![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-300x300.png\")
The WG-1261 Series represents a high-precision, fully automatic wafer thinning Machine designed for 12-inch and smaller SiC wafers, as well as sapphire, quartz, and ceramic materials. As a comprehensive solution from a trusted semiconductor equipment supplier, this series integrates advanced spindle technology, high-load wafer carriers, and automation features to ensure stable, accurate, and efficient wafer thinning.<\/p>\n
Equipped with high-power, high-precision air-bearing spindles and a new-generation high-load, low-vibration air-bearing wafer carrier, the WG-1261 ensures superior rigidity and enhanced process stability. Its encircling high-rigidity spindle drive further boosts machine stiffness, allowing precise control even for challenging materials like SiC and sapphire.<\/p>\n
The inclusion of Autosetup functionality allows the machine to automatically complete wheel dressing after replacement, eliminating manual intervention and improving both productivity and consistency. Additionally, an online measurement unit (range 0\u20131800\u03bcm) ensures precise thickness control, while SECS\/GEM connectivity enables seamless integration into modern smart fabs.<\/p>\n
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Technical Features<\/span><\/h2>\nThe WG-1261 Series is ideal for:<\/p>\n
| Item<\/th>\n | Especifica\u00e7\u00e3o<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|
| Structure<\/td>\n | Spindle \u00d72 \/ Wafer Carrier \u00d73 \/ Worktable \u00d71 \/ Fully Automatic Transfer & Cleaning System \u00d71<\/td>\n<\/tr>\n |
| Spindle Power<\/td>\n | 7.5 kW \/ 11 kW (optional)<\/td>\n<\/tr>\n |
| Grinding Diameter<\/td>\n | \u03c66″, \u03c68″, \u03c612″<\/td>\n<\/tr>\n |
| Dimensions (W\u00d7D\u00d7H)<\/td>\n | 1450mm \u00d7 3380mm \u00d7 1900mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
Perguntas frequentes (FAQ)<\/strong><\/span><\/h2>\nA:<\/strong> The machine supports wafers up to 12 inches, including SiC, sapphire, quartz, and ceramic materials, providing versatile processing options for multiple production lines.<\/li>\n A:<\/strong> Autosetup automatically completes wheel dressing after replacement, eliminating manual intervention, reducing setup errors, and significantly saving production time.<\/li>\n A:<\/strong> Yes, it is equipped with an online measurement unit (0\u20131800\u03bcm) that ensures accurate monitoring and control of wafer thinning during processing.<\/li>\n A:<\/strong> Absolutely. The machine supports SECS\/GEM connectivity<\/strong>, enabling real-time monitoring, data collection, and integration with smart manufacturing systems.<\/li>\n A:<\/strong> With high-power air-bearing spindles, a low-vibration high-load wafer carrier, and an encircling high-rigidity spindle drive, the WG-1261 maintains excellent process stability even for SiC and sapphire wafers.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":" The WG-1261 Series Fully Automatic Wafer Thinning Machine is the perfect solution for modern semiconductor and optical wafer processing. With high precision, advanced automation, and multi-material compatibility, it delivers consistent, efficient, and reliable wafer thinning for SiC, sapphire, quartz, and ceramic wafers up to 12 inches. Ideal for R&D, pilot production, and medium-to-large-scale fabs, the WG-1261 Series ensures higher yields, lower labor costs, and optimized production efficiency.<\/p>","protected":false},"featured_media":2135,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\")
Why Choose WG-1261 Series?<\/span><\/h2>\n