{"id":2215,"date":"2026-04-15T02:54:20","date_gmt":"2026-04-15T02:54:20","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2215"},"modified":"2026-04-15T02:57:45","modified_gmt":"2026-04-15T02:57:45","slug":"wdp-1240-series-dry-polishing-machine","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/pl\/product\/wdp-1240-series-dry-polishing-machine\/","title":{"rendered":"Maszyna do polerowania na sucho serii WDP-1240 do odci\u0105\u017cania i obr\u00f3bki tylnej strony wafli 300 mm"},"content":{"rendered":"<p data-start=\"281\" data-end=\"650\"><img fetchpriority=\"high\" decoding=\"async\" class=\"alignright wp-image-2217\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-300x300.png\" alt=\"Maszyna do polerowania na sucho serii WDP-1240 do odci\u0105\u017cania i obr\u00f3bki tylnej strony wafli 300 mm\" width=\"290\" height=\"290\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing.png 1000w\" sizes=\"(max-width: 290px) 100vw, 290px\" \/>Maszyna do polerowania na sucho serii WDP-1240 to zaawansowany, precyzyjny system opracowany z my\u015bl\u0105 o usuwaniu napr\u0119\u017ce\u0144 i uszkodze\u0144 warstwy tylnej w produkcji p\u00f3\u0142przewodnik\u00f3w. Zaprojektowany specjalnie do przetwarzania wafli 300 mm, sprz\u0119t ten wykorzystuje proces polerowania na sucho w celu uzyskania wysokiej jako\u015bci wyko\u0144czenia powierzchni przy jednoczesnym zminimalizowaniu wp\u0142ywu na \u015brodowisko.<\/p>\n<p data-start=\"652\" data-end=\"959\">System ten jest szczeg\u00f3lnie odpowiedni do zaawansowanych zastosowa\u0144 opakowaniowych, w kt\u00f3rych przerzedzanie wafli i kontrola napr\u0119\u017ce\u0144 maj\u0105 kluczowe znaczenie. Poprzez skuteczne usuwanie podpowierzchniowych warstw uszkodze\u0144 powsta\u0142ych podczas proces\u00f3w szlifowania, WDP-1240 pomaga poprawi\u0107 integralno\u015b\u0107 wafla, zmniejszy\u0107 wypaczenia i zwi\u0119kszy\u0107 wytrzyma\u0142o\u015b\u0107 mechaniczn\u0105.<\/p>\n<p data-start=\"961\" data-end=\"1182\">W por\u00f3wnaniu z tradycyjnymi systemami polerowania na mokro, proces na sucho eliminuje zanieczyszczenia zwi\u0105zane z szlamem i zmniejsza wymagania dotycz\u0105ce przetwarzania odpad\u00f3w, dzi\u0119ki czemu jest bardziej przyjaznym dla \u015brodowiska i op\u0142acalnym rozwi\u0105zaniem.<\/p>\n<hr data-start=\"1184\" data-end=\"1187\" \/>\n<h2 data-section-id=\"m7ukan\" data-start=\"1189\" data-end=\"1232\">Kluczowe cechy i zalety techniczne<\/h2>\n<h3 data-section-id=\"capa5r\" data-start=\"1234\" data-end=\"1295\">Technologia polerowania na sucho o niskim wp\u0142ywie na \u015brodowisko<\/h3>\n<p data-start=\"1296\" data-end=\"1491\">WDP-1240 wykorzystuje w pe\u0142ni suchy proces polerowania, eliminuj\u0105c potrzeb\u0119 stosowania szlamu chemicznego. Znacz\u0105co zmniejsza to obci\u0105\u017cenie dla \u015brodowiska, upraszcza konserwacj\u0119 i obni\u017ca koszty operacyjne.<\/p>\n<h3 data-section-id=\"1awlizo\" data-start=\"1493\" data-end=\"1543\">Skuteczne \u0142agodzenie stresu i usuwanie uszkodze\u0144<\/h3>\n<p data-start=\"1544\" data-end=\"1722\">Zaprojektowany do usuwania tylnej warstwy uszkodze\u0144 po szlifowaniu wafla, system skutecznie uwalnia wewn\u0119trzne napr\u0119\u017cenia, zapewniaj\u0105c lepsz\u0105 p\u0142asko\u015b\u0107 wafla i stabilno\u015b\u0107 strukturaln\u0105.