{"id":2226,"date":"2026-04-15T03:41:10","date_gmt":"2026-04-15T03:41:10","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2226"},"modified":"2026-04-15T04:01:00","modified_gmt":"2026-04-15T04:01:00","slug":"wp-301d-double-side-wafer-grinding-machine-for-6-inch-semiconductor-materials-and-precision-lapping","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/pt\/product\/wp-301d-double-side-wafer-grinding-machine-for-6-inch-semiconductor-materials-and-precision-lapping\/","title":{"rendered":"M\u00e1quina de moagem de wafer de lado duplo WP-301D para materiais semicondutores de 6 polegadas e lapida\u00e7\u00e3o de precis\u00e3o"},"content":{"rendered":"<p data-start=\"284\" data-end=\"683\"><img fetchpriority=\"high\" decoding=\"async\" class=\"alignright wp-image-2229\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-300x300.png\" alt=\"M\u00e1quina de moagem de wafer de lado duplo WP-301D para materiais semicondutores de 6 polegadas e lapida\u00e7\u00e3o de precis\u00e3o\" width=\"283\" height=\"283\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-301D-Double-Side-Wafer-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Precision-Lapping-1.png 1000w\" sizes=\"(max-width: 283px) 100vw, 283px\" \/>A m\u00e1quina de retifica\u00e7\u00e3o de bolachas de dupla face WP-301D \u00e9 um sistema de alta precis\u00e3o concebido para retifica\u00e7\u00e3o e polimento simult\u00e2neos de dupla face de bolachas semicondutoras e materiais fr\u00e1geis. Utilizando um sistema avan\u00e7ado de movimento por engrenagem planet\u00e1ria, a m\u00e1quina permite a remo\u00e7\u00e3o uniforme de material nas superf\u00edcies superior e inferior da bolacha, melhorando significativamente a planicidade e o paralelismo.<\/p>\n<p data-start=\"685\" data-end=\"996\">Concebida para bolachas de 6 polegadas (150 mm) e inferiores, a WP-301D \u00e9 amplamente utilizada no processamento de materiais semicondutores compostos, tais como CdZnTe (CZT), HgCdTe (MCT), GaAs, InP e InSb. Estes materiais s\u00e3o cr\u00edticos em aplica\u00e7\u00f5es que incluem dete\u00e7\u00e3o de infravermelhos, optoelectr\u00f3nica e dispositivos de alta frequ\u00eancia.<\/p>\n<p data-start=\"998\" data-end=\"1200\">Com a sua estrutura mec\u00e2nica robusta, o sistema de controlo de precis\u00e3o e o design optimizado do eixo, a WP-301D assegura uma elevada efici\u00eancia, uma excelente qualidade de superf\u00edcie e um desempenho est\u00e1vel de processamento em lote.<\/p>\n<hr data-start=\"1202\" data-end=\"1205\" \/>\n<h2 data-section-id=\"m7ukan\" data-start=\"1207\" data-end=\"1250\">Principais carater\u00edsticas e vantagens t\u00e9cnicas<\/h2>\n<h3 data-section-id=\"1ggl47b\" data-start=\"1252\" data-end=\"1296\">Processamento simult\u00e2neo de duas faces<\/h3>\n<p data-start=\"1297\" data-end=\"1372\">A m\u00e1quina processa ambos os lados do wafer ao mesmo tempo, garantindo:<\/p>\n<ul data-start=\"1373\" data-end=\"1463\">\n<li data-section-id=\"1i7ktds\" data-start=\"1373\" data-end=\"1406\">Melhoria da uniformidade da espessura<\/li>\n<li data-section-id=\"1da8f9g\" data-start=\"1407\" data-end=\"1429\">Melhor paralelismo<\/li>\n<li data-section-id=\"12e74mo\" data-start=\"1430\" data-end=\"1463\">Redu\u00e7\u00e3o do tempo total de processamento<\/li>\n<\/ul>\n<h3 data-section-id=\"2t7dsg\" data-start=\"1465\" data-end=\"1501\">Sistema de movimento de engrenagem planet\u00e1ria<\/h3>\n<p data-start=\"1502\" data-end=\"1689\">O sistema integrado de engrenagens solares e an\u00e9is pode funcionar de forma s\u00edncrona ou independente, permitindo um controlo flex\u00edvel do processo e percursos de moagem optimizados para diferentes materiais.<\/p>\n<h3 data-section-id=\"dbg2ti\" data-start=\"1691\" data-end=\"1728\">Sistema de fuso de alta precis\u00e3o<\/h3>\n<p data-start=\"1729\" data-end=\"1901\">Equipada com um fuso incorporado de alta precis\u00e3o, a WP-301D assegura uma rota\u00e7\u00e3o est\u00e1vel e uma vibra\u00e7\u00e3o m\u00ednima, o que \u00e9 essencial para obter uma qualidade de superf\u00edcie consistente.