{"id":2048,"date":"2026-04-01T05:59:16","date_gmt":"2026-04-01T05:59:16","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2048"},"modified":"2026-04-01T06:04:59","modified_gmt":"2026-04-01T06:04:59","slug":"microfluidic-laser-equipment-for-high-precision-semiconductor-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/sv\/product\/microfluidic-laser-equipment-for-high-precision-semiconductor-wafer-processing\/","title":{"rendered":"Mikrofluidisk laserutrustning f\u00f6r h\u00f6gprecisionsbearbetning av halvledarwafers"},"content":{"rendered":"

\"\"Mikrofluidisk laserutrustning anv\u00e4nder avancerad mikrojetlaserteknik f\u00f6r att ge h\u00f6gprecisionsbearbetning med l\u00e5g termisk skada f\u00f6r halvledarplattor och andra h\u00e5rda, spr\u00f6da eller material med brett bandgap. Genom att kombinera en submikron vattenstr\u00e5le med en laserstr\u00e5le styr systemet laserenergin exakt till arbetsstyckets yta, samtidigt som vattenstr\u00f6mmen kontinuerligt kyler och avl\u00e4gsnar skr\u00e4p. Denna teknik l\u00f6ser effektivt de vanliga utmaningarna med konventionell laser- och mekanisk bearbetning, inklusive termisk skada, mikrosprickor, kontaminering, avsmalning och deformation.<\/p>\n

\"\"Viktiga funktioner<\/strong><\/span><\/h2>\n
    \n
  • Lasertyp:<\/strong> Diodpumpad solid-state Nd:YAG-laser, v\u00e5gl\u00e4ngd 532\/1064 nm, pulsbredd i \u03bcs\/ns, medeleffekt 10-200 W<\/li>\n
  • Vattenjet-system:<\/strong> Avjoniserat, filtrerat vatten med l\u00e5gt tryck; ultrafin mikrostr\u00e5le f\u00f6rbrukar endast 1 l\/h vid 300 bar, f\u00f6rsumbar kraft (<0,1 N)<\/li>\n
  • Munstycke:<\/strong> Safir eller diamant, 30-150 \u03bcm diameter f\u00f6r exakt laserstyrning<\/li>\n
  • Hj\u00e4lpsystem:<\/strong> H\u00f6gtryckspumpar och vattenreningsenheter s\u00e4kerst\u00e4ller stabil jetprestanda<\/li>\n
  • Precision:<\/strong> Positioneringsnoggrannhet \u00b15 \u03bcm, noggrannhet vid upprepad positionering \u00b12 \u03bcm<\/li>\n
  • Bearbetningskapacitet:<\/strong> Ytj\u00e4mnhet Ra \u22641,2-1,6 \u03bcm, linj\u00e4r sk\u00e4rhastighet \u226550 mm\/s, \u00f6ppningshastighet \u22651,25 mm\/s, omkretssk\u00e4rning \u22656 mm\/s<\/li>\n<\/ul>\n

