{"id":2466,"date":"2026-05-14T06:21:48","date_gmt":"2026-05-14T06:21:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2466"},"modified":"2026-05-14T06:22:03","modified_gmt":"2026-05-14T06:22:03","slug":"wafer-notching-and-coring-processes","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/sv\/wafer-notching-and-coring-processes\/","title":{"rendered":"Wafer Notching och Coring-processer vid 300 mm halvledartillverkning"},"content":{"rendered":"<p>Inom 300 mm halvledartillverkning \u00e4r wafer notching och coring kritiska mekaniska processer som anv\u00e4nds f\u00f6r att f\u00f6rbereda kiselwafers f\u00f6r tillverkningssteg nedstr\u00f6ms. Dessa processer s\u00e4kerst\u00e4ller korrekt orientering av wafern, strukturell integritet och kompatibilitet med automatiserade hanteringssystem i avancerade fabriker.<\/p>\n\n\n\n<p>I takt med att skivstorlekarna forts\u00e4tter att \u00f6ka och processnoderna blir allt mer avancerade har precisionen i den mekaniska skivformningen blivit allt viktigare f\u00f6r att kontrollera utbytet och utrustningens kompatibilitet.<\/p>\n\n\n\n<p>I den h\u00e4r artikeln f\u00f6rklaras vad wafer notching och coring \u00e4r, hur de utf\u00f6rs och varf\u00f6r de \u00e4r viktiga i modern halvledarproduktion.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"533\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH.jpg\" alt=\"\" class=\"wp-image-2467\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH.jpg 800w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-300x200.jpg 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-768x512.jpg 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-18x12.jpg 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-600x400.jpg 600w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Vad \u00e4r Wafer Notching?<\/h2>\n\n\n\n<p>Wafer notching \u00e4r en process d\u00e4r man skapar ett litet, exakt positionerat snitt (notch) p\u00e5 kanten av en kiselskiva. Denna sk\u00e5ra fungerar som en orienteringsreferens f\u00f6r automatiserade system.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Syftet med waferhackning<\/h3>\n\n\n\n<p>De prim\u00e4ra funktionerna f\u00f6r wafer notching inkluderar:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Justering av kristallorientering<\/strong> (t.ex.  eller  kiselorientering)<\/li>\n\n\n\n<li><strong>Referens f\u00f6r positionering av utrustning<\/strong> f\u00f6r robothanteringssystem<\/li>\n\n\n\n<li><strong>Processkonsistens mellan litografi-, etsnings- och deponeringssteg<\/strong><\/li>\n\n\n\n<li><strong>Automationskompatibilitet i 300 mm-fabriker<\/strong><\/li>\n<\/ul>\n\n\n\n<p>P\u00e5 300 mm wafers \u00e4r sk\u00e5ran en standardiserad funktion som g\u00f6r det m\u00f6jligt f\u00f6r utrustningen att identifiera waferorienteringen utan manuella ingrepp.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Vad \u00e4r Wafer Coring?<\/h2>\n\n\n\n<p>Wafer coring avser borttagning eller formning av den centrala regionen eller kantsektionerna p\u00e5 en wafer f\u00f6r specialiserade applikationer eller processkrav. \u00c4ven om det inte diskuteras lika ofta som notching, spelar coring en roll i specifika avancerade tillverknings- och forskningsapplikationer.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Viktiga funktioner f\u00f6r waferuttag<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Skapande av central inriktning eller mekaniska avlastningsstrukturer<\/li>\n\n\n\n<li>F\u00f6rbereda wafers f\u00f6r specialiserade bindnings- eller staplingsprocesser<\/li>\n\n\n\n<li>Avl\u00e4gsnande av stressade eller defekta centrala regioner i experimentella processer<\/li>\n\n\n\n<li>St\u00f6d f\u00f6r anpassade wafergeometrier f\u00f6r forskning och prototyptillverkning<\/li>\n<\/ul>\n\n\n\n<p>I avancerade halvledarmilj\u00f6er utf\u00f6rs k\u00e4rnborrning vanligtvis med diamantverktyg med h\u00f6g precision eller laserassisterade system.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Utrustning som anv\u00e4nds vid sk\u00e5rning och k\u00e4rnborrning<\/h2>\n\n\n\n<p>Waferformning med h\u00f6g precision kr\u00e4ver specialutrustning som \u00e4r konstruerad f\u00f6r noggrannhet p\u00e5 mikroniv\u00e5 och minimala skador.