{"id":2558,"date":"2026-06-16T01:53:41","date_gmt":"2026-06-16T01:53:41","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2558"},"modified":"2026-06-16T01:53:46","modified_gmt":"2026-06-16T01:53:46","slug":"what-is-wafer-tir-and-how-is-it-different-from-ttv","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/sv\/what-is-wafer-tir-and-how-is-it-different-from-ttv\/","title":{"rendered":"Vad \u00e4r Wafer TIR och hur skiljer det sig fr\u00e5n TTV?"},"content":{"rendered":"<p>I <a href=\"https:\/\/www.zmsh-semitech.com\/sv\/products\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">tillverkning av halvledare<\/mark><\/a>, spelar wafergeometrin en avg\u00f6rande roll f\u00f6r processstabiliteten, litografins noggrannhet, bindningskvaliteten och, i slut\u00e4ndan, utbytet av halvledarkomponenter. I takt med att waferdiametrarna forts\u00e4tter att \u00f6ka och avancerade f\u00f6rpackningstekniker st\u00e4ller allt h\u00f6gre krav har behovet av precis wafermetrologi aldrig varit st\u00f6rre.<\/p>\n\n\n\n<p>Bland de m\u00e5nga parametrar som anv\u00e4nds f\u00f6r att bed\u00f6ma skivornas kvalitet, <strong>Total tjockleksvariation (TTV)<\/strong> och <strong>Total indikerad avl\u00e4sning (TIR)<\/strong> f\u00f6rekommer ofta. \u00c4ven om b\u00e5da m\u00e5tten har att g\u00f6ra med skivans tjocklek och planhet, beskriver de olika fysiska egenskaper och missf\u00f6rst\u00e5s ofta.<\/p>\n\n\n\n<p>I den h\u00e4r artikeln redog\u00f6rs f\u00f6r definitioner, m\u00e4tmetoder, till\u00e4mpningar och de viktigaste skillnaderna mellan TIR och TTV, vilket hj\u00e4lper ingenj\u00f6rer att b\u00e4ttre f\u00f6rst\u00e5 specifikationerna f\u00f6r wafergeometri.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"512\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-1024x512.png\" alt=\"\" class=\"wp-image-2559\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-1024x512.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-300x150.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-768x384.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-1536x768.png 1536w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-2048x1024.png 2048w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-18x9.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-600x300.png 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Att f\u00f6rst\u00e5 m\u00e4tningar av skivtjocklek<\/h2>\n\n\n\n<p><a href=\"https:\/\/www.zmsh-semitech.com\/sv\/produkt-kategori\/wafer\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">Halvledarskiva<\/mark>s<\/a> f\u00f6rv\u00e4ntas ha en mycket j\u00e4mn tjocklek \u00f6ver hela ytan. \u00c4ven sm\u00e5 variationer kan p\u00e5verka:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Fokusnoggrannhet vid litografi<\/li>\n\n\n\n<li>Hantering och transport av skivor<\/li>\n\n\n\n<li>Processer f\u00f6r skivbindning<\/li>\n\n\n\n<li>CMP:s prestanda<\/li>\n\n\n\n<li>Enhetens tillf\u00f6rlitlighet och utbyte<\/li>\n<\/ul>\n\n\n\n<p>F\u00f6r att utv\u00e4rdera tjocklekens j\u00e4mnhet anv\u00e4nder tillverkarna flera geometriska parametrar, bland annat:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Tjocklek<\/li>\n\n\n\n<li>TTV (total tjockleksvariation)<\/li>\n\n\n\n<li>B\u00e5ge<\/li>\n\n\n\n<li>Varp<\/li>\n\n\n\n<li>TIR (total angiven avl\u00e4sning)<\/li>\n<\/ul>\n\n\n\n<p>Varje parameter ger unik information om skivans fysiska tillst\u00e5nd.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Vad \u00e4r <a href=\"https:\/\/www.zmsh-semitech.com\/sv\/what-are-wafer-ttv-bow-and-warp\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">TTV (total tjockleksvariation)<\/mark><\/a>?<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Definition<\/h3>\n\n\n\n<p>TTV st\u00e5r f\u00f6r skillnaden mellan den st\u00f6rsta och den minsta tjockleken som uppm\u00e4tts \u00f6ver en wafer.