{"id":2512,"date":"2026-06-02T06:04:17","date_gmt":"2026-06-02T06:04:17","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2512"},"modified":"2026-07-08T09:47:29","modified_gmt":"2026-07-08T09:47:29","slug":"sapphire-temporary-wafer-carrier-for-advanced-semiconductor-packaging","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/hu\/product\/sapphire-temporary-wafer-carrier-for-advanced-semiconductor-packaging\/","title":{"rendered":"Sapphire ideiglenes ostyahordoz\u00f3 fejlett f\u00e9lvezet\u0151-csomagol\u00e1shoz"},"content":{"rendered":"

A zaf\u00edrb\u00f3l k\u00e9sz\u00fclt ideiglenes szil\u00edciumlapka-hordoz\u00f3 egy nagy teljes\u00edtm\u00e9ny\u0171 hordoz\u00f3anyag, amelyet fejlett f\u00e9lvezet\u0151-csomagol\u00e1si folyamatokhoz terveztek, k\u00fcl\u00f6n\u00f6sen az ultrav\u00e9kony szil\u00edciumlapk\u00e1k kezel\u00e9s\u00e9hez \u00e9s a heterog\u00e9n integr\u00e1ci\u00f3s alkalmaz\u00e1sokhoz.<\/p>\n

Sz\u00e9les k\u00f6rben alkalmazz\u00e1k a 2,5D\/3D integr\u00e1lt \u00e1ramk\u00f6ri csomagol\u00e1s, a TSV \u00e9s az RDL folyamatok, valamint a fan-out wafer\/panel szint\u0171 csomagol\u00e1s (FOWLP\/FOPLP) \u00e9s az ideiglenes ragaszt\u00e1s\/lev\u00e1laszt\u00e1s munkafolyamataiban.<\/p>\n

A rendk\u00edv\u00fcl nagy merevs\u00e9ggel \u00e9s kiv\u00e1l\u00f3 h\u0151stabilit\u00e1ssal tervezett hordoz\u00f3 prec\u00edz \u00e9s stabil mechanikai alapot biztos\u00edt a szil\u00edciumlapok v\u00e9kony\u00edt\u00e1s\u00e1hoz \u00e9s h\u00e1toldali megmunk\u00e1l\u00e1s\u00e1hoz, lehet\u0151v\u00e9 t\u00e9ve az 50 \u03bcm-n\u00e9l v\u00e9konyabb szil\u00edciumlapok megb\u00edzhat\u00f3 kezel\u00e9s\u00e9t, mik\u00f6zben komplex h\u0151ciklusok mellett is meg\u0151rzi a m\u00e9retbeli integrit\u00e1st.<\/p>\n

\"\"<\/p>\n

\n

\"\"Az ipar\u00e1g kih\u00edv\u00e1sai<\/strong><\/span><\/h2>\n

A fejlett csomagol\u00e1si technol\u00f3gi\u00e1k folyamatosan fejl\u0151dnek: egyre v\u00e9konyabb szerkezetek, nagyobb m\u00e9retek \u00e9s nagyobb integr\u00e1ci\u00f3s s\u0171r\u0171s\u00e9g fel\u00e9 haladnak. A gy\u00e1rt\u00e1si folyamat instabilit\u00e1sa azonban tov\u00e1bbra is kritikus sz\u0171k keresztmetszetet jelent.<\/p>\n

A legfontosabb m\u0171szaki kih\u00edv\u00e1sok a k\u00f6vetkez\u0151k:<\/p>\n

    \n
  • T\u00f6bbf\u00e9le csomagol\u00f3anyag k\u00f6z\u00f6tti h\u0151t\u00e1gul\u00e1si egy\u00fctthat\u00f3 (CTE) elt\u00e9r\u00e9s<\/li>\n
  • A stressz felhalmoz\u00f3d\u00e1sa ism\u00e9telt h\u0151ciklusok sor\u00e1n<\/li>\n
  • A ragaszt\u00f3 k\u00f6t\u00e9skor bek\u00f6vetkez\u0151 zsugorod\u00e1sa \u00e9s a fel\u00fcleti deform\u00e1ci\u00f3<\/li>\n
  • Az ultrav\u00e9kony szil\u00edciumlapka-r\u00e9tegek egyenetlen vastags\u00e1geloszl\u00e1sa<\/li>\n
  • A deform\u00e1ci\u00f3 okozta ir\u00e1nyelt\u00e9r\u00e9s \u00e9s a hozamcs\u00f6kken\u00e9s<\/li>\n
  • Az ultrav\u00e9kony szil\u00edciumlapok mechanikai t\u00f6r\u00e9kenys\u00e9ge kezel\u00e9s \u00e9s sz\u00e1ll\u00edt\u00e1s k\u00f6zben<\/li>\n<\/ul>\n

