![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-300x300.png\")
WGP-1271C \u00e4r en h\u00f6geffektiv, helautomatisk wafergallringsmaskin som \u00e4r s\u00e4rskilt konstruerad f\u00f6r att hantera utmaningarna med SiC-substrat och enhetswafers med stor diameter. Detta avancerade GGG-system med tre spindlar och fyra stationer \u00e4r utformat med precision och produktivitet i \u00e5tanke och s\u00e4kerst\u00e4ller stabil, konsekvent och h\u00f6gkvalitativ wafertunning f\u00f6r b\u00e5de 8-tums SiC-enhetswafers och 12-tums SiC-substrat.<\/p>\n
WGP-1271C \u00e4r utrustad med spindlar med ultrah\u00f6gt vridmoment och en fj\u00e4rde generationens waferb\u00e4rare med h\u00f6g belastning och hanterar enkelt den komplexa och kr\u00e4vande processen med att tunna SiC, ett av de mest utmanande halvledarmaterialen. Med automation som k\u00e4rna integrerar maskinen wafer\u00f6verf\u00f6ring, reng\u00f6ring och slipning i ett enda str\u00f6mlinjeformat arbetsfl\u00f6de, vilket avsev\u00e4rt f\u00f6rb\u00e4ttrar produktionseffektiviteten samtidigt som det m\u00e4nskliga ingripandet minskar.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-1-300x300.png\")
<\/span><\/h2>\nWGP-1271C \u00e4r idealiskt l\u00e4mpad f\u00f6r:<\/p>\n
Dess f\u00f6rm\u00e5ga att hantera b\u00e5de enhetswafers och substrat g\u00f6r den till ett m\u00e5ngsidigt val f\u00f6r anl\u00e4ggningar som vill minska stillest\u00e5ndstiden, \u00f6ka utbytet och s\u00e4nka de totala driftskostnaderna.<\/p>\n
| F\u00f6rem\u00e5l<\/th>\n | Specifikation<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|
| Struktur<\/td>\n | Spindel \u00d73 \/ Wafer Carrier \u00d74 \/ Arbetsbord \u00d71 \/ Helautomatiskt \u00f6verf\u00f6rings- och reng\u00f6ringssystem \u00d71<\/td>\n<\/tr>\n |
| Spindeleffekt<\/td>\n | 11 kW<\/td>\n<\/tr>\n |
| Slipdiameter<\/td>\n | \u03c66\u2033, \u03c68\u2033, \u03c612\u2033<\/td>\n<\/tr>\n |
| M\u00e5tt (B\u00d7D\u00d7H)<\/td>\n | 1900 mm \u00d7 3530 mm \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
Vanliga fr\u00e5gor och svar (FAQ)<\/strong><\/span><\/h2>\nA:<\/strong> Maskinen st\u00f6der \u03c66\u2033-, \u03c68\u2033- och \u03c612\u2033-wafers, inklusive b\u00e5de 8-tums SiC-enhetswafers och 12-tums SiC-substrat, vilket ger flexibilitet f\u00f6r olika produktionsbehov.<\/li>\n A:<\/strong> Autosetup utf\u00f6r automatiskt hjuljustering efter byte, vilket eliminerar manuella ingrepp, minskar inst\u00e4llningsfel och sparar v\u00e4rdefull produktionstid.<\/li>\n A:<\/strong> Ja, med spindlar med ultrah\u00f6gt vridmoment och en fj\u00e4rde generationens waferh\u00e5llare f\u00f6r h\u00f6g belastning s\u00e4kerst\u00e4ller maskinen stabil gallring \u00e4ven f\u00f6r sv\u00e5rbearbetade SiC-wafers, vilket minimerar stress och defekter.<\/li>\n A:<\/strong> Absolut. Det helautomatiska \u00f6verf\u00f6rings- och reng\u00f6ringssystemet i kombination med h\u00f6gprecisionsspindlar g\u00f6r den idealisk f\u00f6r b\u00e5de forskningsutveckling och storskalig tillverkning.<\/li>\n A:<\/strong> Maskinen erbjuder optimerade konfigurationer av f\u00f6rbrukningsartiklar och h\u00f6g processeffektivitet, vilket minskar materialspill och arbetskostnader samtidigt som h\u00f6g genomstr\u00f6mning och j\u00e4mn waferkvalitet bibeh\u00e5lls.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":" Den helautomatiska Wafer Thinning Machine WGP-1271C \u00e4r den ultimata l\u00f6sningen f\u00f6r modern bearbetning av SiC-wafers. Genom att kombinera precisionsteknik, h\u00f6g automatisering och m\u00e5ngsidig kompatibilitet hanterar den utmaningarna med att tunna stora SiC-substrat och enhetswafers effektivt och tillf\u00f6rlitligt. Oavsett om det g\u00e4ller h\u00f6gvolymproduktion eller forskningsutveckling s\u00e4kerst\u00e4ller WGP-1271C konsekventa resultat, f\u00f6rb\u00e4ttrat utbyte och l\u00e4gre driftskostnader, vilket g\u00f6r den till en oumb\u00e4rlig tillg\u00e5ng f\u00f6r tillverkningsanl\u00e4ggningar f\u00f6r halvledare.<\/p>","protected":false},"featured_media":2132,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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|
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\")
Varf\u00f6r v\u00e4lja WGP-1271C?<\/span><\/h2>\n