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">1. System f\u00f6r precisionsknackning av wafers<\/h3>\n\n\n\n<p>Dessa system anv\u00e4nder diamantslipskivor eller laserbaserade sk\u00e4rhuvuden f\u00f6r att forma exakta sk\u00e5ror p\u00e5 waferkanten.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">2. Diamantvajers\u00e5gar<\/h3>\n\n\n\n<p>Anv\u00e4nds i vissa k\u00e4rnborrnings- och formningsapplikationer, s\u00e4rskilt n\u00e4r man arbetar med h\u00e5rda material eller tjocka wafers.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3. System f\u00f6r mikromaskinbearbetning med laser<\/h3>\n\n\n\n<p>Avancerade fabriker kan anv\u00e4nda laserbaserade verktyg f\u00f6r ber\u00f6ringsfri sk\u00e5rning och urholkning f\u00f6r att minska den mekaniska belastningen.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">4. CNC-precisionsslipmaskiner<\/h3>\n\n\n\n<p>Ger h\u00f6g repeterbarhet och noggrann dimensionskontroll f\u00f6r bearbetning av waferkanter.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Processfl\u00f6de vid tillverkning av 300 mm-wafers<\/h2>\n\n\n\n<p>Ett f\u00f6renklat processfl\u00f6de f\u00f6r sk\u00e5rning och urk\u00e4rning av skivor omfattar:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Inspektion av wafers<\/strong>\n<ul class=\"wp-block-list\">\n<li>Detektering av ytdefekter<\/li>\n\n\n\n<li>M\u00e4tning av tjocklek och planhet<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Orientering Justering<\/strong>\n<ul class=\"wp-block-list\">\n<li>Best\u00e4mning av kristallaxelns riktning<\/li>\n\n\n\n<li>Inst\u00e4llning av sk\u00e5rans referensposition<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Mekanisk bearbetning eller laserbearbetning<\/strong>\n<ul class=\"wp-block-list\">\n<li>Sk\u00e5rsk\u00e4rning p\u00e5 waferkanten<\/li>\n\n\n\n<li>K\u00e4rnavsk\u00e4rning eller centralformning (vid behov)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Avgradning och ytbehandling<\/strong>\n<ul class=\"wp-block-list\">\n<li>Avl\u00e4gsnande av mikrosprickor och skr\u00e4p<\/li>\n\n\n\n<li>Kantpolering f\u00f6r minskad stress<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Inspektion efter process<\/strong>\n<ul class=\"wp-block-list\">\n<li>Optisk metrologi<\/li>\n\n\n\n<li>Dimensionell verifiering<\/li>\n\n\n\n<li>Kontroll av ytans integritet<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">Betydelsen f\u00f6r 300 mm halvledartillverkning<\/h2>\n\n\n\n<p>N\u00e4r skivans diameter \u00f6kar till 300 mm och mer blir den mekaniska precisionen allt viktigare p\u00e5 grund av..:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">1. Krav p\u00e5 automatisering<\/h3>\n\n\n\n<p>Moderna fabriker \u00e4r starkt beroende av robotiserad waferhantering. \u00c4ven sm\u00e5 feljusteringar kan orsaka..:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Waferbrott<\/li>\n\n\n\n<li>Felplacering i litografiverktyg<\/li>\n\n\n\n<li>Avkastningsf\u00f6rlust i nedstr\u00f6msprocesser<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">2. Stressk\u00e4nslighet<\/h3>\n\n\n\n<p>Stora wafers \u00e4r k\u00e4nsligare f\u00f6r mekaniska p\u00e5frestningar som uppst\u00e5r vid kantbearbetning. D\u00e5lig notching eller coring kan leda till:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mikrosprickor<\/li>\n\n\n\n<li>Kantflisning<\/li>\n\n\n\n<li>Delaminering under termisk cykling<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3. Processintegration<\/h3>\n\n\n\n<p>Sk\u00e5rorna m\u00e5ste vara exakt i linje med:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>System f\u00f6r uppriktning av litografi<\/li>\n\n\n\n<li>Etsningsverktygets orientering<\/li>\n\n\n\n<li>Referensramar f\u00f6r metrologi<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Vanliga utmaningar vid notching och coring av wafers<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">1. Kanthuggning<\/h3>\n\n\n\n<p>Felaktiga sk\u00e4rparametrar kan orsaka mikrofrakturer vid waferkanten, vilket p\u00e5verkar den mekaniska h\u00e5llfastheten.