{"id":1939,"date":"2026-03-17T06:13:23","date_gmt":"2026-03-17T06:13:23","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=1939"},"modified":"2026-03-20T07:40:21","modified_gmt":"2026-03-20T07:40:21","slug":"diamond-wire-single-multiple-wire-saw-machine-for-semiconductor-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/sv\/product\/diamond-wire-single-multiple-wire-saw-machine-for-semiconductor-wafer-processing\/","title":{"rendered":"Diamanttr\u00e5d Enkel \/ Multipel tr\u00e5ds\u00e5gmaskin f\u00f6r bearbetning av halvledarskivor"},"content":{"rendered":"

\"\"Diamantvajers\u00e5gen med enkel\/multitr\u00e5d och dubbla stationer \u00e4r en avancerad precisionsutrustning f\u00f6r bearbetning av h\u00e5rda och spr\u00f6da material. Den anv\u00e4nder elektropl\u00e4terad diamantvajerteknik och har dubbla oberoende arbetsstationer, vilket m\u00f6jligg\u00f6r flexibel v\u00e4xling mellan precisionsl\u00e4ge med en vajer och batchproduktionsl\u00e4ge med flera vajrar.<\/p>\n

Den \u00e4r utrustad med r\u00f6relsestyrning med h\u00f6g precision, intelligenta sp\u00e4nningssystem och adaptiv kylteknik och \u00e4r idealisk f\u00f6r precisionssk\u00e4rning av halvledarwafers, kiselwafers f\u00f6r fotovoltaik och optiska komponenter.<\/p>\n

Tekniska specifikationer<\/strong><\/span><\/h2>\n
\n
\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Parameter<\/th>\nSpecifikation<\/th>\n<\/tr>\n<\/thead>\n
Projekt<\/td>\nEnkel-\/multipelvajers\u00e5g<\/td>\n<\/tr>\n
Maximal storlek p\u00e5 arbetsstycket<\/td>\n\u00f8320\u00d7430mm<\/td>\n<\/tr>\n
Huvudrullens bel\u00e4ggningsdiameter<\/td>\n\u00f8210\u00d7450 mm (5 huvudrullar)<\/td>\n<\/tr>\n
Hastighet f\u00f6r tr\u00e5dk\u00f6rning<\/td>\n1000 (MIX) m\/min<\/td>\n<\/tr>\n
Diamanttr\u00e5dens diameter<\/td>\n0,2-0,37 mm<\/td>\n<\/tr>\n
Linjens lagringskapacitet<\/td>\n20 km (0,25 mm tr\u00e5ddiameter)<\/td>\n<\/tr>\n
Omr\u00e5de f\u00f6r sk\u00e4rningstjocklek<\/td>\n1,5-80 mm<\/td>\n<\/tr>\n
Sk\u00e4rningsnoggrannhet<\/td>\n\u00b10,01 mm<\/td>\n<\/tr>\n
Vertikal lyftr\u00f6relse f\u00f6r arbetsstation<\/td>\n350 mm<\/td>\n<\/tr>\n
Sk\u00e4rmetod<\/td>\nArbetsb\u00e4nken sv\u00e4nger upp\u00e5t, diamantvajern st\u00e5r stilla<\/td>\n<\/tr>\n
Sk\u00e4rande matningshastighet<\/td>\n0,01-10mm\/min<\/td>\n<\/tr>\n
Arbetsstation<\/td>\n2<\/td>\n<\/tr>\n
Vattentank<\/td>\n300L<\/td>\n<\/tr>\n
Sk\u00e4rv\u00e4tska<\/td>\nRostskyddande h\u00f6geffektiv sk\u00e4rv\u00e4tska<\/td>\n<\/tr>\n
Sv\u00e4ngvinkel<\/td>\n\u00b18\u00b0<\/td>\n<\/tr>\n
Sv\u00e4nghastighet<\/td>\n0.83\u00b0\/s<\/td>\n<\/tr>\n
Maximal sk\u00e4rsp\u00e4nning<\/td>\n100N (minsta enhet 0,1N)<\/td>\n<\/tr>\n
Sk\u00e4rdjup<\/td>\n430 mm<\/td>\n<\/tr>\n
Str\u00f6mf\u00f6rs\u00f6rjning<\/td>\nTrefas femtr\u00e5dig AC380V\/50Hz<\/td>\n<\/tr>\n
Total effekt<\/td>\n\u226452kW<\/td>\n<\/tr>\n
Huvudmotor<\/td>\n7,5\u00d73 kW<\/td>\n<\/tr>\n
Kabeldragning motor<\/td>\n0,75\u00d72kW<\/td>\n<\/tr>\n
Arbetsb\u00e4nk Swing Motor<\/td>\n1,3\u00d72 kW<\/td>\n<\/tr>\n
Motor f\u00f6r sp\u00e4nningsreglering<\/td>\n4,4\u00d72 kW<\/td>\n<\/tr>\n
Motor f\u00f6r frig\u00f6ring och uppsamling av tr\u00e5d<\/td>\n5,5\u00d72 kW<\/td>\n<\/tr>\n
Yttre m\u00e5tt<\/td>\n2310\u00d72660\u00d72893mm<\/td>\n<\/tr>\n
Maskinens vikt<\/td>\n6000 kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

