{"id":2335,"date":"2026-04-21T09:54:15","date_gmt":"2026-04-21T09:54:15","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2335"},"modified":"2026-06-07T05:44:06","modified_gmt":"2026-06-07T05:44:06","slug":"ceramic-disc-cleaning-and-waxing-integrated-machine-for-semiconductor-wafer-mounting-and-pre-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/hu\/product\/ceramic-disc-cleaning-and-waxing-integrated-machine-for-semiconductor-wafer-mounting-and-pre-processing\/","title":{"rendered":"Ker\u00e1mia lemez tiszt\u00edt\u00f3 \u00e9s viaszol\u00f3 integr\u00e1lt g\u00e9p f\u00e9lvezet\u0151 ostya szerel\u00e9s\u00e9hez \u00e9s el\u0151feldolgoz\u00e1s\u00e1hoz"},"content":{"rendered":"

\"Ker\u00e1miaA ker\u00e1mia lemezek tiszt\u00edt\u00e1s\u00e1ra \u00e9s viaszol\u00e1s\u00e1ra szolg\u00e1l\u00f3 integr\u00e1lt g\u00e9p egy nagy hat\u00e9konys\u00e1g\u00fa automatiz\u00e1lt rendszer, amelyet f\u00e9lvezet\u0151 osty\u00e1k el\u0151feldolgoz\u00e1s\u00e1ra terveztek, \u00e9s amely egyetlen platformba integr\u00e1lja a prec\u00edzi\u00f3s tiszt\u00edt\u00e1st, sz\u00e1r\u00edt\u00e1st \u00e9s az osty\u00e1k viaszol\u00e1s\u00e1t (r\u00f6gz\u00edt\u00e9s\u00e9t).<\/p>\n

Ezt a berendez\u00e9st sz\u00e9les k\u00f6rben haszn\u00e1lj\u00e1k a SiC, Si, GaN, zaf\u00edr \u00e9s fejlett ker\u00e1miafeldolgoz\u00e1sban, biztos\u00edtva a hordoz\u00f3 korongokhoz val\u00f3 stabil ostyak\u00f6t\u00e9st a csiszol\u00e1si, v\u00e9kony\u00edt\u00e1si vagy pol\u00edroz\u00e1si folyamatok el\u0151tt. Az ultrahangos tiszt\u00edt\u00e1si technol\u00f3gia \u00e9s az intelligens viaszvez\u00e9rl\u00e9s kombin\u00e1l\u00e1s\u00e1val a rendszer ak\u00e1r 99,9% magas hozamot is el\u00e9r, \u00edgy ide\u00e1lis mind a t\u00f6megtermel\u00e9shez, mind a cs\u00facskateg\u00f3ri\u00e1s f\u00e9lvezet\u0151 alkalmaz\u00e1sokhoz.<\/p>\n

A teljesen automatiz\u00e1lt m\u0171k\u00f6d\u00e9s \u00e9s a MES-kapcsolat r\u00e9v\u00e9n ez a g\u00e9p jelent\u0151sen jav\u00edtja a termel\u00e9s hat\u00e9konys\u00e1g\u00e1t, a folyamatok k\u00f6vetkezetess\u00e9g\u00e9t \u00e9s a nyomon k\u00f6vethet\u0151s\u00e9get.<\/p>\n

\n

F\u0151bb m\u0171szaki jellemz\u0151k<\/span><\/h2>\n

Integr\u00e1lt tiszt\u00edt\u00f3 \u00e9s gyant\u00e1z\u00f3 rendszer<\/span><\/h3>\n
    \n
  • Kombin\u00e1lja a ker\u00e1mia t\u00e1rcs\u00e1s tiszt\u00edt\u00e1st + kett\u0151s gyant\u00e1z\u00f3 \u00e1llom\u00e1st<\/li>\n
  • Egyl\u00e9p\u00e9ses feldolgoz\u00e1s: tiszt\u00edt\u00e1s \u2192 sz\u00e1r\u00edt\u00e1s \u2192 viaszol\u00e1s<\/li>\n
  • A p\u00e1rhuzamos m\u0171k\u00f6d\u00e9s jav\u00edtja az \u00e1tereszt\u0151k\u00e9pess\u00e9get<\/li>\n<\/ul>\n