<\/p>\n<h3 data-section-id=\"bbwmxj\" data-start=\"1903\" data-end=\"1944\">Sistema de controlo da press\u00e3o em tempo real<\/h3>\n<p data-start=\"1945\" data-end=\"2030\">A m\u00e1quina possui um sistema avan\u00e7ado de controlo de press\u00e3o em circuito fechado, que permite:<\/p>\n<ul data-start=\"2031\" data-end=\"2200\">\n<li data-section-id=\"5pkops\" data-start=\"2031\" data-end=\"2077\">Ajuste exato da press\u00e3o (0,1 - 50 kg)<\/li>\n<li data-section-id=\"18clroc\" data-start=\"2078\" data-end=\"2200\">Monitoriza\u00e7\u00e3o em tempo real e corre\u00e7\u00e3o autom\u00e1tica<br data-start=\"2125\" data-end=\"2128\" \/>Isto garante uma remo\u00e7\u00e3o consistente do material e evita o polimento excessivo.<\/li>\n<\/ul>\n<h3 data-section-id=\"mqy6u6\" data-start=\"2202\" data-end=\"2237\">Design da placa superior flutuante<\/h3>\n<p data-start=\"2238\" data-end=\"2440\">A placa superior adopta uma estrutura de liga\u00e7\u00e3o flutuante, assegurando que permanece paralela \u00e0 placa inferior durante o processamento. Isto melhora significativamente a planicidade da bolacha e reduz a varia\u00e7\u00e3o de espessura.<\/p>\n<h2 data-section-id=\"8lu2ky\" data-start=\"2447\" data-end=\"2477\">Especifica\u00e7\u00f5es t\u00e9cnicas<\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2479\" data-end=\"2829\">\n<thead data-start=\"2479\" data-end=\"2503\">\n<tr data-start=\"2479\" data-end=\"2503\">\n<th class=\"\" data-start=\"2479\" data-end=\"2486\" data-col-size=\"sm\">Item<\/th>\n<th class=\"\" data-start=\"2486\" data-end=\"2503\" data-col-size=\"sm\">Especifica\u00e7\u00e3o<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2527\" data-end=\"2829\">\n<tr data-start=\"2527\" data-end=\"2570\">\n<td data-start=\"2527\" data-end=\"2544\" data-col-size=\"sm\">Tamanho da pe\u00e7a de trabalho<\/td>\n<td data-start=\"2544\" data-end=\"2570\" data-col-size=\"sm\">At\u00e9 \u00d8150 mm (6 polegadas)<\/td>\n<\/tr>\n<tr data-start=\"2571\" data-end=\"2605\">\n<td data-start=\"2571\" data-end=\"2591\" data-col-size=\"sm\">Velocidade inferior da placa<\/td>\n<td data-start=\"2591\" data-end=\"2605\" data-col-size=\"sm\">0 - 30 rpm<\/td>\n<\/tr>\n<tr data-start=\"2606\" data-end=\"2658\">\n<td data-start=\"2606\" data-end=\"2624\" data-col-size=\"sm\">M\u00e9todo de moagem<\/td>\n<td data-start=\"2624\" data-end=\"2658\" data-col-size=\"sm\">Retifica\u00e7\u00e3o planet\u00e1ria de dupla face<\/td>\n<\/tr>\n<tr data-start=\"2659\" data-end=\"2683\">\n<td data-start=\"2659\" data-end=\"2678\" data-col-size=\"sm\">Quantidade de transportadoras<\/td>\n<td data-start=\"2678\" data-end=\"2683\" data-col-size=\"sm\">5<\/td>\n<\/tr>\n<tr data-start=\"2684\" data-end=\"2716\">\n<td data-start=\"2684\" data-end=\"2701\" data-col-size=\"sm\">Gama de press\u00e3o<\/td>\n<td data-start=\"2701\" data-end=\"2716\" data-col-size=\"sm\">0,1 - 50 kg<\/td>\n<\/tr>\n<tr data-start=\"2717\" data-end=\"2753\">\n<td data-start=\"2717\" data-end=\"2734\" data-col-size=\"sm\">Material da placa<\/td>\n<td data-start=\"2734\" data-end=\"2753\" data-col-size=\"sm\">Vidro \/ Cer\u00e2mica<\/td>\n<\/tr>\n<tr data-start=\"2754\" data-end=\"2800\">\n<td data-start=\"2754\" data-end=\"2775\" data-col-size=\"sm\">Dimens\u00f5es da m\u00e1quina<\/td>\n<td data-start=\"2775\" data-end=\"2800\" data-col-size=\"sm\">1572 \u00d7 1053 \u00d7 2533 mm<\/td>\n<\/tr>\n<tr data-start=\"2801\" data-end=\"2829\">\n<td data-start=\"2801\" data-end=\"2810\" data-col-size=\"sm\">Peso<\/td>\n<td data-start=\"2810\" data-end=\"2829\" data-col-size=\"sm\">Aprox. 