\"\"Arbetsprincip<\/strong><\/span><\/h2>\n
    \n
  1. \n

    Kapningssystem<\/strong><\/p>\n

      \n
    • \n

      Diamantvajern bildar en sluten r\u00f6relse som drivs av servomotorer (justerbar 0,5-3 m\/s)<\/p>\n<\/li>\n

    • \n

      Tr\u00e5dsp\u00e4nningen \u00f6vervakas i realtid via h\u00f6gprecisionssensorer (20-50N)<\/p>\n<\/li>\n

    • \n

      Arbetsbord med linj\u00e4r motordrift ger positioneringsnoggrannhet p\u00e5 \u00b11 \u03bcm<\/p>\n<\/li>\n<\/ul>\n<\/li>\n

    • \n

      Koordinering av dubbla stationer<\/strong><\/p>\n

        \n
      • \n

        Station A:<\/strong> Single-wire-l\u00e4ge (min. diameter 0,1 mm) f\u00f6r bearbetning med h\u00f6g precision<\/p>\n<\/li>\n

      • \n

        Station B:<\/strong> Multitr\u00e5dsl\u00e4ge (upp till 200 tr\u00e5dar) f\u00f6r massproduktion<\/p>\n<\/li>\n

      • \n

        B\u00e5da stationerna kan arbeta synkront med automatiserad \u00f6verf\u00f6ring av arbetsstycken via robotarm<\/p>\n<\/li>\n<\/ul>\n<\/li>\n

      • \n

        Styrsystem<\/strong><\/p>\n

          \n
        • \n

          PLC + PC-arkitektur som st\u00f6der programmering med G-kod<\/p>\n<\/li>\n

        • \n

          Positioneringssystem f\u00f6r maskinseende med 5 \u03bcm repeterbarhet<\/p>\n<\/li>\n

        • \n

          Realtids\u00f6vervakning av \u00f6ver 20 processparametrar, inklusive sk\u00e4rkraft och temperatur<\/p>\n<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n

          Centrala funktioner<\/strong><\/span><\/h2>\n
            \n
          1. \n

            H\u00f6gprecisionsbearbetning<\/strong><\/p>\n

              \n
            • \n

              Submikron-noggrannhet med luftlagrad spindel och linj\u00e4r motordrift<\/p>\n<\/li>\n

            • \n

              Adaptiv sp\u00e4nningskontroll f\u00f6r stabil klippning<\/p>\n<\/li>\n

            • \n

              Avancerat kylsystem f\u00f6r kontroll av bearbetningstemperaturen<\/p>\n<\/li>\n<\/ul>\n<\/li>\n

            • \n

              Flexibla produktionsmetoder<\/strong><\/p>\n

                \n
              • \n

                H\u00f6gprecisionsl\u00e4ge med en station f\u00f6r FoU och sm\u00e5 serier<\/p>\n<\/li>\n

