{"id":2327,"date":"2026-04-21T06:21:20","date_gmt":"2026-04-21T06:21:20","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2327"},"modified":"2026-04-21T06:21:21","modified_gmt":"2026-04-21T06:21:21","slug":"wafer-thinning-system-precision-back-grinding-equipment-for-si-sic-and-4-to-12-inch-semiconductor-wafers","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/hu\/product\/wafer-thinning-system-precision-back-grinding-equipment-for-si-sic-and-4-to-12-inch-semiconductor-wafers\/","title":{"rendered":"Wafer Thinning System prec\u00edzi\u00f3s h\u00e1tracsiszol\u00f3 berendez\u00e9s Si SiC \u00e9s 4-12 h\u00fcvelykes f\u00e9lvezet\u0151 osty\u00e1khoz"},"content":{"rendered":"

\"WaferA Wafer Thinning System prec\u00edzi\u00f3s h\u00e1tracsiszol\u00f3 berendez\u00e9s egy nagy pontoss\u00e1g\u00fa waferfeldolgoz\u00e1si megold\u00e1s, amelyet a fejlett f\u00e9lvezet\u0151gy\u00e1rt\u00e1shoz terveztek. T\u00e1mogatja a 4 h\u00fcvelyk \u00e9s 12 h\u00fcvelyk k\u00f6z\u00f6tti osty\u00e1kat, bele\u00e9rtve a szil\u00edciumot (Si), a szil\u00edcium-karbidot (SiC), a gallium-arzenidet (GaAs), a zaf\u00edrt \u00e9s m\u00e1s t\u00f6r\u00e9keny \u00f6sszetett f\u00e9lvezet\u0151 anyagokat.<\/p>\n

Ezt a rendszert ultrapontos ostyah\u00e1toldal-v\u00e9kony\u00edt\u00e1shoz tervezt\u00e9k, amely lehet\u0151v\u00e9 teszi a vastags\u00e1g mikronos \u00e9s szubmikronos szintre t\u00f6rt\u00e9n\u0151 cs\u00f6kkent\u00e9s\u00e9t, mik\u00f6zben kiv\u00e1l\u00f3 fel\u00fcleti integrit\u00e1st biztos\u00edt. Kritikus szerepet j\u00e1tszik a fejlett csomagol\u00e1s, a t\u00e1pegys\u00e9gek, a MEMS \u00e9s az \u00f6sszetett f\u00e9lvezet\u0151k gy\u00e1rt\u00e1s\u00e1ban.<\/p>\n

A nagy merevs\u00e9g\u0171 mechanikai kialak\u00edt\u00e1s, a prec\u00edzi\u00f3s Z-tengely vez\u00e9rl\u00e9s \u00e9s a val\u00f3s idej\u0171 vastags\u00e1gfigyel\u00e9s integr\u00e1l\u00e1s\u00e1val a berendez\u00e9s stabil \u00e9s megism\u00e9telhet\u0151 feldolgoz\u00e1si teljes\u00edtm\u00e9nyt biztos\u00edt az ipari m\u00e9ret\u0171 gy\u00e1rt\u00e1shoz.<\/p>\n

\n

F\u0151bb m\u0171szaki jellemz\u0151k<\/span><\/h2>\n

Nagy pontoss\u00e1g\u00fa vastags\u00e1gszab\u00e1lyoz\u00e1s<\/span><\/h3>\n
    \n
  • Vastags\u00e1g pontoss\u00e1g: \u00b11 \u03bcm<\/li>\n
  • Teljes vastags\u00e1g-v\u00e1ltoz\u00e1s (TTV): \u22642 \u03bcm<\/li>\n
  • A fejlett modellek ak\u00e1r \u00b10,5 \u03bcm-es szubmikronos szab\u00e1lyoz\u00e1st is el\u00e9rnek.<\/li>\n<\/ul>\n

    \"\"Sz\u00e9lesk\u00f6r\u0171 anyagkompatibilit\u00e1s<\/span><\/h3>\n

    F\u00e9lvezet\u0151 \u00e9s rideg anyagok sz\u00e9les sk\u00e1l\u00e1j\u00e1t t\u00e1mogatja:<\/p>\n

      \n
    • Szil\u00edcium (Si)<\/li>\n
    • Szil\u00edcium-karbid (SiC)<\/li>\n
    • Gallium-arzenid (GaAs)<\/li>\n
    • Zaf\u00edr (Al\u2082O\u2083)<\/li>\n
    • Egy\u00e9b \u00f6sszetett f\u00e9lvezet\u0151 lapk\u00e1k<\/li>\n<\/ul>\n