2300 kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<hr data-start=\"2831\" data-end=\"2834\" \/>\n<h2 data-section-id=\"13yq5fc\" data-start=\"2836\" data-end=\"2859\">Princ\u00edpio de funcionamento<\/h2>\n<p data-start=\"2903\" data-end=\"3050\">A WP-301D funciona utilizando um mecanismo de movimento planet\u00e1rio, em que os wafers s\u00e3o colocados dentro de suportes posicionados entre as placas superior e inferior.<\/p>\n<p data-start=\"3052\" data-end=\"3069\">Durante o funcionamento:<\/p>\n<ul data-start=\"3071\" data-end=\"3205\">\n<li data-section-id=\"307xpo\" data-start=\"3071\" data-end=\"3115\">A placa inferior roda continuamente<\/li>\n<li data-section-id=\"155dzsx\" data-start=\"3116\" data-end=\"3156\">A engrenagem solar acciona os suportes<\/li>\n<li data-section-id=\"1h7nv9d\" data-start=\"3157\" data-end=\"3205\">A engrenagem anelar controla o movimento de rota\u00e7\u00e3o<\/li>\n<\/ul>\n<p data-start=\"3207\" data-end=\"3357\">Esta combina\u00e7\u00e3o cria um movimento relativo complexo entre a bolacha e as placas de polimento, assegurando uma remo\u00e7\u00e3o uniforme do material em ambas as superf\u00edcies.<\/p>\n<p data-start=\"3359\" data-end=\"3527\">Simultaneamente, o sistema de controlo da press\u00e3o mant\u00e9m a for\u00e7a constante, enquanto a placa superior flutuante se adapta dinamicamente para manter o contacto paralelo. Isto resulta em:<\/p>\n<ul data-start=\"3529\" data-end=\"3598\">\n<li data-section-id=\"5m7g9e\" data-start=\"3529\" data-end=\"3546\">Elevada planicidade<\/li>\n<li data-section-id=\"1uescvu\" data-start=\"3547\" data-end=\"3568\">Espessura uniforme<\/li>\n<li data-section-id=\"19qiivl\" data-start=\"3569\" data-end=\"3598\">Danos m\u00ednimos no subsolo<\/li>\n<\/ul>\n<hr data-start=\"3600\" data-end=\"3603\" \/>\n<h2 data-section-id=\"4t5b8m\" data-start=\"3605\" data-end=\"3623\"><img decoding=\"async\" class=\"size-medium wp-image-2176 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-300x300.webp\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-768x768.webp 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/silicon_carbide_wafer_4inch_hpsi_350um_widely_used_for_ar_glasses3.webp 800w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Aplica\u00e7\u00f5es<\/h2>\n<p data-start=\"3625\" data-end=\"3684\">A m\u00e1quina de moagem de dupla face WP-301D \u00e9 amplamente utilizada em:<\/p>\n<ul data-start=\"3686\" data-end=\"3896\">\n<li data-section-id=\"lsdmsu\" data-start=\"3686\" data-end=\"3729\">Processamento de bolachas semicondutoras compostas<\/li>\n<li data-section-id=\"1re9cdn\" data-start=\"3730\" data-end=\"3763\">Materiais de infravermelhos (CZT, MCT)<\/li>\n<li data-section-id=\"1kwz9qu\" data-start=\"3764\" data-end=\"3801\">Materiais III-V (GaAs, InP, InSb)<\/li>\n<li data-section-id=\"qagg2f\" data-start=\"3802\" data-end=\"3849\">Substratos \u00f3pticos e componentes de precis\u00e3o<\/li>\n<li data-section-id=\"ir3gdc\" data-start=\"3850\" data-end=\"3896\">Laborat\u00f3rios de investiga\u00e7\u00e3o e produ\u00e7\u00e3o por lotes<\/li>\n<\/ul>\n<p data-start=\"3898\" data-end=\"4021\">\u00c9 particularmente adequado para materiais fr\u00e1geis com 6 polegadas ou menos, onde a precis\u00e3o e a integridade da superf\u00edcie s\u00e3o cr\u00edticas.<\/p>\n<hr data-start=\"4023\" data-end=\"4026\" \/>\n<h2 data-section-id=\"1116wfg\" data-start=\"4028\" data-end=\"4049\"><img decoding=\"async\" class=\"size-medium wp-image-2122 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Vantagens principais<\/h2>\n<ul data-start=\"4051\" data-end=\"4440\">\n<li data-section-id=\"1ar7oz7\" data-start=\"4051\" data-end=\"4131\">Alta efici\u00eancia<br data-start=\"4072\" data-end=\"4075\" \/>O processamento de dupla face reduz o tempo total de maquina\u00e7\u00e3o<\/li>\n<li data-section-id=\"1wr2j5g\" data-start=\"4133\" data-end=\"4202\">Alta precis\u00e3o<br data-start=\"4153\" data-end=\"4156\" \/>Garante uma excelente planicidade e paralelismo<\/li>\n<li