\n<\/tr>\n |
| M\u00e5tt (B\u00d7D\u00d7H)<\/td>\n | 1450 mm \u00d7 3380 mm \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
Vanliga fr\u00e5gor och svar (FAQ)<\/strong><\/span><\/h2>\nA:<\/strong> Maskinen st\u00f6der wafers upp till 12 tum, inklusive SiC, safir, kvarts och keramiska material, vilket ger m\u00e5ngsidiga bearbetningsalternativ f\u00f6r flera produktionslinjer.<\/li>\n A:<\/strong> Autosetup slutf\u00f6r automatiskt hjulavj\u00e4mningen efter byte, vilket eliminerar manuella ingrepp, minskar inst\u00e4llningsfelen och sparar avsev\u00e4rt med produktionstid.<\/li>\n A:<\/strong> Ja, den \u00e4r utrustad med en online-m\u00e4tenhet (0-1800 \u03bcm) som s\u00e4kerst\u00e4ller noggrann \u00f6vervakning och kontroll av skivans gallring under bearbetningen.<\/li>\n A:<\/strong> Absolut. Maskinen st\u00f6der SECS\/GEM-anslutning<\/strong>, vilket m\u00f6jligg\u00f6r \u00f6vervakning i realtid, datainsamling och integrering med smarta tillverkningssystem.<\/li>\n A:<\/strong> Med h\u00f6geffektiva luftlagrade spindlar, en l\u00e5gvibrerande waferh\u00e5llare f\u00f6r h\u00f6g belastning och en omslutande spindeldrivning med h\u00f6g styvhet uppr\u00e4tth\u00e5ller WG-1261 utm\u00e4rkt processtabilitet \u00e4ven f\u00f6r SiC- och safirwafers.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":" Den helautomatiska Wafer Thinning Machine i WG-1261-serien \u00e4r den perfekta l\u00f6sningen f\u00f6r modern halvledar- och optisk waferbearbetning. Med h\u00f6g precision, avancerad automatisering och kompatibilitet med flera material ger den konsekvent, effektiv och tillf\u00f6rlitlig skivtunning f\u00f6r SiC-, safir-, kvarts- och keramikskivor upp till 12 tum. WG-1261-serien \u00e4r idealisk f\u00f6r FoU, pilotproduktion och medelstora till storskaliga fabriker och garanterar h\u00f6gre avkastning, l\u00e4gre arbetskostnader och optimerad produktionseffektivitet.<\/p>","protected":false},"featured_media":2135,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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|
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\")
Varf\u00f6r v\u00e4lja WG-1261-serien?<\/span><\/h2>\n