{"id":2030,"date":"2026-03-27T01:57:48","date_gmt":"2026-03-27T01:57:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2030"},"modified":"2026-03-27T02:00:00","modified_gmt":"2026-03-27T02:00:00","slug":"semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/nl\/product\/semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing\/","title":{"rendered":"Semi Automatische Kamer Temperatuur Wafer Bonding Machine voor 2 tot 12 Inch Wafer Processing"},"content":{"rendered":"

\"\"De semi-automatische kamertemperatuurmachine voor wafer bonding is een uiterst nauwkeurig systeem voor bonding op waferniveau en chipniveau. Door mechanische druk te combineren met in situ oppervlakteactiveringstechnologie maakt het permanente hechting mogelijk bij kamertemperatuur (20-30\u00b0C) zonder kleefstoffen of verwerking bij hoge temperatuur. Dit minimaliseert thermische stress en materiaalvervorming, waardoor het ideaal is voor warmtegevoelige en heterogene materialen. De machine ondersteunt wafermaten van 2 inch tot 12 inch en is geschikt voor onderzoek, proefproductie en kleine tot middelgrote productie.<\/p>\n

\"\"Belangrijkste kenmerken<\/strong><\/h2>\n
    \n
  1. Verbinding bij kamertemperatuur<\/strong> - Werkt bij 25 \u00b1 5\u00b0C om thermische mismatch en kromtrekken van de wafer te voorkomen.<\/li>\n
  2. Activering van het oppervlak<\/strong> - Plasma of chemische activering verbetert de hechtsterkte; optioneel sputteren verbetert de interfacekwaliteit.<\/li>\n
  3. Uitlijning met hoge precisie<\/strong> - Visueel uitlijnsysteem en precisiebewegingsplatform met \u00b10,5 \u03bcm nauwkeurigheid.<\/li>\n
  4. Brede materiaalcompatibiliteit<\/strong> - Ondersteunt Si, SiC, GaAs, GaN, InP, saffier, glas, LiNbO\u2083, LiTaO\u2083, diamant en geselecteerde polymeren.<\/li>\n
  5. Semi-automatische bediening<\/strong> - Handmatig laden van wafers met geautomatiseerd hechtproces; programmeerbare recepten voor reproduceerbare resultaten.<\/li>\n
  6. Schoon en stabiel milieu<\/strong> - Het ingebouwde Klasse 100 reinigingssysteem zorgt voor een lage vervuiling en interface leegloop <0,1%.<\/li>\n<\/ol>\n

    Technische specificaties<\/strong><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Parameter<\/th>\nSpecificatie<\/th>\n<\/tr>\n<\/thead>\n
    Wafergrootte<\/td>\n2\u2033 - 12\u2033, compatibel met onregelmatige monsters<\/td>\n<\/tr>\n
    Verbindingstemperatuur<\/td>\n20-30\u00b0C<\/td>\n<\/tr>\n
    Maximale druk<\/td>\n80 kN<\/td>\n<\/tr>\n
    Drukregeling<\/td>\n0-5000 N instelbaar, resolutie \u00b11 N<\/td>\n<\/tr>\n
    Nauwkeurigheid uitlijning<\/td>\n\u00b10,5 \u03bcm<\/td>\n<\/tr>\n
    Hechtsterkte<\/td>\n\u22652,0 J\/m\u00b2<\/td>\n<\/tr>\n
    Oppervlaktebehandeling<\/td>\nIn situ activering + afzetting door sputteren<\/td>\n<\/tr>\n
    Voedingsmodus<\/td>\nHandmatig<\/td>\n<\/tr>\n
    Reinheidsniveau<\/td>\nKlasse 100<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    Kerntechnologie<\/strong><\/h2>\n
      \n
    1. Directe verlijming bij kamertemperatuur<\/strong> - Geactiveerde oppervlakken maken contact onder gecontroleerde druk en vormen stabiele bindingen zonder thermische gloeiing.<\/li>\n
    2. Activering van het oppervlak<\/strong> - Verhoogt de oppervlakte-energie, verwijdert verontreinigingen en verbetert de uniformiteit van de hechting op verschillende materialen.<\/li>\n<\/ol>\n

      \"\"Toepassingen<\/strong><\/h2>\n
        \n
      1. Geavanceerde verpakking van halfgeleiders<\/strong> - 3D IC-stapelen, TSV-lijmen, heterogene integratie van logica- en geheugenchips.<\/li>\n
      2. MEMS Productie<\/strong> - Vacu\u00fcmverpakking op waferniveau voor sensoren zoals versnellingsmeters en gyroscopen.<\/li>\n
      3. Opto-elektronica en beeldschermen<\/strong> - Lijmen van LED's, lijmen van saffier en glassubstraten, assemblage van AR\/VR optische modules.<\/li>\n
      4. Microflu\u00efdica en biochips<\/strong> - PDMS en glasbinding met behoud van biologische activiteit.<\/li>\n
      5. Onderzoek en nieuwe apparaten<\/strong> - Flexibele elektronica, kwantumapparaten en heterogene materiaalintegratie.<\/li>\n<\/ol>\n

        Service en ondersteuning<\/strong><\/h2>\n
          \n
        1. Procesontwikkeling<\/strong> - Optimalisatie van bindingsparameters en oppervlakteactiveringsoplossingen voor verschillende materialen.<\/li>\n
        2. Aanpassing van apparatuur<\/strong> - Uitlijnmodules met hoge precisie, vacu\u00fcmkamers of kamers met gecontroleerde atmosfeer.<\/li>\n
        3. Technische training<\/strong> - Begeleiding op locatie en debugging van processen.<\/li>\n
        4. Ondersteuning na verkoop<\/strong> - 12 maanden garantie, snelle vervanging van belangrijke onderdelen, diagnose op afstand en software-updates.<\/li>\n<\/ol>\n

          FAQ<\/h2>\n

          V: Wat is het belangrijkste voordeel van lijmen bij kamertemperatuur?
          A: Het elimineert thermische spanning en maakt betrouwbaar lijmen van warmtegevoelige en heterogene materialen mogelijk.<\/p>\n

          V: Welke materialen kunnen worden verlijmd?
          A: Silicium, siliciumcarbide, galliumnitride, galliumarsenide, indiumfosfide, saffier, glas, lithiumniobaat, diamant en geselecteerde polymeren.<\/p>","protected":false},"excerpt":{"rendered":"

          De semi-automatische kamertemperatuurmachine voor wafer bonding is een uiterst nauwkeurig systeem voor bonding op waferniveau en chipniveau. Door mechanische druk te combineren met in situ oppervlakteactiveringstechnologie maakt het permanente hechting mogelijk bij kamertemperatuur (20-30\u00b0C) zonder kleefstoffen of verwerking bij hoge temperatuur.<\/p>","protected":false},"featured_media":2031,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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