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">2. Skador under markytan<\/h3>\n\n\n\n<p>\u00d6verdriven mekanisk kraft kan ge upphov till dolda defekter som sprider sig under v\u00e4rmebehandlingen.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3. Fel i uppriktningen<\/h3>\n\n\n\n<p>\u00c4ven sm\u00e5 avvikelser i sk\u00e5rans position kan p\u00e5verka hela fabrikens automationssystem.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">4. Slitage p\u00e5 verktyg<\/h3>\n\n\n\n<p>Diamantverktyg bryts ned med tiden, vilket p\u00e5verkar j\u00e4mnheten och kr\u00e4ver strikt underh\u00e5llskontroll.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Kvalitetskontroll och inspektionsmetoder<\/h2>\n\n\n\n<p>F\u00f6r att s\u00e4kerst\u00e4lla tillf\u00f6rlitligheten i halvledartillverkningen \u00e4r wafer notching- och coring-processerna noggrant kontrollerade med hj\u00e4lp av:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Inspektion med optisk mikroskopi<\/li>\n\n\n\n<li>Metrologi med laserskanning<\/li>\n\n\n\n<li>System f\u00f6r m\u00e4tning av kantprofiler<\/li>\n\n\n\n<li>Analys av ytj\u00e4mnhet (AFM\/SEM i avancerade fall)<\/li>\n<\/ul>\n\n\n\n<p>Dessa metoder s\u00e4kerst\u00e4ller att standarderna f\u00f6r halvledarkvalitet uppfylls.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Till\u00e4mpningar inom industrin<\/h2>\n\n\n\n<p>Wafer notching och coring anv\u00e4nds ofta i:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Tillverkning av 300 mm kiselskivor<\/li>\n\n\n\n<li>Avancerade logik- och minnesfabriker<\/li>\n\n\n\n<li>Prototyptillverkning av wafers f\u00f6r forskning och utveckling<\/li>\n\n\n\n<li>Specialmaterial f\u00f6r halvledare (SiC, safir, glasskivor)<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Slutsats<\/h2>\n\n\n\n<p>Wafer notching och coring \u00e4r viktiga precisionsprocesser i<mark style=\"background-color:rgba(0, 0, 0, 0);color:#0693e3\" class=\"has-inline-color\"> 300 mm halvledartillverkning<\/mark>. \u00c4ven om de kan verka mindre j\u00e4mf\u00f6rt med litografi eller deponering, p\u00e5verkar dessa mekaniska steg direkt noggrannheten vid hantering av wafern, processtabiliteten och det totala utbytet.<\/p>\n\n\n\n<p>I takt med att halvledartekniken forts\u00e4tter att utvecklas kommer efterfr\u00e5gan p\u00e5 ultraexakt kantbearbetning att forts\u00e4tta att \u00f6ka, vilket g\u00f6r dessa processer allt viktigare i n\u00e4sta generations fabriker.<\/p>","protected":false},"excerpt":{"rendered":"<p>In 300mm semiconductor manufacturing, wafer notching and coring are critical mechanical processes used to prepare silicon wafers for downstream fabrication steps. These processes ensure proper wafer orientation, structural integrity, and compatibility with automated handling systems in advanced fabs. As wafer sizes continue to increase and process nodes become more advanced, precision in mechanical wafer shaping [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2467,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[24],"tags":[1367,1370,185,1327,1369,1365,1366,1337,1368],"class_list":["post-2466","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-300mm-wafer-manufacturing","tag-precision-wafer-processing","tag-semiconductor-manufacturing-equipment","tag-semiconductor-wafer-processing","tag-silicon-wafer-alignment","tag-wafer-coring","tag-wafer-edge-notching","tag-wafer-handling-systems","tag-wafer-notching"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/posts\/2466","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/comments?post=2466"}],"version-history":[{"count":1,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/posts\/2466\/revisions"}],"predecessor-version":[{"id":2468,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/posts\/2466\/revisions\/2468"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/media\/2467"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/media?parent=2466"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/categories?post=2466"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/sv\/wp-json\/wp\/v2\/tags?post=2466"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}