data-section-id=\"esn72i\" data-start=\"4204\" data-end=\"4283\">Estabilidade do processo<br data-start=\"4227\" data-end=\"4230\" \/>O controlo da press\u00e3o em circuito fechado melhora a consist\u00eancia<\/li>\n<li data-section-id=\"1crbhdt\" data-start=\"4285\" data-end=\"4356\">Funcionamento flex\u00edvel<br data-start=\"4309\" data-end=\"4312\" \/>Controlo de engrenagens independente ou sincronizado<\/li>\n<li data-section-id=\"1hbjrp7\" data-start=\"4358\" data-end=\"4440\">Optimizado para materiais fr\u00e1geis<br data-start=\"4395\" data-end=\"4398\" \/>Minimiza o stress e evita fissuras<\/li>\n<\/ul>\n<hr data-start=\"4442\" data-end=\"4445\" \/>\n<h2 data-section-id=\"w1cnyx\" data-start=\"4447\" data-end=\"4456\">FAQ<\/h2>\n<p data-start=\"4458\" data-end=\"4662\">Q1: Qual \u00e9 a principal vantagem da retifica\u00e7\u00e3o de dupla face?<br data-start=\"4517\" data-end=\"4520\" \/>R: Permite o processamento simult\u00e2neo de ambas as superf\u00edcies da bolacha, melhorando a planicidade, o paralelismo e a efici\u00eancia em compara\u00e7\u00e3o com a retifica\u00e7\u00e3o de um s\u00f3 lado.<\/p>\n<p data-start=\"4664\" data-end=\"4820\">Q2: Que materiais podem ser processados?<br data-start=\"4704\" data-end=\"4707\" \/>R: A m\u00e1quina \u00e9 adequada para CZT, MCT, GaAs, InP, InSb e outros materiais semicondutores macios e fr\u00e1geis.<\/p>\n<p data-start=\"4822\" data-end=\"4924\">P3: Que tamanho de bolacha \u00e9 suportado pela WP-301D?<br data-start=\"4871\" data-end=\"4874\" \/>R: Suporta bolachas at\u00e9 150 mm (6 polegadas).<\/p>","protected":false},"excerpt":{"rendered":"<p>A m\u00e1quina de retifica\u00e7\u00e3o de bolachas de dupla face WP-301D \u00e9 um sistema de alta precis\u00e3o concebido para retifica\u00e7\u00e3o e polimento simult\u00e2neos de dupla face de bolachas semicondutoras e materiais fr\u00e1geis. Utilizando um sistema avan\u00e7ado de movimento por engrenagem planet\u00e1ria, a m\u00e1quina permite a remo\u00e7\u00e3o uniforme de material nas superf\u00edcies superior e inferior da bolacha, melhorando significativamente a planicidade e o paralelismo.<\/p>","protected":false},"featured_media":2229,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[724],"product_tag":[1005,1017,1015,1012,1018,1016,1019,1014,1020,1013],"class_list":{"0":"post-2226","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-grinding-machine","7":"product_tag-6-inch-wafer-grinding","8":"product_tag-czt-grinding-machine","9":"product_tag-double-side-polishing-machine","10":"product_tag-double-side-wafer-grinding-machine","11":"product_tag-gaas-wafer-polishing","12":"product_tag-planetary-lapping-system","13":"product_tag-precision-wafer-lapping","14":"product_tag-semiconductor-grinding-equipment","15":"product_tag-semiconductor-surface-grinding","16":"product_tag-wafer-lapping-machine","17":"desktop-align-left","18":"tablet-align-left","19":"mobile-align-left","20":"ast-product-gallery-layout-horizontal-slider","21":"ast-product-tabs-layout-horizontal","23":"first","24":"instock","25":"shipping-taxable","26":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/product\/2226","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/comments?post=2226"}],"version-history":[{"count":5,"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/product\/2226\/revisions"}],"predecessor-version":[{"id":2233,"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/product\/2226\/revisions\/2233"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/media\/2229"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/media?parent=2226"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/product_brand?post=2226"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/product_cat?post=2226"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pt\/wp-json\/wp\/v2\/product_tag?post=2226"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}