    Ultra-nagy pontoss\u00e1g\u00fa igaz\u00edt\u00e1s<\/span><\/h3>\n
      \n
    • CCD l\u00e1t\u00e1smeghat\u00e1roz\u00f3 rendszer<\/li>\n
    • Igaz\u00edt\u00e1si pontoss\u00e1g: \u00b10,02 mm<\/li>\n
    • Biztos\u00edtja a szeletek pontos elhelyez\u00e9s\u00e9t \u00e9s a ragaszt\u00e1s min\u0151s\u00e9g\u00e9t<\/li>\n<\/ul>\n

      Ellen\u0151rz\u00f6tt viaszlev\u00e1laszt\u00e1s<\/span><\/h3>\n
        \n
      • Viasz mennyis\u00e9ge: 0,8 g \u00b10,05 g osty\u00e1nk\u00e9nt<\/li>\n
      • Az egyenletes eloszl\u00e1s stabil r\u00f6gz\u00edt\u00e9st biztos\u00edt a csiszol\u00e1s sor\u00e1n<\/li>\n<\/ul>\n

        Stabil nyom\u00e1sszab\u00e1lyoz\u00e1s<\/span><\/h3>\n
          \n
        • A pneumatikus rendszer 5-10 N\/cm\u00b2 egyenletes nyom\u00e1st tart fenn<\/li>\n
        • Megakad\u00e1lyozza a waferek torzul\u00e1s\u00e1t \u00e9s a k\u00f6t\u00e9si hib\u00e1kat<\/li>\n<\/ul>\n

          Nagy hozam \u00e9s folyamatstabilit\u00e1s<\/span><\/h3>\n
            \n
          • Ak\u00e1r 99,9% hozamfokozat<\/li>\n
          • Val\u00f3s idej\u0171 fel\u00fcgyelet automatikus param\u00e9terbe\u00e1ll\u00edt\u00e1ssal (\u00b13% t\u0171r\u00e9s)<\/li>\n<\/ul>\n
            \n

            M\u0171szaki specifik\u00e1ci\u00f3k<\/span><\/h2>\n
            \n
            \n\n\n\n\n\n\n\n\n
            Param\u00e9ter<\/th>\n\u00c9rt\u00e9k<\/th>\n<\/tr>\n<\/thead>\n
            M\u00e9retek<\/td>\n7740 \u00d7 3390 \u00d7 2300 mm<\/td>\n<\/tr>\n
            T\u00e1pegys\u00e9g<\/td>\nAC 380V, 50Hz, 90 kW<\/td>\n<\/tr>\n
            Pneumatikus ell\u00e1t\u00e1s<\/td>\n2 m\u00b3\/h, 0,4-0,5 MPa (olajmentes sz\u00e1raz leveg\u0151)<\/td>\n<\/tr>\n
            V\u00edzell\u00e1t\u00e1s<\/td>\n2 T\/h @ 0,3 MPa, \u226512 M\u03a9-cm DI v\u00edz<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
            \n

            M\u0171k\u00f6d\u00e9si elv<\/span><\/h2>\n

            1. Ker\u00e1mia t\u00e1rcs\u00e1s tiszt\u00edt\u00e1si szakasz<\/span><\/h3>\n
              \n
            • Az ultrahangos tiszt\u00edt\u00f3rendszer elt\u00e1vol\u00edtja a mikron szint\u0171 r\u00e9szecsk\u00e9ket \u00e9s szennyez\u0151d\u00e9seket<\/li>\n
            • Nagy tisztas\u00e1g\u00fa DI-vizet haszn\u00e1l (\u226512 M\u03a9-cm)<\/li>\n
            • L\u00e9gk\u00e9ssel + v\u00e1kuumsz\u00e1r\u00edt\u00e1ssal kombin\u00e1lva, nulla marad\u00e9kot biztos\u00edtva<\/li>\n<\/ul>\n

              2. Automatiz\u00e1lt gyant\u00e1z\u00e1si folyamat<\/span><\/h3>\n
                \n
              • A l\u00e1t\u00f3rendszer felismeri a t\u00e1rcsa koordin\u00e1t\u00e1it<\/li>\n
              • A programozhat\u00f3 adagol\u00f3fej egyenletes viaszr\u00e9teget hordoz fel<\/li>\n
              • Az osty\u00e1t ellen\u0151rz\u00f6tt nyom\u00e1sviszonyok k\u00f6z\u00f6tt szerelik fel<\/li>\n<\/ul>\n