<\/p>\n<h3 data-section-id=\"90fwyd\" data-start=\"1724\" data-end=\"1762\">Zwi\u0119kszona wydajno\u015b\u0107 cienkich wafli<\/h3>\n<p data-start=\"1763\" data-end=\"1827\">Minimalizuj\u0105c koncentracj\u0119 napr\u0119\u017ce\u0144, urz\u0105dzenie pomaga zapobiega\u0107 ich powstawaniu:<\/p>\n<ul data-start=\"1828\" data-end=\"1876\">\n<li data-section-id=\"pus2hj\" data-start=\"1828\" data-end=\"1846\">P\u0119kanie wafli<\/li>\n<li data-section-id=\"wcbb49\" data-start=\"1847\" data-end=\"1864\">Odpryski na kraw\u0119dziach<\/li>\n<li data-section-id=\"bpnlvj\" data-start=\"1865\" data-end=\"1876\">Wypaczenie<\/li>\n<\/ul>\n<p data-start=\"1878\" data-end=\"1965\">Prowadzi to do wy\u017cszego wska\u017anika wydajno\u015bci, szczeg\u00f3lnie w przypadku du\u017cych i ultracienkich wafli.<\/p>\n<h3 data-section-id=\"98a0im\" data-start=\"1967\" data-end=\"2017\">Bezproblemowa integracja z systemami przerzedzania<\/h3>\n<p data-start=\"2018\" data-end=\"2217\">WDP-1240 mo\u017cna zintegrowa\u0107 z urz\u0105dzeniami poprzedzaj\u0105cymi, takimi jak automatyczna szlifierka do wafli WG1251, umo\u017cliwiaj\u0105c w pe\u0142ni zautomatyzowane linie produkcyjne z bezpiecznym i stabilnym transferem wafli mi\u0119dzy procesami.<\/p>\n<h3 data-section-id=\"1pvq7tz\" data-start=\"2219\" data-end=\"2265\">Stabilna i wytrzyma\u0142a struktura mechaniczna<\/h3>\n<p data-start=\"2266\" data-end=\"2435\">Sprz\u0119t jest wyposa\u017cony w pojedyncze wrzeciono, pojedynczy uchwyt i konfiguracj\u0119 obci\u0105gacza, co zapewnia sta\u0142\u0105 wydajno\u015b\u0107 polerowania i d\u0142ugoterminow\u0105 stabilno\u015b\u0107 operacyjn\u0105.<\/p>\n<hr data-start=\"2437\" data-end=\"2440\" \/>\n<h2 data-section-id=\"8lu2ky\" data-start=\"2442\" data-end=\"2472\">\u00a0Specyfikacja techniczna<\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2474\" data-end=\"2738\">\n<thead data-start=\"2474\" data-end=\"2498\">\n<tr data-start=\"2474\" data-end=\"2498\">\n<th class=\"\" data-start=\"2474\" data-end=\"2481\" data-col-size=\"sm\">Pozycja<\/th>\n<th class=\"\" data-start=\"2481\" data-end=\"2498\" data-col-size=\"md\">Specyfikacja<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2522\" data-end=\"2738\">\n<tr data-start=\"2522\" data-end=\"2583\">\n<td data-start=\"2522\" data-end=\"2534\" data-col-size=\"sm\">Struktura<\/td>\n<td data-start=\"2534\" data-end=\"2583\" data-col-size=\"md\">Wrzeciono \u00d71 \/ St\u00f3\u0142 uchwytu \u00d71 \/ Obci\u0105gacz \u00d71<\/td>\n<\/tr>\n<tr data-start=\"2584\" data-end=\"2618\">\n<td data-start=\"2584\" data-end=\"2600\" data-col-size=\"sm\">Moc wrzeciona<\/td>\n<td data-start=\"2600\" data-end=\"2618\" data-col-size=\"md\">7,5 kW \/ 11 kW<\/td>\n<\/tr>\n<tr data-start=\"2619\" data-end=\"2658\">\n<td data-start=\"2619\" data-end=\"2632\" data-col-size=\"sm\">Rozmiar wafla<\/td>\n<td data-start=\"2632\" data-end=\"2658\" data-col-size=\"md\">Do 12 cali (300 mm)<\/td>\n<\/tr>\n<tr data-start=\"2659\" data-end=\"2691\">\n<td data-start=\"2659\" data-end=\"2674\" data-col-size=\"sm\">Typ procesu<\/td>\n<td data-start=\"2674\" data-end=\"2691\" data-col-size=\"md\">Polerowanie na sucho<\/td>\n<\/tr>\n<tr data-start=\"2692\" data-end=\"2738\">\n<td data-start=\"2692\" data-end=\"2713\" data-col-size=\"sm\">Wymiary maszyny<\/td>\n<td data-start=\"2713\" data-end=\"2738\" data-col-size=\"md\">1450 \u00d7 3380 \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<hr data-start=\"2740\" data-end=\"2743\" \/>\n<h2 data-section-id=\"13yq5fc\" data-start=\"2745\" data-end=\"2768\">Zasada dzia\u0142ania<\/h2>\n<p data-start=\"2812\" data-end=\"2954\">WDP-1240 dzia\u0142a poprzez zastosowanie kontrolowanego mechanicznego polerowania tylnej strony p\u0142ytki przy u\u017cyciu szybkiego wrzeciona i precyzyjnego systemu uchwyt\u00f3w.