{"id":1582,"date":"2026-01-05T05:39:17","date_gmt":"2026-01-05T05:39:17","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=1582"},"modified":"2026-01-05T06:06:33","modified_gmt":"2026-01-05T06:06:33","slug":"sic-precision-bonding-machine-for-bubble-free-wafer-and-sic-seed-assembly","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/ko\/product\/sic-precision-bonding-machine-for-bubble-free-wafer-and-sic-seed-assembly\/","title":{"rendered":"SiC Precision Bonding Machine for Bubble-Free Wafer and SiC Seed Assembly"},"content":{"rendered":"<h2 data-start=\"343\" data-end=\"378\"><strong data-start=\"346\" data-end=\"376\">\uc81c\ud488 \uac1c\uc694<\/strong><\/h2>\n<p data-start=\"380\" data-end=\"578\">The SiC Bonding Machine is a high-precision, vacuum-assisted system designed to bond wafers, SiC seeds, graphite paper, and graphite plates with exceptional accuracy and stability.<\/p>\n<p data-start=\"580\" data-end=\"593\">It ensures:<\/p>\n<ul data-start=\"595\" data-end=\"801\">\n<li data-start=\"595\" data-end=\"653\">\n<p data-start=\"597\" data-end=\"653\">Precise center alignment for wafers and substrates<\/p>\n<\/li>\n<li data-start=\"654\" data-end=\"713\">\n<p data-start=\"656\" data-end=\"713\">Uniform compression for stable, bubble-free bonding<\/p>\n<\/li>\n<li data-start=\"714\" data-end=\"801\">\n<p data-start=\"716\" data-end=\"801\">Reproducible results suitable for both R&amp;D and small-to-medium scale production<\/p>\n<\/li>\n<\/ul>\n<p data-start=\"803\" data-end=\"996\">Ideal for semiconductors, SiC seed bonding, high-temperature ceramics, and advanced materials research, this machine provides a reliable, efficient, and high-quality bonding solution.<\/p>\n<p data-start=\"803\" data-end=\"996\"><img fetchpriority=\"high\" decoding=\"async\" class=\"wp-image-1585 size-large aligncenter\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/59ede938-d59b-40d3-98f7-cec380e5f88a-1024x532.png\" alt=\"\" width=\"1024\" height=\"532\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/59ede938-d59b-40d3-98f7-cec380e5f88a-1024x532.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/59ede938-d59b-40d3-98f7-cec380e5f88a-300x156.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/59ede938-d59b-40d3-98f7-cec380e5f88a-768x399.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/59ede938-d59b-40d3-98f7-cec380e5f88a-600x312.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/59ede938-d59b-40d3-98f7-cec380e5f88a.png 1384w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<h2 data-start=\"1003\" data-end=\"1037\"><strong data-start=\"1006\" data-end=\"1035\">Key Features &amp; Advantages<\/strong><\/h2>\n<ul data-start=\"1039\" data-end=\"1652\">\n<li data-start=\"1039\" data-end=\"1135\">\n<p data-start=\"1041\" data-end=\"1135\"><strong data-start=\"1041\" data-end=\"1064\">Precision Alignment<\/strong> \u2013 Mechanically ensures exact center positioning for perfect bonding.<\/p>\n<\/li>\n<li data-start=\"1136\" data-end=\"1240\">\n<p data-start=\"1138\" data-end=\"1240\"><strong data-start=\"1138\" data-end=\"1172\">Vacuum-Assisted Bubble Removal<\/strong> \u2013 Eliminates air pockets for <strong data-start=\"1202\" data-end=\"1237\">defect-free adhesive interfaces<\/strong>.<\/p>\n<\/li>\n<li data-start=\"1241\" data-end=\"1345\">\n<p data-start=\"1243\" data-end=\"1345\"><strong data-start=\"1243\" data-end=\"1266\">Adjustable Pressure<\/strong> \u2013 Provides <strong data-start=\"1278\" data-end=\"1301\">uniform compression<\/strong> for consistent bonding across substrates.