Geoptimaliseerd voor geavanceerde verpakking
Ontworpen voor halfgeleiderprocessen van de volgende generatie<\/li>\n<\/ul>\n
\nFAQ<\/h2>\n
V1: Wat is het belangrijkste voordeel van droog polijsten ten opzichte van nat polijsten?
A: Droog polijsten elimineert het gebruik van slurry, waardoor de impact op het milieu vermindert, het onderhoud vereenvoudigd en de bedrijfskosten verlaagd worden terwijl de oppervlaktekwaliteit hoog blijft.<\/p>\n
V2: Welke wafermaten worden ondersteund?
A: De WDP-1240 ondersteunt wafers tot 12 inch (300 mm), inclusief Si en SiC-materialen.<\/p>\n
V3: Kan deze machine worden ge\u00efntegreerd in een productielijn?
A: Ja. Hij kan naadloos worden aangesloten op wafer thinning apparatuur zoals de WG1251, waardoor automatische wafertransfer en continue verwerking mogelijk worden.<\/p>","protected":false},"excerpt":{"rendered":"
De WDP-1240 serie droogpolijstmachine is een geavanceerd precisiesysteem dat is ontwikkeld voor het ontlasten van de achterzijde van wafers en het verwijderen van beschadigde lagen bij de productie van halfgeleiders. Deze apparatuur is speciaal ontworpen voor het verwerken van 300 mm wafers en maakt gebruik van een droog polijstproces om een hoogwaardige oppervlakteafwerking te bereiken en tegelijkertijd de impact op het milieu te minimaliseren.<\/p>","protected":false},"featured_media":2217,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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![\"WDP-1240](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-300x300.png\")
De WDP-1240 serie droogpolijstmachine is een geavanceerd precisiesysteem dat is ontwikkeld voor het ontlasten van de achterzijde van wafers en het verwijderen van beschadigde lagen bij de productie van halfgeleiders. Deze apparatuur is speciaal ontworpen voor het verwerken van 300 mm wafers en maakt gebruik van een droog polijstproces om een hoogwaardige oppervlakteafwerking te bereiken en tegelijkertijd de impact op het milieu te minimaliseren.<\/p>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-300x300.webp\")
Toepassingsbereik<\/h2>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png\")
Belangrijkste voordelen<\/h2>\n