{"id":2030,"date":"2026-03-27T01:57:48","date_gmt":"2026-03-27T01:57:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2030"},"modified":"2026-03-27T02:00:00","modified_gmt":"2026-03-27T02:00:00","slug":"semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/pt\/product\/semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing\/","title":{"rendered":"M\u00e1quina de colagem de wafer semi-autom\u00e1tica de temperatura ambiente para processamento de wafer de 2 a 12 polegadas"},"content":{"rendered":"

\"\"A m\u00e1quina semi-autom\u00e1tica de colagem de bolachas \u00e0 temperatura ambiente \u00e9 um sistema de alta precis\u00e3o para a colagem de bolachas e chips. Ao combinar a press\u00e3o mec\u00e2nica com a tecnologia de ativa\u00e7\u00e3o de superf\u00edcie in situ, permite a liga\u00e7\u00e3o permanente \u00e0 temperatura ambiente (20-30\u00b0C) sem adesivos ou processamento a alta temperatura. Isto minimiza o stress t\u00e9rmico e a deforma\u00e7\u00e3o do material, tornando-a ideal para materiais sens\u00edveis ao calor e heterog\u00e9neos. A m\u00e1quina suporta tamanhos de bolacha de 2 polegadas a 12 polegadas e \u00e9 adequada para investiga\u00e7\u00e3o, produ\u00e7\u00e3o piloto e fabrico em pequena e m\u00e9dia escala.<\/p>\n

\"\"Carater\u00edsticas principais<\/strong><\/h2>\n
    \n
  1. Colagem \u00e0 temperatura ambiente<\/strong> - Funciona a 25 \u00b1 5\u00b0C para evitar incompatibilidade t\u00e9rmica e empenamento da bolacha.<\/li>\n
  2. Ativa\u00e7\u00e3o de superf\u00edcie<\/strong> - A ativa\u00e7\u00e3o qu\u00edmica ou por plasma melhora a resist\u00eancia da liga\u00e7\u00e3o; a pulveriza\u00e7\u00e3o cat\u00f3dica opcional melhora a qualidade da interface.<\/li>\n
  3. Alinhamento de alta precis\u00e3o<\/strong> - Sistema de alinhamento visual e plataforma de movimentos de precis\u00e3o com uma exatid\u00e3o de \u00b10,5 \u03bcm.<\/li>\n
  4. Ampla compatibilidade de materiais<\/strong> - Suporta Si, SiC, GaAs, GaN, InP, safira, vidro, LiNbO\u2083, LiTaO\u2083, diamante e pol\u00edmeros selecionados.<\/li>\n
  5. Funcionamento semi-autom\u00e1tico<\/strong> - Carregamento manual de bolacha com processo de colagem automatizado; receitas program\u00e1veis para resultados repet\u00edveis.<\/li>\n
  6. Ambiente limpo e est\u00e1vel<\/strong> - O sistema de limpeza Classe 100 incorporado garante uma baixa contamina\u00e7\u00e3o e uma taxa de vazios na interface <0,1%.<\/li>\n<\/ol>\n

    Especifica\u00e7\u00f5es t\u00e9cnicas<\/strong><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Par\u00e2metro<\/th>\nEspecifica\u00e7\u00e3o<\/th>\n<\/tr>\n<\/thead>\n
    Tamanho da pastilha<\/td>\n2\u2033 - 12\u2033, compat\u00edvel com amostras irregulares<\/td>\n<\/tr>\n
    Temperatura de liga\u00e7\u00e3o<\/td>\n20-30\u00b0C<\/td>\n<\/tr>\n
    Press\u00e3o m\u00e1xima<\/td>\n80 kN<\/td>\n<\/tr>\n
    Controlo da press\u00e3o<\/td>\n0-5000 N ajust\u00e1vel, resolu\u00e7\u00e3o \u00b11 N<\/td>\n<\/tr>\n
    Precis\u00e3o do alinhamento<\/td>\n\u00b10,5 \u03bcm<\/td>\n<\/tr>\n
    Resist\u00eancia da liga\u00e7\u00e3o<\/td>\n\u22652,0 J\/m\u00b2<\/td>\n<\/tr>\n
    Tratamento de superf\u00edcie<\/td>\nAtiva\u00e7\u00e3o in situ + deposi\u00e7\u00e3o por pulveriza\u00e7\u00e3o cat\u00f3dica<\/td>\n<\/tr>\n
    Modo de alimenta\u00e7\u00e3o<\/td>\nManual<\/td>\n<\/tr>\n
    N\u00edvel de limpeza<\/td>\nClasse 100<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    Tecnologia de base<\/strong><\/h2>\n
      \n
    1. Colagem direta \u00e0 temperatura ambiente<\/strong> - As superf\u00edcies activadas entram em contacto sob press\u00e3o controlada, formando liga\u00e7\u00f5es est\u00e1veis sem recozimento t\u00e9rmico.<\/li>\n
    2. Ativa\u00e7\u00e3o de superf\u00edcie<\/strong> - Aumenta a energia da superf\u00edcie, remove contaminantes e melhora a uniformidade da liga\u00e7\u00e3o entre materiais.<\/li>\n<\/ol>\n