<\/p>\n<\/li>\n<li data-start=\"1346\" data-end=\"1448\">\n<p data-start=\"1348\" data-end=\"1448\"><strong data-start=\"1348\" data-end=\"1372\">Material Flexibility<\/strong> \u2013 Compatible with wafers, SiC seeds, graphite paper, and graphite plates.<\/p>\n<\/li>\n<li data-start=\"1449\" data-end=\"1549\">\n<p data-start=\"1451\" data-end=\"1549\"><strong data-start=\"1451\" data-end=\"1473\">High Repeatability<\/strong> \u2013 Delivers consistent results for pilot-scale production or R&amp;D projects.<\/p>\n<\/li>\n<li data-start=\"1550\" data-end=\"1652\">\n<p data-start=\"1552\" data-end=\"1652\"><strong data-start=\"1552\" data-end=\"1579\">User-Friendly Interface<\/strong> \u2013 Simple controls for process monitoring and semi-automated operation.<\/p>\n<\/li>\n<\/ul>\n<h2 data-start=\"1659\" data-end=\"1683\"><strong data-start=\"1662\" data-end=\"1681\">System Features<\/strong><\/h2>\n<ul data-start=\"1685\" data-end=\"2217\">\n<li data-start=\"1685\" data-end=\"1759\">\n<p data-start=\"1687\" data-end=\"1759\"><strong data-start=\"1687\" data-end=\"1714\">Vacuum-Assisted Bonding<\/strong> \u2013 Ensures bubble-free and uniform adhesion<\/p>\n<\/li>\n<li data-start=\"1760\" data-end=\"1861\">\n<p data-start=\"1762\" data-end=\"1861\"><strong data-start=\"1762\" data-end=\"1792\">Precision Pressure Control<\/strong> \u2013 Adjustable for various substrate types and adhesive requirements<\/p>\n<\/li>\n<li data-start=\"1862\" data-end=\"1954\">\n<p data-start=\"1864\" data-end=\"1954\"><strong data-start=\"1864\" data-end=\"1894\">Center Alignment Mechanism<\/strong> \u2013 Guarantees accurate positioning of wafers and SiC seeds<\/p>\n<\/li>\n<li data-start=\"1955\" data-end=\"2065\">\n<p data-start=\"1957\" data-end=\"2065\"><strong data-start=\"1957\" data-end=\"1990\">Programmable Process Settings<\/strong> \u2013 Customizable temperature, pressure, and dwell time for precise control<\/p>\n<\/li>\n<li data-start=\"2066\" data-end=\"2132\">\n<p data-start=\"2068\" data-end=\"2132\"><strong data-start=\"2068\" data-end=\"2095\">Compact, Modular Design<\/strong> \u2013 Easy integration and maintenance<\/p>\n<\/li>\n<li data-start=\"2133\" data-end=\"2217\">\n<p data-start=\"2135\" data-end=\"2217\"><strong data-start=\"2135\" data-end=\"2164\">Data Logging &amp; Monitoring<\/strong> \u2013 Records process parameters for quality assurance<\/p>\n<\/li>\n<\/ul>\n<p><img decoding=\"async\" class=\"aligncenter wp-image-1587 size-full\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/8dd8242e-31c1-4b71-b055-dcefd46d2715_\u526f\u672c.png\" alt=\"\" width=\"866\" height=\"685\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/8dd8242e-31c1-4b71-b055-dcefd46d2715_\u526f\u672c.png 866w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/8dd8242e-31c1-4b71-b055-dcefd46d2715_\u526f\u672c-300x237.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/8dd8242e-31c1-4b71-b055-dcefd46d2715_\u526f\u672c-768x607.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/8dd8242e-31c1-4b71-b055-dcefd46d2715_\u526f\u672c-600x475.png 600w\" sizes=\"(max-width: 866px) 100vw, 866px\" \/><\/p>\n<h2 data-start=\"2224\" data-end=\"2257\"><strong data-start=\"2227\" data-end=\"2255\">\uae30\uc220 \uc0ac\uc591<\/strong><\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex w-fit flex-col-reverse\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2259\" data-end=\"2901\">\n<thead data-start=\"2259\" data-end=\"2296\">\n<tr data-start=\"2259\" data-end=\"2296\">\n<th data-start=\"2259\" data-end=\"2271\" data-col-size=\"sm\">\ub9e4\uac1c\ubcc0\uc218<\/th>\n<th data-start=\"2271\" data-end=\"2287\" data-col-size=\"sm\">\uc0ac\uc591<\/th>\n<th