    Tekniska specifikationer<\/strong><\/span><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Specifikation<\/th>\nAlternativ 1<\/th>\nAlternativ 2<\/th>\n<\/tr>\n<\/thead>\n
    B\u00e4nkskivans volym (mm)<\/td>\n300\u00d7300\u00d7150<\/td>\n400\u00d7400\u00d7200<\/td>\n<\/tr>\n
    Linj\u00e4r axel XY<\/td>\nLinj\u00e4r motor<\/td>\nLinj\u00e4r motor<\/td>\n<\/tr>\n
    Linj\u00e4r axel Z<\/td>\n150<\/td>\n200<\/td>\n<\/tr>\n
    Positioneringsnoggrannhet (\u03bcm)<\/td>\n\u00b15<\/td>\n\u00b15<\/td>\n<\/tr>\n
    Noggrannhet vid upprepad positionering (\u03bcm)<\/td>\n\u00b12<\/td>\n\u00b12<\/td>\n<\/tr>\n
    Acceleration (G)<\/td>\n1<\/td>\n0.29<\/td>\n<\/tr>\n
    Numerisk styrning<\/td>\n3 axlar \/ 3+1 \/ 3+2 axlar<\/td>\n3 axlar \/ 3+1 \/ 3+2 axlar<\/td>\n<\/tr>\n
    V\u00e5gl\u00e4ngd (nm)<\/td>\n532\/1064<\/td>\n532\/1064<\/td>\n<\/tr>\n
    Nominell effekt (W)<\/td>\n50\/100\/200<\/td>\n50\/100\/200<\/td>\n<\/tr>\n
    Tryck vattenstr\u00e5le (bar)<\/td>\n50-100<\/td>\n50-600<\/td>\n<\/tr>\n
    Storlek p\u00e5 munstycke (\u03bcm)<\/td>\n30-150<\/td>\n30-150<\/td>\n<\/tr>\n
    Maskinens m\u00e5tt (mm)<\/td>\n1445\u00d71944\u00d72260<\/td>\n1700\u00d71500\u00d72120<\/td>\n<\/tr>\n
    Vikt (T)<\/td>\n2.5<\/td>\n3<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    Till\u00e4mpningar<\/strong><\/span><\/h2>\n
      \n
    1. Dicing och sk\u00e4rning av wafers<\/strong>\n
        \n
      • Material: Kisel (Si), kiselkarbid (SiC), galliumnitrid (GaN) och andra h\u00e5rda\/spr\u00f6da wafers<\/li>\n
      • F\u00f6rdelar: Ers\u00e4tter traditionella diamantklingor: Ers\u00e4tter traditionella diamantklingor, minskar kantbrytning (20 \u03bcm), \u00f6kar sk\u00e4rhastigheten med 30%, m\u00f6jligg\u00f6r stealth dicing f\u00f6r ultratunna wafers (<50 \u03bcm)<\/li>\n<\/ul>\n<\/li>\n
      • Sp\u00e5nborrning och bearbetning av mikroh\u00e5l<\/strong>\n
          \n
        • Till\u00e4mpningar: TSV-borrning (Through-Silicon Via), termiska mikroh\u00e5lsarrayer f\u00f6r kraftaggregat<\/li>\n
        • Egenskaper: Apertur 10-200 \u03bcm, djup-till-bredd-f\u00f6rh\u00e5llande upp till 10:1, ytj\u00e4mnhet Ra <0,5 \u03bcm<\/li>\n<\/ul>\n<\/li>\n
        • Avancerade f\u00f6rpackningar<\/strong>\n
            \n
          • Till\u00e4mpningar: \u00d6ppning av RDL-f\u00f6nster, f\u00f6rpackning p\u00e5 waferniv\u00e5 (Fan-Out WLP)<\/li>\n
          • F\u00f6rdelar: Undviker mekanisk p\u00e5frestning, f\u00f6rb\u00e4ttrar utbytet till >99,5%<\/li>\n<\/ul>\n<\/li>\n
          • Bearbetning av sammansatta halvledare<\/strong>\n
              \n
            • Material: GaN, SiC och andra halvledare med brett bandgap<\/li>\n
            • Funktioner: Gate notch-etsning, lasergl\u00f6dgning, exakt energistyrning f\u00f6r att f\u00f6rhindra termisk nedbrytning<\/li>\n<\/ul>\n<\/li>\n
            • Reparation av defekter och finjustering<\/strong>\n
                \n
              • Till\u00e4mpningar: Laserfusing f\u00f6r minneskretsar, avst\u00e4mning av mikrolinser f\u00f6r optiska sensorer<\/li>\n
              • Noggrannhet: Energikontroll \u00b11%, reparationspositioneringsfel <0,1 \u03bcm<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n

                \"\"<\/p>\n

                H\u00f6jdpunkter och f\u00f6rdelar<\/strong><\/span><\/h2>\n
                  \n
                • Kall, ren och kontrollerad bearbetning minimerar v\u00e4rmeskador, mikrosprickor och avsmalning<\/li>\n
                • Ultrafin vattenstr\u00e5le s\u00e4kerst\u00e4ller exakt laserstyrning och effektiv borttagning av skr\u00e4p<\/li>\n
                • L\u00e4mplig f\u00f6r h\u00e5rda, spr\u00f6da och transparenta material som SiC, GaN, diamant, LTCC och fotovoltaiska kristaller<\/li>\n
                • Kompatibel med h\u00f6gprecisionstillverkning av halvledare, avancerade f\u00f6rpackningar, komponenter f\u00f6r flyg- och rymdindustrin samt mikroelektronik<\/li>\n
                • F\u00f6rb\u00e4ttrar utbytet, minskar materialspillet och bevarar materialegenskaperna<\/li>\n<\/ul>\n

