![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Fully-Automatic-Precision-Dicing-Saw-Equipment-For-8inch-12inch-Wafer-Cutting6.png\")
<\/p>\nZMSH Fully Automatic Precision Dicing Saw \u00e4r ett avancerat sk\u00e4rsystem f\u00f6r halvledare och spr\u00f6da material som \u00e4r utformat f\u00f6r wafer-dicing med h\u00f6g precision. Den st\u00f6der 8-tums och 12-tums wafers samt ett brett utbud av \u00f6mt\u00e5liga material, inklusive keramik, glas, aluminiumnitrid, PZT och epoxisubstrat. Med hj\u00e4lp av diamantbladsteknik och hastigheter p\u00e5 upp till 60.000 varv\/min uppn\u00e5r systemet en sk\u00e4rnoggrannhet p\u00e5 mikroniv\u00e5 (\u00b12 \u03bcm) samtidigt som det minimerar chipping (<5 \u03bcm), vilket g\u00f6r det idealiskt f\u00f6r applikationer d\u00e4r avkastning, precision och ytintegritet \u00e4r avg\u00f6rande.<\/p>\n
<\/p>\n
Detta helautomatiska system integrerar dubbelaxliga spindlar med h\u00f6g styvhet, nanometriska positioneringssteg och intelligent visionsinriktning f\u00f6r att utf\u00f6ra alla viktiga operationer - inklusive laddning, positionering, kapning och inspektion - utan manuell inblandning. Det synkrona sk\u00e4rl\u00e4get med dubbla spindlar f\u00f6rb\u00e4ttrar bearbetningsgenomstr\u00f6mningen avsev\u00e4rt med upp till 80% j\u00e4mf\u00f6rt med konventionella enspindliga system. Importerade premiumkomponenter, inklusive kulskruvar, linj\u00e4rstyrningar och sluten styrning av Y-axelns galler, s\u00e4kerst\u00e4ller konsekvent l\u00e5ngsiktig stabilitet och bearbetningss\u00e4kerhet, \u00e4ven i produktionsmilj\u00f6er med h\u00f6ga volymer.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/fully_automatic_precision_dicing_saw_equipment_for_8inch_12inch_wafer_cutting3-300x223.webp\")
Tekniska specifikationer<\/h3>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Fully-Automatic-Precision-Dicing-Saw-Equipment-For-8inch-12inch-Wafer-Cutting4-300x240.jpg\")
Viktiga f\u00f6rdelar<\/h3>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Fully-Automatic-Precision-Dicing-Saw-Equipment-For-8inch-12inch-Wafer-Cutting5-300x240.jpg\")
Centrala funktioner<\/h3>\nZMSH-precisionss\u00e5gen \u00e4r kompatibel med ett brett utbud av material och ger skr\u00e4ddarsydda sk\u00e4rl\u00f6sningar f\u00f6r moderna f\u00f6rpackningar f\u00f6r halvledare och elektronik:<\/p>\n
| Material<\/th>\n | Typiska till\u00e4mpningar<\/th>\n | Krav p\u00e5 bearbetning<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|---|
| Aluminiumnitrid (AlN)<\/td>\n | LED-substrat, termiska substrat med h\u00f6g effekt<\/td>\n | T\u00e4rning med l\u00e5g p\u00e5frestning, f\u00f6rhindrande av delaminering<\/td>\n<\/tr>\n |
| PZT keramik<\/td>\n | 5G-filter, SAW-enheter<\/td>\n | H\u00f6gfrekvent stabilitetssk\u00e4rning<\/td>\n<\/tr>\n |
| Vismut-tellurid (Bi\u2082Te\u2083)<\/td>\n | Termoelektriska moduler<\/td>\n | Bearbetning vid l\u00e5g temperatur<\/td>\n<\/tr>\n |
| Monokristallint kisel (Si)<\/td>\n | IC-chip<\/td>\n | Submikron noggrannhet vid t\u00e4rning<\/td>\n<\/tr>\n |
| Epoxi gjutmassa<\/td>\n | BGA-substrat<\/td>\n | Kompatibilitet med flerskiktsmaterial<\/td>\n<\/tr>\n |
| Cu-pelare \/ PI-dielektrikum<\/td>\n | WLCSP<\/td>\n | Bearbetning av ultratunna wafers<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\nTill\u00e4mpningar och f\u00f6rdelar<\/h3>\nDen helautomatiska ZMSH-s\u00e5gen \u00e4r l\u00e4mplig f\u00f6r tillverkning av halvledare, avancerade f\u00f6rpackningar, LED-produktion, MEMS-enheter och termoelektriska moduler. Dess precision s\u00e4kerst\u00e4ller h\u00f6gt utbyte, minimal skada p\u00e5 wafern och j\u00e4mn snittkvalitet, \u00e4ven vid bearbetning av \u00f6mt\u00e5liga eller ultratunna wafers. Kombinationen av automation, dubbelspindlig sk\u00e4rning och felkorrigering i realtid g\u00f6r den idealisk f\u00f6r industriella applikationer med h\u00f6g kapacitet.<\/p>\n Vanliga fr\u00e5gor och svar<\/h3>\nF1: Vilka material kan sk\u00e4ras med det h\u00e4r systemet? Q2: Hur f\u00f6rb\u00e4ttrar dubbelspindell\u00e4get produktionen? F3: \u00c4r systemet helt automatiserat? Q4: Hur tunn wafer kan den bearbeta? Q5: Kan systemet integreras i befintliga automationslinjer i fabriker? Den helautomatiska precisionss\u00e5gen ZMSH \u00e4r ett avancerat sk\u00e4rsystem f\u00f6r halvledare och spr\u00f6da material som \u00e4r utformat f\u00f6r wafer-dicing med h\u00f6g precision.<\/p>","protected":false},"featured_media":2007,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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