data-start=\"2287\" data-end=\"2296\" data-col-size=\"md\">Notes<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2335\" data-end=\"2901\">\n<tr data-start=\"2335\" data-end=\"2427\">\n<td data-start=\"2335\" data-end=\"2364\" data-col-size=\"sm\"><strong data-start=\"2337\" data-end=\"2363\">Maximum Substrate Size<\/strong><\/td>\n<td data-start=\"2364\" data-end=\"2377\" data-col-size=\"sm\">\u226412 inches<\/td>\n<td data-start=\"2377\" data-end=\"2427\" data-col-size=\"md\">Supports small to medium wafers and substrates<\/td>\n<\/tr>\n<tr data-start=\"2428\" data-end=\"2489\">\n<td data-start=\"2428\" data-end=\"2447\" data-col-size=\"sm\"><strong data-start=\"2430\" data-end=\"2446\">\uc9c4\uacf5 \ub808\ubca8<\/strong><\/td>\n<td data-start=\"2447\" data-end=\"2458\" data-col-size=\"sm\">\u226410\u207b\u00b2\u202fPa<\/td>\n<td data-start=\"2458\" data-end=\"2489\" data-col-size=\"md\">Ensures bubble-free bonding<\/td>\n<\/tr>\n<tr data-start=\"2490\" data-end=\"2559\">\n<td data-start=\"2490\" data-end=\"2511\" data-col-size=\"sm\"><strong data-start=\"2492\" data-end=\"2510\">\uc555\ub825 \ubc94\uc704<\/strong><\/td>\n<td data-start=\"2511\" data-end=\"2521\" data-col-size=\"sm\">0\u20135 MPa<\/td>\n<td data-start=\"2521\" data-end=\"2559\" data-col-size=\"md\">Adjustable for uniform compression<\/td>\n<\/tr>\n<tr data-start=\"2560\" data-end=\"2652\">\n<td data-start=\"2560\" data-end=\"2584\" data-col-size=\"sm\"><strong data-start=\"2562\" data-end=\"2583\">\uc628\ub3c4 \ubc94\uc704<\/strong><\/td>\n<td data-start=\"2584\" data-end=\"2603\" data-col-size=\"sm\">Ambient \u2013 300\u202f\u00b0C<\/td>\n<td data-start=\"2603\" data-end=\"2652\" data-col-size=\"md\">Optional heated bonding for special adhesives<\/td>\n<\/tr>\n<tr data-start=\"2653\" data-end=\"2730\">\n<td data-start=\"2653\" data-end=\"2670\" data-col-size=\"sm\"><strong data-start=\"2655\" data-end=\"2669\">Cycle Time<\/strong><\/td>\n<td data-start=\"2670\" data-end=\"2681\" data-col-size=\"sm\">5\u201360 min<\/td>\n<td data-start=\"2681\" data-end=\"2730\" data-col-size=\"md\">Adjustable depending on substrate and process<\/td>\n<\/tr>\n<tr data-start=\"2731\" data-end=\"2815\">\n<td data-start=\"2731\" data-end=\"2750\" data-col-size=\"sm\"><strong data-start=\"2733\" data-end=\"2749\">\uc804\uc6d0 \uacf5\uae09 \uc7a5\uce58<\/strong><\/td>\n<td data-start=\"2750\" data-end=\"2764\" data-col-size=\"sm\">220V \/ 380V<\/td>\n<td data-start=\"2764\" data-end=\"2815\" data-col-size=\"md\">Single or three-phase depending on installation<\/td>\n<\/tr>\n<tr data-start=\"2816\" data-end=\"2901\">\n<td data-start=\"2816\" data-end=\"2837\" data-col-size=\"sm\"><strong data-start=\"2818\" data-end=\"2836\">Motion Control<\/strong><\/td>\n<td data-start=\"2837\" data-end=\"2864\" data-col-size=\"sm\">Manual or semi-automated<\/td>\n<td data-start=\"2864\" data-end=\"2901\" data-col-size=\"md\">For precise alignment and bonding<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h2 data-start=\"2908\" data-end=\"2929\"><strong data-start=\"2911\" data-end=\"2927\">\uc560\ud50c\ub9ac\ucf00\uc774\uc158<\/strong><\/h2>\n<ul data-start=\"2931\" data-end=\"3343\">\n<li data-start=\"2931\" data-end=\"3005\">\n<p data-start=\"2933\" data-end=\"3005\"><strong data-start=\"2933\" data-end=\"2953\">SiC Seed Bonding<\/strong> \u2013 High-precision bonding for SiC seeds and wafers<\/p>\n<\/li>\n<li data-start=\"3006\" data-end=\"3080\">\n<p data-start=\"3008\" data-end=\"3080\"><strong data-start=\"3008\" data-end=\"3039\">Semiconductor Wafer Bonding<\/strong> \u2013 Single or multi-layer wafer adhesion<\/p>\n<\/li>\n<li data-start=\"3081\" data-end=\"3188\">\n<p data-start=\"3083\" data-end=\"3188\"><strong