<\/p>\n\n\n\n<p>Matematiskt sett:<\/p>\n\n\n\n<p><strong>TTV = Maximal tjocklek \u2212 Minimal tjocklek<\/strong><\/p>\n\n\n\n<p>TTV fokuserar uteslutande p\u00e5 tjockleksj\u00e4mnheten och tar inte h\u00e4nsyn till skivans orientering eller rotationsbeteende.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">M\u00e4tprincip<\/h3>\n\n\n\n<p>Tjockleksm\u00e4tningar utf\u00f6rs vid flera punkter \u00f6ver hela skivans yta med hj\u00e4lp av:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kapacitiva sensorer<\/li>\n\n\n\n<li>Optiska interferometrar<\/li>\n\n\n\n<li>Kontaktbaserade tjockleksm\u00e4tare<\/li>\n\n\n\n<li>Laserm\u00e4tningssystem<\/li>\n<\/ul>\n\n\n\n<p>De h\u00f6gsta och l\u00e4gsta tjockleksv\u00e4rdena identifieras, och skillnaden mellan dem blir TTV-v\u00e4rdet.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Exempel<\/h3>\n\n\n\n<p>Om en skivans tjocklek ligger inom intervallet:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Maximal tjocklek: 726 \u03bcm<\/li>\n\n\n\n<li>Minsta tjocklek: 721 \u03bcm<\/li>\n<\/ul>\n\n\n\n<p>Sedan:<\/p>\n\n\n\n<p><strong>TTV = 726 \u2212 721 = 5 \u03bcm<\/strong><\/p>\n\n\n\n<p>Ett l\u00e4gre TTV-v\u00e4rde indikerar b\u00e4ttre tjockleksj\u00e4mnhet.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Vad \u00e4r TIR (Total Indicated Reading)?<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Definition<\/h3>\n\n\n\n<p>TIR m\u00e4ter den totala variationen som observeras n\u00e4r en skiva roteras runt sin mittaxel.<\/p>\n\n\n\n<p>Till skillnad fr\u00e5n TTV \u00e5terspeglar TIR den sammantagna p\u00e5verkan av:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Tjockleksvariation<\/li>\n\n\n\n<li>Ytfel<\/li>\n\n\n\n<li>Skivans excentricitet<\/li>\n\n\n\n<li>Fel i monteringen av armaturer<\/li>\n\n\n\n<li>Ytavvikelse<\/li>\n<\/ul>\n\n\n\n<p>TIR anv\u00e4nds ofta inom finmekanik och m\u00e4tteknik.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">M\u00e4tprincip<\/h3>\n\n\n\n<p>Wafern \u00e4r monterad p\u00e5 en spindel och roteras 360 grader samtidigt som en f\u00f6rskjutningssensor kontinuerligt registrerar ytr\u00f6relser.<\/p>\n\n\n\n<p>Skillnaden mellan det h\u00f6gsta och det l\u00e4gsta m\u00e4tv\u00e4rdet under rotationen definieras som:<\/p>\n\n\n\n<p><strong>TIR = indikatorns h\u00f6gsta v\u00e4rde \u2212 indikatorns l\u00e4gsta v\u00e4rde<\/strong><\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Exempel<\/h3>\n\n\n\n<p>Under rotation:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>H\u00f6gsta m\u00e4tv\u00e4rde: +3 \u03bcm<\/li>\n\n\n\n<li>L\u00e4gsta m\u00e4tv\u00e4rde: \u22124 \u03bcm<\/li>\n<\/ul>\n\n\n\n<p>Sedan:<\/p>\n\n\n\n<p><strong>TIR = 3 \u2212 (\u22124) = 7 \u03bcm<\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">TTV j\u00e4mf\u00f6rt med TIR: De viktigaste skillnaderna<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th>Parameter<\/th><th>TTV<\/th><th>TIR<\/th><\/tr><tr><td>Fullst\u00e4ndigt namn<\/td><td>Total tjockleksvariation<\/td><td>Total angiven avl\u00e4sning<\/td><\/tr><tr><td>Huvudsyfte<\/td><td>Enhetlig tjocklek<\/td><td>Variationer i rotationsytan<\/td><\/tr><tr><td>M\u00e4ter tjockleken?<\/td><td>Ja<\/td><td>Delvis<\/td><\/tr><tr><td>P\u00e5verkas det av ytans form?<\/td><td>Nej<\/td><td>Ja<\/td><\/tr><tr><td>P\u00e5verkas det av waferns excentricitet?<\/td><td>Nej<\/td><td>Ja<\/td><\/tr><tr><td>Kr\u00e4ver rotation?<\/td><td>Nej<\/td><td>Ja<\/td><\/tr><tr><td>Typisk till\u00e4mpning<\/td><td>Kvalificering av halvledarskivor<\/td><td>Precisionsm\u00e4tteknik och justering av utrustning<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Den viktigaste skillnaden \u00e4r att:<\/p>\n\n\n\n<p><strong>TTV m\u00e4ter tjockleksvariationer direkt, medan TIR m\u00e4ter den totala positionsvariationen under rotation.