    Ezek a k\u00e9rd\u00e9sek jelent\u0151sen befoly\u00e1solj\u00e1k a folyamat hozam\u00e1t, megb\u00edzhat\u00f3s\u00e1g\u00e1t \u00e9s sk\u00e1l\u00e1zhat\u00f3s\u00e1g\u00e1t a fejlett csomagol\u00e1sgy\u00e1rt\u00e1sban.<\/p>\n

    \n

    \"\"Megold\u00e1s: Sapphire hordoz\u00f3platform<\/strong><\/span><\/h2>\n

    A zaf\u00edr mechanikai szil\u00e1rds\u00e1g\u00e1nak, optikai \u00e1tl\u00e1tsz\u00f3s\u00e1g\u00e1nak \u00e9s h\u0151stabilit\u00e1s\u00e1nak term\u00e9szetes kombin\u00e1ci\u00f3ja r\u00e9v\u00e9n ide\u00e1lis alapanyagot jelent az ideiglenes szil\u00edciumlapka-hordoz\u00f3khoz.<\/p>\n

    Lehet\u0151v\u00e9 teszi:<\/p>\n

      \n
    • Nagy pontoss\u00e1g\u00fa mechanikus tart\u00f3szerkezet ultrav\u00e9kony szil\u00edciumlapokhoz<\/li>\n
    • A feldolgoz\u00e1s sor\u00e1n cs\u00f6kkentett hajl\u00edt\u00e1s \u00e9s deform\u00e1ci\u00f3<\/li>\n
    • Kompatibilit\u00e1s a l\u00e9zeres lev\u00e1laszt\u00e1si technol\u00f3gi\u00e1kkal<\/li>\n
    • Egyenletes fesz\u00fclts\u00e9geloszl\u00e1s nagy fel\u00fclet\u0171 hordoz\u00f3kon<\/li>\n
    • Stabil teljes\u00edtm\u00e9ny magas h\u0151m\u00e9rs\u00e9klet\u0171 \u00e9s vegyi k\u00f6rnyezetben<\/li>\n<\/ul>\n
      \n

      A legfontosabb teljes\u00edtm\u00e9nybeli el\u0151ny\u00f6k<\/strong><\/span><\/h2>\n

      Magas Young-modulus (345\u2013420 GPa)<\/strong>
      Kiv\u00e9teles merevs\u00e9get biztos\u00edt, hat\u00e9konyan cs\u00f6kkentve az ostya hajl\u00edt\u00e1s\u00e1t \u00e9s a szerkezet torzul\u00e1s\u00e1t a h\u0151kezel\u00e9si \u00e9s mechanikai folyamatok sor\u00e1n.<\/p>\n

      Kiv\u00e1l\u00f3 mechanikai szil\u00e1rds\u00e1g (1800\u20132200 HV)<\/strong>
      Kiv\u00e1l\u00f3 ellen\u00e1ll\u00e1st biztos\u00edt a fel\u00fcleti s\u00e9r\u00fcl\u00e9sekkel \u00e9s a mechanikai kop\u00e1ssal szemben, \u00edgy ipari k\u00f6rnyezetben is hossz\u00fa t\u00e1von \u00fajrahasznos\u00edthat\u00f3.<\/p>\n

      Magas optikai \u00e1tl\u00e1tsz\u00f3s\u00e1g (>83%, 300\u20131200 nm)<\/strong>
      Lehet\u0151v\u00e9 teszi a hat\u00e9kony l\u00e9zeres \u00e1tvitelt, t\u00e1mogatva a fejlett l\u00e9zeres lev\u00e1laszt\u00e1si \u00e9s ideiglenes ragaszt\u00e1si elj\u00e1r\u00e1sokat.<\/p>\n