<\/p>\n<p data-start=\"2956\" data-end=\"3193\">Po przerzedzeniu p\u0142ytki cz\u0119sto pod jej powierzchni\u0105 pozostaje uszkodzona warstwa, wprowadzaj\u0105ca wewn\u0119trzne napr\u0119\u017cenia. Proces polerowania na sucho usuwa t\u0119 warstw\u0119, zachowuj\u0105c \u015bcis\u0142\u0105 kontrol\u0119 nad ci\u015bnieniem i szybko\u015bci\u0105 usuwania materia\u0142u. Skutkuje to:<\/p>\n<ul data-start=\"3195\" data-end=\"3278\">\n<li data-section-id=\"1r1ex1w\" data-start=\"3195\" data-end=\"3222\">Jednolita jako\u015b\u0107 powierzchni<\/li>\n<li data-section-id=\"bhqqr1\" data-start=\"3223\" data-end=\"3250\">Zmniejszone napr\u0119\u017cenia szcz\u0105tkowe<\/li>\n<li data-section-id=\"1iz8bdx\" data-start=\"3251\" data-end=\"3278\">Poprawiona p\u0142asko\u015b\u0107 p\u0142ytki<\/li>\n<\/ul>\n<p data-start=\"3280\" data-end=\"3392\">Zintegrowana obci\u0105garka zapewnia, \u017ce narz\u0119dzia polerskie zachowuj\u0105 sta\u0142\u0105 wydajno\u015b\u0107 przez ca\u0142y proces.<\/p>\n<hr data-start=\"3394\" data-end=\"3397\" \/>\n<h2 data-section-id=\"1mpxdoq\" data-start=\"3399\" data-end=\"3422\"><img decoding=\"async\" class=\"size-medium wp-image-2171 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-300x300.webp\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-768x768.webp 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers.webp 800w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Zakres zastosowa\u0144<\/h2>\n<p data-start=\"3424\" data-end=\"3462\">Seria WDP-1240 jest szeroko stosowana w:<\/p>\n<ul data-start=\"3464\" data-end=\"3675\">\n<li data-section-id=\"thioxr\" data-start=\"3464\" data-end=\"3507\">Przetwarzanie tylnej strony p\u0142ytki p\u00f3\u0142przewodnikowej<\/li>\n<li data-section-id=\"1b52adm\" data-start=\"3508\" data-end=\"3557\">Zaawansowane opakowania (WLCSP, opakowania typu fan-out)<\/li>\n<li data-section-id=\"1lhtczs\" data-start=\"3558\" data-end=\"3590\">Polerowanie p\u0142ytek krzemowych (Si)<\/li>\n<li data-section-id=\"zqmbwb\" data-start=\"3591\" data-end=\"3633\">Przetwarzanie p\u0142ytek z w\u0119glika krzemu (SiC)<\/li>\n<li data-section-id=\"1xtbjfg\" data-start=\"3634\" data-end=\"3675\">Zastosowania zwi\u0105zane z odpr\u0119\u017caniem cienkich p\u0142ytek<\/li>\n<\/ul>\n<p data-start=\"3677\" data-end=\"3828\">Obs\u0142uguje wafle 12-calowe i mniejsze, dzi\u0119ki czemu nadaje si\u0119 zar\u00f3wno do g\u0142\u00f3wnego nurtu produkcji p\u00f3\u0142przewodnik\u00f3w, jak i do pojawiaj\u0105cych si\u0119 zaawansowanych technologii pakowania.<\/p>\n<hr data-start=\"3830\" data-end=\"3833\" \/>\n<h2 data-section-id=\"1116wfg\" data-start=\"3835\" data-end=\"3856\"><img decoding=\"async\" class=\"size-medium wp-image-2122 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Podstawowe zalety<\/h2>\n<ul data-start=\"3858\" data-end=\"4293\">\n<li data-section-id=\"6czk3i\" data-start=\"3858\" data-end=\"3942\">Niski wp\u0142yw na \u015brodowisko<br data-start=\"3888\" data-end=\"3891\" \/>Suchy proces eliminuje szlam i zmniejsza ilo\u015b\u0107 odpad\u00f3w<\/li>\n<li data-section-id=\"7ceake\" data-start=\"3944\" data-end=\"4024\">Wysoka poprawa rentowno\u015bci<br data-start=\"3972\" data-end=\"3975\" \/>Minimalizuje p\u0119kanie i wypaczanie cienkich wafli<\/li>\n<li data-section-id=\"aztc7d\" data-start=\"4026\" data-end=\"4104\">Wysoka stabilno\u015b\u0107 procesu<br data-start=\"4054\" data-end=\"4057\" \/>Solidna struktura zapewnia sp\u00f3jne wyniki<\/li>\n<li data-section-id=\"1viz6br\" data-start=\"4106\" data-end=\"4194\">Integracja linii produkcyjnej<br data-start=\"4139\" data-end=\"4142\" \/>Kompatybilno\u015b\u0107 ze zautomatyzowanymi systemami przerzedzania p\u0142ytek<\/li>\n<li data-section-id=\"vz1nvb\" data-start=\"4196\" data-end=\"4293\">Zoptymalizowany dla zaawansowanych opakowa\u0144<br data-start=\"4234\" data-end=\"4237\" \/>Zaprojektowany dla proces\u00f3w p\u00f3\u0142przewodnikowych nowej generacji<\/li>\n<\/ul>\n<hr data-start=\"4295\" data-end=\"4298\" \/>\n<h2 data-section-id=\"w1cnyx\" data-start=\"4300\" data-end=\"4309\">FAQ<\/h2>\n<p data-start=\"4311\" data-end=\"4563\">P1: Jaka jest g\u0142\u00f3wna zaleta polerowania na sucho w por\u00f3wnaniu do polerowania na mokro?