<\/strong><\/p>\n\n\n\n<p>Detta inneb\u00e4r att TIR-v\u00e4rdena ofta \u00e4r st\u00f6rre \u00e4n TTV-v\u00e4rdena, eftersom ytterligare geometriska fel ing\u00e5r.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Sambandet mellan TIR och TTV<\/h2>\n\n\n\n<p>\u00c4ven om TIR och TTV \u00e4r besl\u00e4ktade begrepp \u00e4r de inte utbytbara.<\/p>\n\n\n\n<p>I en idealisk skiva:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Perfekt centrering<\/li>\n\n\n\n<li>Perfekt spindelinriktning<\/li>\n\n\n\n<li>Inga oj\u00e4mnheter i ytan<\/li>\n<\/ul>\n\n\n\n<p>TIR kan n\u00e4rma sig TTV-v\u00e4rdet.<\/p>\n\n\n\n<p>I verkliga tillverkningsmilj\u00f6er p\u00e5verkas TIR dock vanligtvis av ytterligare faktorer:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Ytavvikelse<\/h3>\n\n\n\n<p>Mikroskopiska oj\u00e4mnheter eller lokala defekter kan leda till h\u00f6gre m\u00e4tv\u00e4rden.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Skivans excentricitet<\/h3>\n\n\n\n<p>Om skivans centrum inte \u00e4r perfekt inriktat mot spindelaxeln \u00f6kar TIR.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Fel i spelprogrammet<\/h3>\n\n\n\n<p>Chuckens planhet och monteringsnoggrannheten kan bidra till m\u00e4tvariationer.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Mekaniska vibrationer<\/h3>\n\n\n\n<p>Instabilitet i utrustningen kan orsaka m\u00e4tbrus.<\/p>\n\n\n\n<p>F\u00f6ljaktligen:<\/p>\n\n\n\n<p><strong>TIR \u00e4r st\u00f6rre \u00e4n TTV i de flesta praktiska situationer.<\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Varf\u00f6r TIR \u00e4r viktigt inom halvledartillverkningen<\/h2>\n\n\n\n<p>I takt med att skivornas diameter \u00f6kar fr\u00e5n 150 mm och 200 mm till 300 mm och \u00e4nnu st\u00f6rre blir den geometriska precisionen allt viktigare.<\/p>\n\n\n\n<p>TIR-m\u00e4tningar anv\u00e4nds ofta inom:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Slipning av skivor<\/h3>\n\n\n\n<p>\u00d6vervakning av spindelns noggrannhet under bakslipningsprocesser.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Polering av kiselskivor<\/h3>\n\n\n\n<p>Utv\u00e4rdering av rotationsstabiliteten under CMP-processer.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">System f\u00f6r inspektion av kiselskivor<\/h3>\n\n\n\n<p>S\u00e4kerst\u00e4ller korrekt positionering och fokusering.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Wafer-bondning<\/h3>\n\n\n\n<p>Minskning av inriktningsfel i avancerade f\u00f6rpackningstill\u00e4mpningar.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">MEMS-tillverkning<\/h3>\n\n\n\n<p>Att uppr\u00e4tth\u00e5lla strikta krav p\u00e5 planhet f\u00f6r mikroelektromekaniska strukturer.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Typiska branschkrav<\/h2>\n\n\n\n<p>Vilka TTV- och TIR-v\u00e4rden som \u00e4r acceptabla beror p\u00e5 typen av kiselplatta och anv\u00e4ndningsomr\u00e5det.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Kiselplattor<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td>Diameter<\/td><td>Typisk TTV<\/td><\/tr><tr><td>150 mm<\/td><td>&lt; 5 \u03bcm<\/td><\/tr><tr><td>200 mm<\/td><td>&lt; 3 \u03bcm<\/td><\/tr><tr><td>300 mm<\/td><td>&lt; 1 \u03bcm<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\">Avancerade SiC-skivor<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td>Diameter<\/td><td>Typisk TTV<\/td><\/tr><tr><td>6 tum<\/td><td>&lt; 10 \u03bcm<\/td><\/tr><tr><td>8 tum<\/td><td>&lt; 5 \u03bcm<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>TIR-specifikationerna fastst\u00e4lls i allm\u00e4nhet av utrustningstillverkarna och utifr\u00e5n processkraven, snarare \u00e4n enbart utifr\u00e5n standarder f\u00f6r substrat.