data-start=\"3083\" data-end=\"3113\">Graphite Substrate Bonding<\/strong> \u2013 High-temperature and high-strength bonding of graphite paper or plates<\/p>\n<\/li>\n<li data-start=\"3189\" data-end=\"3272\">\n<p data-start=\"3191\" data-end=\"3272\"><strong data-start=\"3191\" data-end=\"3219\">Pilot and R&amp;D Production<\/strong> \u2013 Small-batch, research, or pilot-scale production<\/p>\n<\/li>\n<li data-start=\"3273\" data-end=\"3343\">\n<p data-start=\"3275\" data-end=\"3343\"><strong data-start=\"3275\" data-end=\"3297\">Advanced Materials<\/strong> \u2013 Bonding ceramics and composite substrates<\/p>\n<\/li>\n<\/ul>\n<p><img decoding=\"async\" class=\"aligncenter wp-image-1586 size-large\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/a6497651-59d9-4ca0-84a8-6def06ea9122-1024x543.png\" alt=\"\" width=\"1024\" height=\"543\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/a6497651-59d9-4ca0-84a8-6def06ea9122-1024x543.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/a6497651-59d9-4ca0-84a8-6def06ea9122-300x159.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/a6497651-59d9-4ca0-84a8-6def06ea9122-768x407.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/a6497651-59d9-4ca0-84a8-6def06ea9122-600x318.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/01\/a6497651-59d9-4ca0-84a8-6def06ea9122.png 1358w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<h2 data-start=\"3350\" data-end=\"3391\"><strong data-start=\"3353\" data-end=\"3389\">FAQ \u2013 Frequently Asked Questions<\/strong><\/h2>\n<p data-start=\"3393\" data-end=\"3557\"><strong data-start=\"3393\" data-end=\"3449\">Q1: What types of substrates can the machine handle?<\/strong><br data-start=\"3449\" data-end=\"3452\" \/><strong data-start=\"3452\" data-end=\"3459\">A1:<\/strong> Wafers, SiC seeds, graphite paper, and graphite plates, including rigid and flexible materials.<\/p>\n<p data-start=\"3559\" data-end=\"3698\"><strong data-start=\"3559\" data-end=\"3603\">Q2: How is bubble-free bonding achieved?<\/strong><br data-start=\"3603\" data-end=\"3606\" \/><strong data-start=\"3606\" data-end=\"3613\">A2:<\/strong> Vacuum-assisted bonding removes trapped air, ensuring defect-free adhesive layers.<\/p>\n<p data-start=\"3700\" data-end=\"3869\"><strong data-start=\"3700\" data-end=\"3749\">Q3: Can pressure and temperature be adjusted?<\/strong><br data-start=\"3749\" data-end=\"3752\" \/><strong data-start=\"3752\" data-end=\"3759\">A3:<\/strong> Yes, pressure is adjustable from 0\u20135 MPa, and temperature can reach up to 300\u202f\u00b0C for specialized adhesives.<\/p>\n<p data-start=\"3871\" data-end=\"4010\"><strong data-start=\"3871\" data-end=\"3931\">Q4: Is this machine suitable for pilot-scale production?<\/strong><br data-start=\"3931\" data-end=\"3934\" \/><strong data-start=\"3934\" data-end=\"3941\">A4:<\/strong> Yes, it is ideal for R&amp;D, pilot-scale, and small-batch production.<\/p>\n<p data-start=\"4012\" data-end=\"4154\"><strong data-start=\"4012\" data-end=\"4055\">Q5: How user-friendly is the operation?<\/strong><br data-start=\"4055\" data-end=\"4058\" \/><strong data-start=\"4058\" data-end=\"4065\">A5:<\/strong> The interface is intuitive, with semi-automated alignment and easy process monitoring.<\/p>","protected":false},"excerpt":{"rendered":"<p>The SiC Bonding Machine is a high-precision, vacuum-assisted system designed to bond wafers, SiC seeds, graphite paper, and graphite plates with exceptional accuracy and stability.<\/p>","protected":false},"featured_media":1584,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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