              • \n

                Parallell bearbetning i flera stationer f\u00f6r h\u00f6g effektivitet<\/p>\n<\/li>\n

              • \n

                Snabbv\u00e4xlingsfunktionalitet f\u00f6r olika produktionskrav<\/p>\n<\/li>\n<\/ul>\n<\/li>\n

              • \n

                Intelligent styrsystem<\/strong><\/p>\n

                  \n
                • \n

                  Avancerad HMI f\u00f6r anv\u00e4ndarv\u00e4nlig drift<\/p>\n<\/li>\n

                • \n

                  Realtids\u00f6vervakning och automatisk optimering av viktiga parametrar<\/p>\n<\/li>\n

                • \n

                  Funktioner f\u00f6r fj\u00e4rrdiagnostik och fj\u00e4rrunderh\u00e5ll<\/p>\n<\/li>\n<\/ul>\n<\/li>\n

                • \n

                  Robust och t\u00e5lig design<\/strong><\/p>\n

                    \n
                  • \n

                    H\u00f6gh\u00e5llfasta, slitstarka material f\u00f6r kritiska komponenter<\/p>\n<\/li>\n

                  • \n

                    Modul\u00e4r struktur underl\u00e4ttar underh\u00e5ll<\/p>\n<\/li>\n

                  • \n

                    Omfattande skyddssystem f\u00f6rl\u00e4nger utrustningens livsl\u00e4ngd<\/p>\n<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n

                    Till\u00e4mpningar<\/strong><\/span><\/h2>\n
                      \n
                    1. \n

                      Tillverkning av halvledarwafers<\/strong><\/p>\n

                        \n
                      • \n

                        Sk\u00e4rning av SiC\/GaN-str\u00f6mf\u00f6rs\u00f6rjningsenheter f\u00f6r elbilar och 5G<\/p>\n<\/li>\n

                      • \n

                        Safirsubstrat f\u00f6r lysdioder och konsumentelektronik<\/p>\n<\/li>\n

                      • \n

                        T\u00e4rning av MEMS-sensorchip<\/p>\n<\/li>\n<\/ul>\n<\/li>\n

                      • \n

                        Fotovoltaisk produktion<\/strong><\/p>\n

                          \n
                        • \n

                          Skivning av stora monokristallina kiselskivor<\/p>\n<\/li>\n

                        • \n

                          Bearbetning av heterojunction-solceller<\/p>\n<\/li>\n

                        • \n

                          Sk\u00e4rning av ultratunna kiselskivor (<120 \u03bcm)<\/p>\n<\/li>\n<\/ul>\n<\/li>\n

                        • \n

                          Optisk komponentbearbetning<\/strong><\/p>\n

                            \n
                          • \n

                            Optiska element av kvartsglas<\/p>\n<\/li>\n

                          • \n

                            Laserkristaller (YAG, safir)<\/p>\n<\/li>\n

                          • \n

                            Infrar\u00f6da optiska f\u00f6nster<\/p>\n<\/li>\n<\/ul>\n<\/li>\n

                          • \n

                            Bearbetning av specialmaterial<\/strong><\/p>\n

                              \n
                            • \n

                              Keramiska substrat av AlN \/ Al\u2082O\u2083<\/p>\n<\/li>\n

                            • \n

                              Kompositmaterial av kiselkarbid<\/p>\n<\/li>\n

                            • \n

                              Ultrah\u00e5rda material (CVD-diamant)<\/p>\n<\/li>\n<\/ul>\n<\/li>\n

                            • \n

                              Forskning och specialapplikationer<\/strong><\/p>\n

                                \n
                              • \n

                                Prototypframtagning av nya halvledarmaterial<\/p>\n<\/li>\n

                              • \n

                                Utveckling av mikroenheter<\/p>\n<\/li>\n

                              • \n

                                Skr\u00e4ddarsydd provberedning<\/p>\n<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n

                                Tekniska f\u00f6rdelar<\/strong><\/span><\/h2>\n
                                  \n
                                • \n