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">TIR, TTV, b\u00e5ge och skevhet: En helhetsbild<\/h2>\n\n\n\n<p>Ingen enskild parameter kan fullst\u00e4ndigt beskriva skivans geometri.<\/p>\n\n\n\n<p>Ingenj\u00f6rer utv\u00e4rderar vanligtvis:<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td>Parameter<\/td><td>Beskrivning<\/td><\/tr><tr><td>Tjocklek<\/td><td>Genomsnittlig skivtjocklek<\/td><\/tr><tr><td>TTV<\/td><td>J\u00e4mnhet i tjocklek<\/td><\/tr><tr><td>TIR<\/td><td>Rotationsvariation<\/td><\/tr><tr><td>B\u00e5ge<\/td><td>F\u00f6rskjutning i centrum fr\u00e5n referensplanet<\/td><\/tr><tr><td>Varp<\/td><td>Total deformation av skivan<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Tillsammans ger dessa m\u00e4tningar en helt\u00e4ckande bild av skivornas kvalitet och processkompatibiliteten.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Slutsats<\/h2>\n\n\n\n<p>TTV och TIR \u00e4r b\u00e5da viktiga m\u00e4tparametrar f\u00f6r kiselskivor, men de har olika syften.<\/p>\n\n\n\n<p>TTV kvantifierar tjockleksj\u00e4mnheten \u00f6ver hela skivans yta, vilket g\u00f6r det till en avg\u00f6rande specifikation f\u00f6r substrattillverkare och halvledarfabriker. TIR m\u00e4ter d\u00e4remot den totala positionsvariationen under rotation och \u00e5terspeglar de sammantagna effekterna av tjockleksvariationer, ytoregelbundenheter och mekanisk inriktning.<\/p>\n\n\n\n<p>I takt med att halvledartillverkningen forts\u00e4tter att utvecklas mot st\u00f6rre skivdiametrar, avancerad f\u00f6rpackning och sn\u00e4vare processtoleranser blir det allt viktigare f\u00f6r ingenj\u00f6rer som arbetar med skivproduktion, inspektion och tillverkning av komponenter att f\u00f6rst\u00e5 skillnaden mellan TTV och TIR.<\/p>\n\n\n\n<p>Genom att noggrant utv\u00e4rdera b\u00e5da parametrarna kan tillverkarna f\u00f6rb\u00e4ttra processstabiliteten, utrustningens prestanda och den totala avkastningen f\u00f6r enheterna.<\/p>","protected":false},"excerpt":{"rendered":"<p>In semiconductor manufacturing, wafer geometry plays a critical role in determining process stability, lithography accuracy, bonding quality, and ultimately device yield. As wafer diameters continue to increase and advanced packaging technologies become more demanding, the need for precise wafer metrology has never been greater. Among the many parameters used to evaluate wafer quality, Total Thickness [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2559,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[25],"tags":[1522,383,1524,36,195,637,1090,1520,130,1518,372,1515,1521,714,1517,1523,1519,873,131],"class_list":["post-2558","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technology-applications","tag-cmp-process","tag-precision-metrology","tag-semiconductor-engineering","tag-semiconductor-manufacturing","tag-semiconductor-materials","tag-sic-wafer","tag-silicon-wafer","tag-total-indicated-reading","tag-total-thickness-variation","tag-wafer-bow","tag-wafer-flatness","tag-wafer-geometry","tag-wafer-grinding","tag-wafer-inspection","tag-wafer-metrology","tag-wafer-thickness-measurement","tag-wafer-tir","tag-wafer-ttv","tag-wafer-warp"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/posts\/2558","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/comments?post=2558"}],"version-history":[{"count":1,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/posts\/2558\/revisions"}],"predecessor-version":[{"id":2560,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/posts\/2558\/revisions\/2560"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/media\/2559"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/media?parent=2558"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/categories?post=2558"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/tags?post=2558"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}