                  Certifiering och efterlevnad<\/strong><\/span><\/h2>\n
                    \n
                  • RoHS-kompatibel<\/li>\n
                  • Utformad f\u00f6r h\u00f6gprecisionsapplikationer inom halvledarindustrin<\/li>\n
                  • St\u00f6djer reproducerbar, repeterbar och automatiserad bearbetning<\/li>\n<\/ul>\n

                    VANLIGA FR\u00c5GOR<\/strong><\/span><\/h2>\n

                    1. Vilka typer av material kan bearbetas med mikrofluidisk laserutrustning?<\/strong>
                    Mikrofluidisk laserteknik kan exakt bearbeta h\u00e5rda, spr\u00f6da och bredbandiga halvledarmaterial, inklusive kisel (Si), kiselkarbid (SiC), galliumnitrid (GaN), diamant, LTCC-kolkeramiska substrat, fotovoltaiska kristaller och andra avancerade material. Den \u00e4r idealisk f\u00f6r applikationer som kr\u00e4ver minimal termisk skada och h\u00f6g ytkvalitet.<\/p>\n

                    2. Hur f\u00f6rb\u00e4ttrar mikrojetlasertekniken tillverkningen av halvledarwafers?<\/strong>
                    Genom att kombinera en submikron vattenstr\u00e5le med en laserstr\u00e5le uppn\u00e5r tekniken submikron noggrannhet samtidigt som v\u00e4rmep\u00e5verkade zoner, kontaminering och kantbrott minimeras. Den ers\u00e4tter traditionella mekaniska blad f\u00f6r t\u00e4rning, borrning och mikrostrukturering, vilket f\u00f6rb\u00e4ttrar utbytet och minskar materialspillet.<\/p>\n

                    3. Vilka till\u00e4mpningar \u00e4r mikrofluidisk laserutrustning b\u00e4st l\u00e4mpad f\u00f6r?<\/strong>
                    Denna utrustning anv\u00e4nds i stor utstr\u00e4ckning i:<\/p>\n

                      \n
                    • Wafer-dicing och stealth-dicing av ultratunna wafers (<50 \u03bcm)<\/li>\n
                    • TSV-borrning (Through-Silicon Via) och mikroh\u00e5lsarrayer f\u00f6r 3D-IC:er och kraftf\u00f6rs\u00f6rjningsenheter<\/li>\n
                    • Avancerad paketering, t.ex. RDL-f\u00f6nster\u00f6ppning, paketering p\u00e5 waferniv\u00e5 (Fan-Out WLP) och gateetsning\/lasergl\u00f6dgning f\u00f6r GaN- och SiC-halvledare<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

                      Mikrofluidisk laserutrustning anv\u00e4nder avancerad mikrojetlaserteknik f\u00f6r att ge h\u00f6gprecisionsbearbetning med l\u00e5g termisk skada f\u00f6r halvledarplattor och andra h\u00e5rda, spr\u00f6da eller material med brett bandgap.<\/p>","protected":false},"featured_media":2049,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[21],"product_tag":[554,687,691,684,57,689,693,686,681,688,682,690,694,437,683,685,692],"class_list":{"0":"post-2048","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-laser-cutting","7":"product_tag-advanced-packaging","8":"product_tag-cold-laser-machining","9":"product_tag-diamond-wafer-cutting","10":"product_tag-gan-processing","11":"product_tag-high-precision-laser-cutting","12":"product_tag-laser-defect-repair","13":"product_tag-laser-micromachining","14":"product_tag-low-thermal-damage-laser","15":"product_tag-microfluidic-laser-equipment","16":"product_tag-microhole-processing","17":"product_tag-microjet-laser-technology","18":"product_tag-photovoltaic-crystal-processing","19":"product_tag-precision-microfabrication","20":"product_tag-semiconductor-wafer-processing","21":"product_tag-sic-wafer-dicing","22":"product_tag-tsv-drilling","23":"product_tag-wide-bandgap-semiconductor","24":"desktop-align-left","25":"tablet-align-left","26":"mobile-align-left","27":"ast-product-gallery-layout-horizontal-slider","28":"ast-product-tabs-layout-horizontal","30":"first","31":"instock","32":"shipping-taxable","33":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product\/2048","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/comments?post=2048"}],"version-history":[{"count":3,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product\/2048\/revisions"}],"predecessor-version":[{"id":2057,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product\/2048\/revisions\/2057"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/media\/2049"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/media?parent=2048"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product_brand?post=2048"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product_cat?post=2048"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product_tag?post=2048"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}