                3. Intelligens folyamatir\u00e1ny\u00edt\u00e1s<\/span><\/h3>\n
                  \n
                • PLC rendszer szinkroniz\u00e1lja a tiszt\u00edt\u00f3 \u00e9s viaszol\u00f3 modulokat<\/li>\n
                • T\u00e1mogatja a p\u00e1rhuzamos feldolgoz\u00e1st, ak\u00e1r 30 lemez\/\u00f3ra sebess\u00e9gig<\/li>\n
                • A vastags\u00e1g\u00e9rz\u00e9kel\u0151k val\u00f3s id\u0151ben ellen\u0151rzik a viasz egyenletess\u00e9g\u00e9t<\/li>\n<\/ul>\n
                  \n

                  Termel\u00e9si kapacit\u00e1s<\/span><\/h2>\n
                  \n
                  \n\n\n\n\n\n\n\n\n\n\n
                  Wafer m\u00e9ret<\/th>\nT\u00e1rcsa \u00e1tm\u00e9r\u0151je<\/th>\nMennyis\u00e9g<\/th>\nCiklusid\u0151<\/th>\n<\/tr>\n<\/thead>\n
                  4 h\u00fcvelyk<\/td>\n\u03a6485 mm<\/td>\n11 db<\/td>\n5 perc\/lemez<\/td>\n<\/tr>\n
                  4 h\u00fcvelyk<\/td>\n\u03a6576 mm<\/td>\n13 db<\/td>\n6 perc\/lemez<\/td>\n<\/tr>\n
                  6 h\u00fcvelyk<\/td>\n\u03a6485 mm<\/td>\n6 db<\/td>\n3 perc\/lemez<\/td>\n<\/tr>\n
                  6 h\u00fcvelyk<\/td>\n\u03a6576 mm<\/td>\n8 db<\/td>\n4 perc\/lemez<\/td>\n<\/tr>\n
                  8 h\u00fcvelyk<\/td>\n\u03a6485 mm<\/td>\n3 db<\/td>\n2 perc\/lemez<\/td>\n<\/tr>\n
                  8 h\u00fcvelyk<\/td>\n\u03a6576 mm<\/td>\n5 db<\/td>\n3 perc\/lemez<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
                  \n

                  Alkalmaz\u00e1sok<\/span><\/h2>\n

                  \"\"F\u00e9lvezet\u0151 szeletek el\u0151feldolgoz\u00e1sa<\/span><\/h3>\n
                    \n
                  • Wafer r\u00f6gz\u00edt\u00e9s csiszol\u00e1s \/ v\u00e9kony\u00edt\u00e1s \/ pol\u00edroz\u00e1s el\u0151tt<\/li>\n
                  • Alkalmas:\n
                      \n
                    • Szil\u00edcium (Si)<\/li>\n
                    • Szil\u00edcium-karbid (SiC)<\/li>\n
                    • Gallium-nitrid (GaN)<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n

                      \u00d6sszetett f\u00e9lvezet\u0151k gy\u00e1rt\u00e1sa<\/span><\/h3>\n
                        \n
                      • GaN, SiC t\u00e1pegys\u00e9gek<\/li>\n
                      • Fejlett szubsztr\u00e1tkezel\u00e9s<\/li>\n<\/ul>\n

                        Optikai \u00e9s krist\u00e1lyos anyagok<\/span><\/h3>\n
                          \n
                        • Zaf\u00edr szubsztr\u00e1tumok<\/li>\n
                        • Prec\u00edzi\u00f3s ker\u00e1mia<\/li>\n
                        • Optikai alkatr\u00e9szek<\/li>\n<\/ul>\n

                          MEMS \u00e9s fejlett anyagok<\/span><\/h3>\n
                            \n
                          • Mikrogy\u00e1rt\u00e1si osty\u00e1k el\u0151k\u00e9sz\u00edt\u00e9se<\/li>\n
                          • Speci\u00e1lis anyagfeldolgoz\u00e1s<\/li>\n<\/ul>\n
                            \n