      Kiv\u00e1l\u00f3 anyagegys\u00e9gess\u00e9g<\/strong>
      Minimaliz\u00e1lja a nagy m\u00e9ret\u0171 hordoz\u00f3kon fell\u00e9p\u0151 helyi fesz\u00fclts\u00e9gingadoz\u00e1sokat, jav\u00edtva ezzel a folyamat konzisztenci\u00e1j\u00e1t \u00e9s a hozam stabilit\u00e1s\u00e1t.<\/p>\n

      Kiv\u00e1l\u00f3 h\u0151- \u00e9s vegyi ellen\u00e1ll\u00f3s\u00e1g<\/strong>
      Ism\u00e9telt h\u0151ciklusok \u00e9s vegyi tiszt\u00edt\u00e1s mellett is meg\u0151rzi szerkezeti integrit\u00e1s\u00e1t.<\/p>\n

      \n

      M\u0171szaki specifik\u00e1ci\u00f3k<\/strong><\/span><\/h2>\n

      Geometria \u00e9s form\u00e1tumok<\/strong><\/span><\/h3>\n
      \n
      \n\n\n\n\n\n\n\n
      Param\u00e9ter<\/th>\nSpecifik\u00e1ci\u00f3<\/th>\n<\/tr>\n<\/thead>\n
      Wafer m\u00e9ret<\/td>\n8 inch \/ 12 inch<\/td>\n<\/tr>\n
      A panel m\u00e9rete<\/td>\n100 \u00d7 100 mm \u2013 510 \u00d7 515 mm<\/td>\n<\/tr>\n
      Vastags\u00e1g tartom\u00e1ny<\/td>\n0,7\u20132,0 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
      \n

      M\u00e9retbeli \u00e9s fel\u00fcleti tulajdons\u00e1gok<\/strong><\/span><\/h3>\n
      \n
      \n\n\n\n\n\n\n\n\n\n
      Ingatlan<\/th>\nNorm\u00e1l min\u0151s\u00e9g<\/th>\nKiv\u00e1l\u00f3 pontoss\u00e1g\u00fa min\u0151s\u00e9g<\/th>\n<\/tr>\n<\/thead>\n
      Teljes vastags\u00e1gv\u00e1ltoz\u00e1s (TTV)<\/td>\n\u2264 3 \u03bcm<\/td>\n\u2264 2 \u03bcm<\/td>\n<\/tr>\n
      Warp<\/td>\n\u2264 100 \u03bcm<\/td>\n\u2264 50 \u03bcm<\/td>\n<\/tr>\n
      Vastags\u00e1gt\u0171r\u00e9s<\/td>\n\u00b10,010 mm<\/td>\n\u00b10,005 mm<\/td>\n<\/tr>\n
      Fel\u00fcleti \u00e9rdess\u00e9g (Ra)<\/td>\n< 1,0 nm<\/td>\n< 1,0 nm<\/td>\n<\/tr>\n
      Karcol\u00e1s\/\u00c1s\u00e1s<\/td>\n60\/40<\/td>\n40\/20<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
      \n

      Anyagi tulajdons\u00e1gok<\/strong><\/span><\/h3>\n
      \n
      \n\n\n\n\n\n\n\n\n\n\n
      Ingatlan<\/th>\n\u00c9rt\u00e9k<\/th>\n<\/tr>\n<\/thead>\n
      Young modulus<\/td>\n345\u2013420 GPa<\/td>\n<\/tr>\n
      Vickers-kem\u00e9nys\u00e9g<\/td>\n1800 \u2013 2200 HV<\/td>\n<\/tr>\n
      Optikai \u00e1tl\u00e1tsz\u00f3s\u00e1g<\/td>\n>83% (300\u20131200 nm)<\/td>\n<\/tr>\n
      S\u0171r\u0171s\u00e9g<\/td>\n3,98 g\/cm\u00b3<\/td>\n<\/tr>\n
      H\u0151vezet\u0151 k\u00e9pess\u00e9g<\/td>\n30\u201340 W\/m\u00b7K<\/td>\n<\/tr>\n
      CTE (20 \u00b0C)<\/td>\n5,6 \u2013 7,7 \u00d7 10\u207b\u2076\/K<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
      \n