<br data-start=\"4389\" data-end=\"4392\" \/>O: Polerowanie na sucho eliminuje u\u017cycie szlamu, zmniejszaj\u0105c wp\u0142yw na \u015brodowisko, upraszczaj\u0105c konserwacj\u0119 i obni\u017caj\u0105c koszty operacyjne przy jednoczesnym zachowaniu wysokiej jako\u015bci powierzchni.<\/p>\n<p data-start=\"4565\" data-end=\"4700\">P2: Jakie rozmiary p\u0142ytek s\u0105 obs\u0142ugiwane?<br data-start=\"4604\" data-end=\"4607\" \/>O: WDP-1240 obs\u0142uguje wafle do 12 cali (300 mm), w tym materia\u0142y Si i SiC.<\/p>\n<p data-start=\"4702\" data-end=\"4916\">P3: Czy to urz\u0105dzenie mo\u017cna zintegrowa\u0107 z lini\u0105 produkcyjn\u0105?<br data-start=\"4764\" data-end=\"4767\" \/>Tak. Mo\u017cna go p\u0142ynnie po\u0142\u0105czy\u0107 ze sprz\u0119tem do przerzedzania p\u0142ytek, takim jak WG1251, umo\u017cliwiaj\u0105c zautomatyzowany transfer p\u0142ytek i ci\u0105g\u0142e przetwarzanie.<\/p>","protected":false},"excerpt":{"rendered":"<p>Maszyna do polerowania na sucho serii WDP-1240 to zaawansowany, precyzyjny system opracowany z my\u015bl\u0105 o usuwaniu napr\u0119\u017ce\u0144 i uszkodze\u0144 warstwy tylnej w produkcji p\u00f3\u0142przewodnik\u00f3w. Zaprojektowany specjalnie do przetwarzania wafli 300 mm, sprz\u0119t ten wykorzystuje proces polerowania na sucho w celu uzyskania wysokiej jako\u015bci wyko\u0144czenia powierzchni przy jednoczesnym zminimalizowaniu wp\u0142ywu na \u015brodowisko.<\/p>","protected":false},"featured_media":2217,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[725],"product_tag":[995,1000,993,1001,996,997,999,998,994,1002],"class_list":{"0":"post-2215","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-polishing-machine","7":"product_tag-300mm-wafer-polishing","8":"product_tag-advanced-packaging-equipment","9":"product_tag-dry-polishing-machine","10":"product_tag-dry-wafer-processing","11":"product_tag-semiconductor-polishing-machine","12":"product_tag-sic-wafer-polishing","13":"product_tag-stress-relief-polishing-machine","14":"product_tag-wafer-backside-polishing","15":"product_tag-wafer-polishing-equipment","16":"product_tag-wafer-thinning-line-equipment","17":"desktop-align-left","18":"tablet-align-left","19":"mobile-align-left","20":"ast-product-gallery-layout-horizontal-slider","21":"ast-product-gallery-with-no-image","22":"ast-product-tabs-layout-horizontal","24":"first","25":"instock","26":"shipping-taxable","27":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/product\/2215","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/comments?post=2215"}],"version-history":[{"count":3,"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/product\/2215\/revisions"}],"predecessor-version":[{"id":2219,"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/product\/2215\/revisions\/2219"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/media\/2217"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/media?parent=2215"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/product_brand?post=2215"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/product_cat?post=2215"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/pl\/wp-json\/wp\/v2\/product_tag?post=2215"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}