![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-300x300.png\")
De WG-1261 serie is een zeer nauwkeurige, volledig automatische machine voor het dunnen van wafers, ontworpen voor 12-inch en kleinere SiC wafers, maar ook voor saffier, kwarts en keramische materialen. Als uitgebreide oplossing van een vertrouwde leverancier van halfgeleiderapparatuur integreert deze serie geavanceerde spindeltechnologie, hoogbelaste waferdragers en automatiseringsfuncties om stabiel, nauwkeurig en effici\u00ebnt waferdunnen te garanderen.<\/p>\n
De WG-1261 is uitgerust met krachtige, uiterst precieze luchtgelagerde spindels en een nieuwe generatie luchtgelagerde waferdragers met hoge belasting en lage trillingen, wat zorgt voor superieure stijfheid en verbeterde processtabiliteit. De omcirkelende spindelaandrijving met hoge stijfheid verhoogt de stijfheid van de machine nog verder, waardoor zelfs uitdagende materialen als SiC en saffier nauwkeurig bestuurd kunnen worden.<\/p>\n
De Autosetup-functionaliteit zorgt ervoor dat de machine automatisch de wielbehandeling afrondt na vervanging, waardoor handmatig ingrijpen overbodig wordt en zowel de productiviteit als de consistentie verbetert. Bovendien zorgt een online meetunit (bereik 0-1800 \u03bcm) voor een nauwkeurige dikteregeling, terwijl de SECS\/GEM connectiviteit een naadloze integratie in moderne smart fabs mogelijk maakt.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-300x300.png\")
Technische kenmerken<\/span><\/h2>\nDe WG-1261 serie is ideaal voor:<\/p>\n
| Item<\/th>\n | Specificatie<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|
| Structuur<\/td>\n | Spindel \u00d72 \/ Wafeldrager \u00d73 \/ Werktafel \u00d71 \/ Volautomatisch Transfer & Reinigingssysteem \u00d71<\/td>\n<\/tr>\n |
| Spindelvermogen<\/td>\n | 7,5 kW \/ 11 kW (optioneel)<\/td>\n<\/tr>\n |
| Diameter slijpen<\/td>\n | \u03c66\u2033, \u03c68\u2033, \u03c612\u2033<\/td>\n<\/tr>\n |
| Afmetingen (B\u00d7D\u00d7H)<\/td>\n | 1450 mm \u00d7 3380 mm \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
Veelgestelde vragen (FAQ)<\/strong><\/span><\/h2>\nA:<\/strong> De machine ondersteunt wafers tot 12 inch, waaronder SiC, saffier, kwarts en keramische materialen, wat veelzijdige verwerkingsopties biedt voor meerdere productielijnen.<\/li>\n A:<\/strong> Autosetup voltooit automatisch de wielaanpassing na vervanging, waardoor handmatig ingrijpen niet meer nodig is, er minder instelfouten optreden en er aanzienlijk bespaard kan worden op productietijd.<\/li>\n A:<\/strong> Ja, hij is uitgerust met een online meeteenheid (0-1800 \u03bcm) die zorgt voor nauwkeurige bewaking en controle van het dunner worden van de wafer tijdens het verwerken.<\/li>\n A:<\/strong> Absoluut. De machine ondersteunt SECS\/GEM-connectiviteit<\/strong>, die real-time bewaking, gegevensverzameling en integratie met slimme productiesystemen mogelijk maakt.<\/li>\n A:<\/strong> Met krachtige luchtgelagerde spindels, een trillingsarme waferdrager met hoge belasting en een omlopende spindelaandrijving met hoge stijfheid behoudt de WG-1261 een uitstekende processtabiliteit, zelfs voor SiC- en saffierwafers.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":" De WG-1261 serie volautomatische waferdunmachine is de perfecte oplossing voor moderne verwerking van halfgeleider- en optische wafers. Met hoge precisie, geavanceerde automatisering en compatibiliteit met meerdere materialen levert deze machine consistente, effici\u00ebnte en betrouwbare waferdunning voor SiC, saffier, kwarts en keramische wafers tot 12 inch. De WG-1261 serie is ideaal voor R&D, proefproductie en fabs op middelgrote tot grote schaal en zorgt voor een hogere opbrengst, lagere arbeidskosten en een geoptimaliseerde productie-effici\u00ebntie.<\/p>","protected":false},"featured_media":2135,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[724],"product_tag":[856,857,843,842,855,835,845,862,851,858,859,861,863,854,848,853,860,475,807,852],"class_list":{"0":"post-2134","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-grinding-machine","7":"product_tag-12-inch-wafer-thinning","8":"product_tag-air-bearing-spindle","9":"product_tag-automated-wafer-transfer","10":"product_tag-autosetup","11":"product_tag-ceramic-wafer-processing","12":"product_tag-fully-automatic-wafer-thinning-machine","13":"product_tag-high-precision-wafer-thinning","14":"product_tag-high-throughput-wafer-fabrication","15":"product_tag-low-operational-cost","16":"product_tag-low-vibration-wafer-carrier","17":"product_tag-online-thickness-measurement","18":"product_tag-optical-wafer-processing","19":"product_tag-process-stability","20":"product_tag-quartz-wafer-processing","21":"product_tag-rd-wafer-thinning","22":"product_tag-sapphire-wafer-thinning","23":"product_tag-secs-gem-connectivity","24":"product_tag-semiconductor-manufacturing","25":"product_tag-sic-wafer-thinning","26":"product_tag-wg-1261","27":"desktop-align-left","28":"tablet-align-left","29":"mobile-align-left","30":"ast-product-gallery-layout-horizontal-slider","31":"ast-product-tabs-layout-horizontal","33":"first","34":"instock","35":"shipping-taxable","36":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/product\/2134","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/comments?post=2134"}],"version-history":[{"count":2,"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/product\/2134\/revisions"}],"predecessor-version":[{"id":2137,"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/product\/2134\/revisions\/2137"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/media\/2135"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/media?parent=2134"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/product_brand?post=2134"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/product_cat?post=2134"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/nl\/wp-json\/wp\/v2\/product_tag?post=2134"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}} |
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\")
Waarom kiezen voor de WG-1261 serie?<\/span><\/h2>\n