      \"\"Alkalmaz\u00e1si ter\u00fcletek<\/strong><\/span><\/h2>\n
        \n
      • Ultrav\u00e9kony szil\u00edciumlapka h\u00e1toldal\u00e1nak megmunk\u00e1l\u00e1sa<\/li>\n
      • 2,5D\/3D heterog\u00e9n integr\u00e1ci\u00f3<\/li>\n
      • TSV (Through-Silicon Via) gy\u00e1rt\u00e1s<\/li>\n
      • RDL (\u00fajraeloszt\u00e1si r\u00e9teg) kialak\u00edt\u00e1sa<\/li>\n
      • Ideiglenes ostya\u00f6sszekapcsol\u00f3 \u00e9s -lev\u00e1laszt\u00f3 rendszerek<\/li>\n
      • Fan-out wafer-szint\u0171 csomagol\u00e1s (FOWLP)<\/li>\n
      • Panel szint\u0171 eloszt\u00f3csomagol\u00e1s (FOPLP)<\/li>\n
      • Fejlett ostyav\u00e9kony\u00edt\u00e1s \u00e9s kezel\u00e9s (<50 \u03bcm-es osty\u00e1k)<\/li>\n<\/ul>\n
        \n

        M\u00e9rn\u00f6ki \u00e9rt\u00e9k<\/strong><\/span><\/h2>\n

        A zaf\u00edrb\u00f3l k\u00e9sz\u00fclt ideiglenes ostyahordoz\u00f3 seg\u00edts\u00e9g\u00e9vel a fejlett csomagol\u00e1si technol\u00f3gi\u00e1kat alkalmaz\u00f3 gy\u00e1rt\u00f3k a k\u00f6vetkez\u0151ket \u00e9rhetik el:<\/p>\n

          \n
        • A szil\u00edciumlapok g\u00f6rb\u00fclet\u00e9nek \u00e9s szerkezeti deform\u00e1ci\u00f3j\u00e1nak jelent\u0151s cs\u00f6kken\u00e9se<\/li>\n
        • A finom s\u0171r\u0171s\u00e9g\u0171 csomagol\u00e1si folyamatokban jav\u00edtott igaz\u00edt\u00e1si pontoss\u00e1g<\/li>\n
        • 50 \u03bcm alatti ultrav\u00e9kony szil\u00edciumlapok stabil kezel\u00e9se<\/li>\n
        • A hozam \u00e1lland\u00f3s\u00e1g\u00e1nak jav\u00edt\u00e1sa a nagy\u00fczemi gy\u00e1rt\u00e1sban<\/li>\n
        • A folyamat ism\u00e9telhet\u0151s\u00e9g\u00e9nek \u00e9s a gy\u00e1rt\u00e1s stabilit\u00e1s\u00e1nak jav\u00edt\u00e1sa<\/li>\n
        • Kompatibilit\u00e1s a k\u00f6vetkez\u0151 gener\u00e1ci\u00f3s heterog\u00e9n integr\u00e1ci\u00f3s platformokkal<\/li>\n<\/ul>\n
          \n

          GYIK<\/strong><\/span><\/h2>\n

          1. k\u00e9rd\u00e9s: Mi a zaf\u00edr f\u0151 el\u0151nye az ideiglenes szil\u00edciumlapka-hordoz\u00f3kban?<\/strong>
          V: A zaf\u00edr rendk\u00edv\u00fcl nagy merevs\u00e9get, kem\u00e9nys\u00e9get \u00e9s h\u0151stabilit\u00e1st biztos\u00edt, ami kiv\u00e1l\u00f3 torzul\u00e1scs\u00f6kkent\u00e9st \u00e9s mechanikai megb\u00edzhat\u00f3s\u00e1got tesz lehet\u0151v\u00e9 a fejlett csomagol\u00e1si folyamatokban.<\/p>\n

