{"id":2030,"date":"2026-03-27T01:57:48","date_gmt":"2026-03-27T01:57:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2030"},"modified":"2026-03-27T02:00:00","modified_gmt":"2026-03-27T02:00:00","slug":"semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/pt\/product\/semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing\/","title":{"rendered":"Semi Automatic Room Temperature Wafer Bonding Machine for 2 to 12 Inch Wafer Processing"},"content":{"rendered":"

\"\"The Semi Automatic Room Temperature Wafer Bonding Machine is a high-precision system for wafer-level and chip-level bonding. By combining mechanical pressure with in situ surface activation technology, it enables permanent bonding at room temperature (20\u201330\u00b0C) without adhesives or high temperature processing. This minimizes thermal stress and material deformation, making it ideal for heat-sensitive and heterogeneous materials. The machine supports wafer sizes from 2 inch to 12 inch and is suitable for research, pilot production, and small to medium scale manufacturing.<\/p>\n

\"\"Carater\u00edsticas principais<\/strong><\/h2>\n
    \n
  1. Room Temperature Bonding<\/strong> \u2013 Operates at 25 \u00b1 5\u00b0C to prevent thermal mismatch and wafer warpage.<\/li>\n
  2. Surface Activation<\/strong> \u2013 Plasma or chemical activation improves bonding strength; optional sputtering enhances interface quality.<\/li>\n
  3. High Precision Alignment<\/strong> \u2013 Visual alignment system and precision motion platform with \u00b10.5 \u03bcm accuracy.<\/li>\n
  4. Wide Material Compatibility<\/strong> \u2013 Supports Si, SiC, GaAs, GaN, InP, sapphire, glass, LiNbO\u2083, LiTaO\u2083, diamond, and selected polymers.<\/li>\n
  5. Semi-Automatic Operation<\/strong> \u2013 Manual wafer loading with automated bonding process; programmable recipes for repeatable results.<\/li>\n
  6. Clean and Stable Environment<\/strong> \u2013 Built-in Class 100 clean system ensures low contamination and interface void rate <0.1%.<\/li>\n<\/ol>\n

    Especifica\u00e7\u00f5es t\u00e9cnicas<\/strong><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Par\u00e2metro<\/th>\nEspecifica\u00e7\u00e3o<\/th>\n<\/tr>\n<\/thead>\n
    Tamanho da pastilha<\/td>\n2″ \u2013 12″, compatible with irregular samples<\/td>\n<\/tr>\n
    Bonding Temperature<\/td>\n20\u201330\u00b0C<\/td>\n<\/tr>\n
    Maximum Pressure<\/td>\n80 kN<\/td>\n<\/tr>\n
    Controlo da press\u00e3o<\/td>\n0\u20135000 N adjustable, \u00b11 N resolution<\/td>\n<\/tr>\n
    Alignment Accuracy<\/td>\n\u00b10.5 \u03bcm<\/td>\n<\/tr>\n
    Bond Strength<\/td>\n\u22652.0 J\/m\u00b2<\/td>\n<\/tr>\n
    Surface Treatment<\/td>\nIn situ activation + sputtering deposition<\/td>\n<\/tr>\n
    Feeding Mode<\/td>\nManual<\/td>\n<\/tr>\n
    Cleanliness Level<\/td>\nClass 100<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    Core Technology<\/strong><\/h2>\n
      \n
    1. Room Temperature Direct Bonding<\/strong> \u2013 Activated surfaces contact under controlled pressure forming stable bonds without thermal annealing.<\/li>\n
    2. Surface Activation<\/strong> \u2013 Increases surface energy, removes contaminants, and improves bonding uniformity across materials.<\/li>\n<\/ol>\n

      \"\"Aplica\u00e7\u00f5es<\/strong><\/h2>\n
        \n
      1. Advanced Semiconductor Packaging<\/strong> \u2013 3D IC stacking, TSV bonding, heterogeneous integration of logic and memory chips.<\/li>\n
      2. MEMS Manufacturing<\/strong> \u2013 Wafer-level vacuum packaging for sensors such as accelerometers and gyroscopes.<\/li>\n
      3. Optoelectronics and Displays<\/strong> \u2013 LED bonding, sapphire and glass substrate bonding, AR\/VR optical module assembly.<\/li>\n
      4. Microfluidics and Biochips<\/strong> \u2013 PDMS and glass bonding while preserving biological activity.<\/li>\n
      5. Research and Emerging Devices<\/strong> \u2013 Flexible electronics, quantum devices, and heterogeneous material integration.<\/li>\n<\/ol>\n

        Service and Support<\/strong><\/h2>\n
          \n
        1. Process Development<\/strong> \u2013 Bonding parameter optimization and surface activation solutions for different materials.<\/li>\n
        2. Equipment Customization<\/strong> \u2013 High-precision alignment modules, vacuum or controlled atmosphere chambers.<\/li>\n
        3. Forma\u00e7\u00e3o t\u00e9cnica<\/strong> \u2013 On-site operation guidance and process debugging.<\/li>\n
        4. After-Sales Support<\/strong> \u2013 12-month warranty, quick replacement of key components, remote diagnostics, and software updates.<\/li>\n<\/ol>\n

          FAQ<\/h2>\n

          Q: What is the main advantage of room temperature bonding?
          A: It eliminates thermal stress and enables reliable bonding of heat-sensitive and heterogeneous materials.<\/p>\n

          Q: What materials can be bonded?
          A: Silicon, silicon carbide, gallium nitride, gallium arsenide, indium phosphide, sapphire, glass, lithium niobate, diamond, and selected polymers.<\/p>","protected":false},"excerpt":{"rendered":"

          The Semi Automatic Room Temperature Wafer Bonding Machine is a high-precision system for wafer-level and chip-level bonding. By combining mechanical pressure with in situ surface activation technology, it enables permanent bonding at room temperature (20\u201330\u00b0C) without adhesives or high temperature processing.<\/p>","protected":false},"featured_media":2031,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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