                            \"\"Legfontosabb el\u0151ny\u00f6k<\/span><\/h2>\n
                              \n
                            • Magas integr\u00e1ci\u00f3: Tiszt\u00edt\u00e1s + sz\u00e1r\u00edt\u00e1s + viaszol\u00e1s egy rendszerben<\/li>\n
                            • Energiahat\u00e9konys\u00e1g: V\u00edz \u00fajrahasznos\u00edt\u00e1si ar\u00e1ny >80%, cs\u00f6kkentett fogyaszt\u00e1s<\/li>\n
                            • Nagy \u00e1tereszt\u0151k\u00e9pess\u00e9g: \u00f3r\u00e1nk\u00e9nt: ak\u00e1r 30 lemez\/\u00f3ra<\/li>\n
                            • Intelligens gy\u00e1rt\u00e1s k\u00e9sz: MES\/ERP integr\u00e1ci\u00f3 t\u00e1mogatott<\/li>\n
                            • Rugalmas testreszab\u00e1s: T\u00e1mogatja a \u03a6300-650 mm-es nem szabv\u00e1nyos lemezeket.<\/li>\n
                            • Gyors \u00e1t\u00e1ll\u00e1s: percek: Szersz\u00e1mv\u00e1lt\u00e1si id\u0151 <3 perc<\/li>\n<\/ul>\n
                              \n

                              A teljes\u00edtm\u00e9ny kiemelked\u0151 pontjai<\/span><\/h2>\n
                                \n
                              • Viasz egyenletess\u00e9gi elt\u00e9r\u00e9s: \u2264\u00b13%<\/li>\n
                              • V\u00edzfogyaszt\u00e1s: \u22640,5 L\/t\u00e1ny\u00e9r<\/li>\n
                              • Automatiz\u00e1lt m\u0171k\u00f6d\u00e9s teljes nyomon k\u00f6vethet\u0151s\u00e9ggel<\/li>\n
                              • Stabil \u00e9s megism\u00e9telhet\u0151 folyamatszab\u00e1lyoz\u00e1s<\/li>\n<\/ul>\n
                                \n

                                GYIK<\/span><\/h2>\n

                                1. k\u00e9rd\u00e9s: Hogyan biztos\u00edtj\u00e1k a magas hozamot?<\/span><\/h3>\n

                                A dedik\u00e1lt CCD l\u00e1t\u00e1svez\u00e9rl\u0151 rendszer \u00b10,02 mm poz\u00edcion\u00e1l\u00e1si pontoss\u00e1got biztos\u00edt, \u00edgy biztos\u00edtva a lapkak\u00e9sz\u00edt\u00e9s egyenletes min\u0151s\u00e9g\u00e9t.<\/p>\n

                                2. k\u00e9rd\u00e9s: Mekkora a v\u00edzfogyaszt\u00e1s szintje?<\/span><\/h3>\n

                                A rendszer >80% v\u00edz \u00fajrahasznos\u00edt\u00e1s\u00e1t \u00e9ri el, a fogyaszt\u00e1s pedig mind\u00f6ssze \u22640,5 l lemezenk\u00e9nt.<\/p>\n

                                3. k\u00e9rd\u00e9s: T\u00e1mogatja a gyors ostyam\u00e9ret-v\u00e1lt\u00e1st?<\/span><\/h3>\n

                                Igen, az intelligens r\u00f6gz\u00edt\u0151t\u00e1r lehet\u0151v\u00e9 teszi az automatikus szersz\u00e1mv\u00e1lt\u00e1st 3 percen bel\u00fcl a HMI-n kereszt\u00fcl.<\/p>","protected":false},"excerpt":{"rendered":"

                                A ker\u00e1mia lemezek tiszt\u00edt\u00e1s\u00e1ra \u00e9s viaszol\u00e1s\u00e1ra szolg\u00e1l\u00f3 integr\u00e1lt g\u00e9p egy nagy hat\u00e9konys\u00e1g\u00fa automatiz\u00e1lt rendszer, amelyet f\u00e9lvezet\u0151 osty\u00e1k el\u0151feldolgoz\u00e1s\u00e1ra terveztek, \u00e9s amely egyetlen platformba integr\u00e1lja a prec\u00edzi\u00f3s tiszt\u00edt\u00e1st, sz\u00e1r\u00edt\u00e1st \u00e9s az osty\u00e1k viaszol\u00e1s\u00e1t (r\u00f6gz\u00edt\u00e9s\u00e9t).Ez a berendez\u00e9s sz\u00e9les k\u00f6rben haszn\u00e1latos a SiC, Si, GaN, zaf\u00edr \u00e9s fejlett ker\u00e1mia feldolgoz\u00e1s\u00e1ban, biztos\u00edtva az osty\u00e1k stabil k\u00f6t\u00e9s\u00e9t a hordoz\u00f3lemezekhez a csiszol\u00e1si, v\u00e9kony\u00edt\u00e1si vagy pol\u00edroz\u00e1si folyamatok el\u0151tt.<\/p>","protected":false},"featured_media":2338,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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