          2. k\u00e9rd\u00e9s: Alkalmas-e a zaf\u00edr l\u00e9zeres lev\u00e1laszt\u00e1si elj\u00e1r\u00e1sokhoz?<\/strong>
          V: Igen. Az UV-t\u0151l a k\u00f6z\u00e9p-infrav\u00f6r\u00f6s hull\u00e1mhosszokig terjed\u0151 magas optikai \u00e1tereszt\u0151k\u00e9pess\u00e9ge hat\u00e9kony l\u00e9zeres \u00e1thatol\u00e1st tesz lehet\u0151v\u00e9, \u00edgy teljes m\u00e9rt\u00e9kben kompatibilis a l\u00e9zeres lev\u00e1laszt\u00f3 rendszerekkel.<\/p>\n

          3. k\u00e9rd\u00e9s: Alkalmasak-e a zaf\u00edr hordoz\u00f3k nagy m\u00e9ret\u0171 panelek csomagol\u00e1s\u00e1ra?<\/strong>
          V: Igen. A zaf\u00edr hordoz\u00f3k nagy m\u00e9ret\u0171 panelek form\u00e1j\u00e1ban is gy\u00e1rthat\u00f3k, mik\u00f6zben kiv\u00e1l\u00f3 s\u00edkfel\u00fcletet \u00e9s egyenletes fesz\u00fclts\u00e9geloszl\u00e1st biztos\u00edtanak, \u00edgy alkalmasak FOPLP-hez \u00e9s m\u00e1s, nagy fel\u00fclet\u0171, fejlett csomagol\u00e1si alkalmaz\u00e1sokhoz.<\/p>","protected":false},"excerpt":{"rendered":"

          A zaf\u00edrb\u00f3l k\u00e9sz\u00fclt ideiglenes szil\u00edciumlapka-hordoz\u00f3 egy nagy teljes\u00edtm\u00e9ny\u0171 hordoz\u00f3anyag, amelyet fejlett f\u00e9lvezet\u0151-csomagol\u00e1si folyamatokhoz terveztek, k\u00fcl\u00f6n\u00f6sen az ultrav\u00e9kony szil\u00edciumlapk\u00e1k kezel\u00e9s\u00e9hez \u00e9s a heterog\u00e9n integr\u00e1ci\u00f3s alkalmaz\u00e1sokhoz.<\/p>","protected":false},"featured_media":2514,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[1212],"product_tag":[1425,601,1419,1433,1428,1430,1429,1438,1435,1434,1431,1427,1420,1424,1437,1421,1436,1426,1423,1439,1422,1432],"class_list":{"0":"post-2512","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-semiconductor-consumables","7":"product_tag-2-5d-ic-packaging","8":"product_tag-3d-ic-integration","9":"product_tag-advanced-packaging-materials","10":"product_tag-cte-mismatch-solution","11":"product_tag-fan-out-packaging","12":"product_tag-foplp","13":"product_tag-fowlp","14":"product_tag-heterogeneous-integration-platform","15":"product_tag-high-modulus-ceramics","16":"product_tag-high-rigidity-materials","17":"product_tag-laser-debonding-compatibility","18":"product_tag-rdl-process","19":"product_tag-sapphire-wafer-carrier","20":"product_tag-semiconductor-carrier-substrate","21":"product_tag-semiconductor-manufacturing-materials","22":"product_tag-temporary-wafer-bonding","23":"product_tag-thermal-stability-materials","24":"product_tag-tsv-process","25":"product_tag-ultra-thin-wafer-handling","26":"product_tag-ultra-thin-wafer-support-systems","27":"product_tag-wafer-debonding","28":"product_tag-wafer-warpage-control","29":"desktop-align-left","30":"tablet-align-left","31":"mobile-align-left","32":"ast-product-gallery-layout-horizontal-slider","33":"ast-product-tabs-layout-horizontal","35":"first","36":"instock","37":"shipping-taxable","38":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product\/2512","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/comments?post=2512"}],"version-history":[{"count":2,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product\/2512\/revisions"}],"predecessor-version":[{"id":2519,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product\/2512\/revisions\/2519"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media\/2514"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media?parent=2512"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product_brand?post=2512"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product_cat?post=2512"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product_tag?post=2512"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}