                                  Stabil bearbetningskvalitet med >99,5% utbyte<\/p>\n<\/li>\n

                                • \n

                                  Anpassningsbar till olika h\u00e5rda\/spr\u00f6da material<\/p>\n<\/li>\n

                                • \n

                                  Betydligt h\u00f6gre produktivitet \u00e4n konventionella metoder<\/p>\n<\/li>\n

                                • \n

                                  Enkel drift och l\u00e5g total \u00e4gandekostnad (TCO)<\/p>\n<\/li>\n

                                • \n

                                  Kundanpassade l\u00f6sningar tillg\u00e4ngliga, inklusive renrumsversioner och specialm\u00e5tt<\/p>\n<\/li>\n<\/ul>\n

                                  VANLIGA FR\u00c5GOR<\/strong><\/span><\/h2>\n

                                  F: Vilken \u00e4r den st\u00f6rsta f\u00f6rdelen med en diamantvajers\u00e5g med dubbla stationer?<\/strong>
                                  A:<\/strong> M\u00f6jligg\u00f6r samtidig precisionssk\u00e4rning med en tr\u00e5d och batchbearbetning med flera tr\u00e5dar, vilket \u00f6kar produktiviteten med 50% j\u00e4mf\u00f6rt med single-mode-maskiner.<\/p>\n

                                  F: Vilka material kan kapas med diamantvajers\u00e5gar med dubbla stationer?<\/strong>
                                  A:<\/strong> H\u00e5rda och spr\u00f6da material som kisel, SiC, GaN, safir, kvarts och keramik, med en precision p\u00e5 upp till \u00b10,01 mm.<\/p>","protected":false},"excerpt":{"rendered":"

                                  Diamantvajers\u00e5gen med enkel\/multitr\u00e5d och dubbla stationer \u00e4r en avancerad precisionsutrustning f\u00f6r bearbetning av h\u00e5rda och spr\u00f6da material. Den anv\u00e4nder elektropl\u00e4terad diamantvajerteknik och har dubbla oberoende arbetsstationer, vilket m\u00f6jligg\u00f6r flexibel v\u00e4xling mellan precisionsl\u00e4ge med en vajer och batchproduktionsl\u00e4ge med flera vajrar.<\/p>","protected":false},"featured_media":1940,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[22],"product_tag":[434,424,446,435,450,418,440,448,449,447,436,444,442,443,445,441,437,439,417,438],"class_list":{"0":"post-1939","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-wire-saw-machine","7":"product_tag-advanced-manufacturing-equipment","8":"product_tag-brittle-material-processing","9":"product_tag-ceramic-cutting-machine","10":"product_tag-diamond-wire-saw-machine","11":"product_tag-dual-station-wire-saw","12":"product_tag-dual-station-cutting-machine","13":"product_tag-gan-wafer-cutting","14":"product_tag-high-precision-wire-saw","15":"product_tag-industrial-cutting-machine","16":"product_tag-mems-wafer-dicing","17":"product_tag-multi-wire-saw","18":"product_tag-optical-material-cutting","19":"product_tag-photovoltaic-silicon-wafer-cutting","20":"product_tag-precision-cutting-equipment","21":"product_tag-quartz-glass-cutting","22":"product_tag-sapphire-cutting-machine","23":"product_tag-semiconductor-wafer-processing","24":"product_tag-sic-wafer-cutting","25":"product_tag-single-wire-saw","26":"product_tag-wafer-slicing-machine","27":"desktop-align-left","28":"tablet-align-left","29":"mobile-align-left","30":"ast-product-gallery-layout-horizontal-slider","31":"ast-product-tabs-layout-horizontal","33":"first","34":"instock","35":"shipping-taxable","36":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product\/1939","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/comments?post=1939"}],"version-history":[{"count":3,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product\/1939\/revisions"}],"predecessor-version":[{"id":1947,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product\/1939\/revisions\/1947"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/media\/1940"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/media?parent=1939"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product_brand?post=1939"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product_cat?post=1939"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/product_tag?post=1939"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}