      \"\"Aplica\u00e7\u00f5es<\/strong><\/h2>\n
        \n
      1. Embalagem avan\u00e7ada de semicondutores<\/strong> - Empilhamento de CI 3D, colagem de TSV, integra\u00e7\u00e3o heterog\u00e9nea de chips l\u00f3gicos e de mem\u00f3ria.<\/li>\n
      2. Fabrico de MEMS<\/strong> - Embalagem em v\u00e1cuo ao n\u00edvel da bolacha para sensores como aceler\u00f3metros e girosc\u00f3pios.<\/li>\n
      3. Optoelectr\u00f3nica e ecr\u00e3s<\/strong> - Colagem de LEDs, colagem de substratos de safira e vidro, montagem de m\u00f3dulos \u00f3pticos AR\/VR.<\/li>\n
      4. Microflu\u00eddica e Biochips<\/strong> - PDMS e vidro, preservando a atividade biol\u00f3gica.<\/li>\n
      5. Investiga\u00e7\u00e3o e dispositivos emergentes<\/strong> - Eletr\u00f3nica flex\u00edvel, dispositivos qu\u00e2nticos e integra\u00e7\u00e3o de materiais heterog\u00e9neos.<\/li>\n<\/ol>\n

        Servi\u00e7o e assist\u00eancia<\/strong><\/h2>\n
          \n
        1. Desenvolvimento de processos<\/strong> - Otimiza\u00e7\u00e3o dos par\u00e2metros de liga\u00e7\u00e3o e solu\u00e7\u00f5es de ativa\u00e7\u00e3o de superf\u00edcie para diferentes materiais.<\/li>\n
        2. Personaliza\u00e7\u00e3o do equipamento<\/strong> - M\u00f3dulos de alinhamento de alta precis\u00e3o, c\u00e2maras de v\u00e1cuo ou de atmosfera controlada.<\/li>\n
        3. Forma\u00e7\u00e3o t\u00e9cnica<\/strong> - Orienta\u00e7\u00e3o de opera\u00e7\u00e3o no local e depura\u00e7\u00e3o de processos.<\/li>\n
        4. Apoio p\u00f3s-venda<\/strong> - Garantia de 12 meses, substitui\u00e7\u00e3o r\u00e1pida dos principais componentes, diagn\u00f3stico remoto e actualiza\u00e7\u00f5es de software.<\/li>\n<\/ol>\n

          FAQ<\/h2>\n

          P: Qual \u00e9 a principal vantagem da colagem \u00e0 temperatura ambiente?
          R: Elimina o stress t\u00e9rmico e permite uma liga\u00e7\u00e3o fi\u00e1vel de materiais heterog\u00e9neos e sens\u00edveis ao calor.<\/p>\n

          P: Que materiais podem ser colados?
          A: Sil\u00edcio, carboneto de sil\u00edcio, nitreto de g\u00e1lio, arsenieto de g\u00e1lio, fosforeto de \u00edndio, safira, vidro, niobato de l\u00edtio, diamante e pol\u00edmeros selecionados.<\/p>","protected":false},"excerpt":{"rendered":"

          A m\u00e1quina semi-autom\u00e1tica de colagem de bolachas \u00e0 temperatura ambiente \u00e9 um sistema de alta precis\u00e3o para a colagem de bolachas e chips. Ao combinar a press\u00e3o mec\u00e2nica com a tecnologia de ativa\u00e7\u00e3o de superf\u00edcie in situ, permite a liga\u00e7\u00e3o permanente \u00e0 temperatura ambiente (20-30\u00b0C) sem adesivos ou processamento a alta temperatura.<\/p>","protected":false},"featured_media":2031,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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