      Wafer m\u00e9ret kompatibilit\u00e1s<\/span><\/h3>\n
        \n
      • 4 h\u00fcvelykes \/ 6 h\u00fcvelykes \/ 8 h\u00fcvelykes \/ 10 h\u00fcvelykes \/ 12 h\u00fcvelykes osty\u00e1k<\/li>\n
      • Rugalmas kezel\u00e9s mind a szabv\u00e1nyos, mind az egyedi szubsztr\u00e1tumokhoz<\/li>\n<\/ul>\n

        Nagy stabilit\u00e1s\u00fa mechanikus rendszer<\/span><\/h3>\n
          \n
        • Nagy merevs\u00e9g\u0171 l\u00e9gcsap\u00e1gyas ors\u00f3<\/li>\n
        • Alacsony rezg\u00e9ssz\u00e1m\u00fa prec\u00edzi\u00f3s k\u00f6sz\u00f6r\u0171platform<\/li>\n
        • Import\u00e1lt goly\u00f3scsavar + line\u00e1ris vezet\u0151 rendszer<\/li>\n
        • Nagy pontoss\u00e1g\u00fa szervomotor-vez\u00e9rl\u00e9s (0,1 \u03bcm felbont\u00e1s)<\/li>\n<\/ul>\n

          Fejlett h\u0171t\u0151rendszer<\/span><\/h3>\n
            \n
          • V\u00edzh\u0171t\u00e9ses ors\u00f3rendszer biztos\u00edtja a h\u0151stabilit\u00e1st<\/li>\n
          • Megakad\u00e1lyozza a deform\u00e1ci\u00f3t a nagy sebess\u00e9g\u0171 csiszol\u00e1s sor\u00e1n<\/li>\n<\/ul>\n
            \n

            Rendszerkonfigur\u00e1ci\u00f3<\/span><\/h2>\n

            Az ostyav\u00e9kony\u00edt\u00f3 rendszer t\u00f6bb funkcion\u00e1lis modult integr\u00e1l:<\/p>\n

            1. Prec\u00edzi\u00f3s k\u00f6sz\u00f6r\u00fcl\u00e9s modul<\/span><\/h3>\n

            Ellen\u0151rz\u00f6tt anyagelt\u00e1vol\u00edt\u00e1st v\u00e9gez nagy fel\u00fcleti egyenletess\u00e9ggel.<\/p>\n

            2. Z-tengely prec\u00edzi\u00f3s vez\u00e9rl\u0151rendszer<\/span><\/h3>\n

            Lehet\u0151v\u00e9 teszi az ultrafinom f\u00fcgg\u0151leges be\u00e1ll\u00edt\u00e1st az egyenletes ostyavastags\u00e1g \u00e9rdek\u00e9ben.<\/p>\n

            3. Vastags\u00e1gm\u00e9r\u0151 rendszer<\/span><\/h3>\n

            A val\u00f3s idej\u0171 \u00e9rint\u00e9ses\/nem \u00e9rint\u00e9ses m\u00e9r\u00e9s biztos\u00edtja a folyamat stabilit\u00e1s\u00e1t.<\/p>\n

            4. V\u00e1kuumos ostyafog\u00f3k\u00e9sz\u00fcl\u00e9k<\/span><\/h3>\n

            Biztons\u00e1gos ostyar\u00f6gz\u00edt\u00e9s, bele\u00e9rtve a szab\u00e1lytalan osty\u00e1k egyedi megold\u00e1sait is.<\/p>\n

            5. Automatiz\u00e1l\u00e1si vez\u00e9rl\u0151rendszer<\/span><\/h3>\n
              \n
            • Teljes \/ f\u00e9lautomata \u00fczemm\u00f3dok<\/li>\n
            • M\u0171veleti napl\u00f3 r\u00f6gz\u00edt\u00e9se<\/li>\n
            • Recept alap\u00fa folyamatir\u00e1ny\u00edt\u00e1s<\/li>\n<\/ul>\n
              \n

              \"\" Feldolgoz\u00e1si k\u00e9pess\u00e9gek<\/span><\/h2>\n

              A rendszert nagy teljes\u00edtm\u00e9ny\u0171 ostyah\u00e1toldal-feldolgoz\u00e1sra tervezt\u00e9k:<\/p>\n

                \n
              • Szil\u00edcium ostya h\u00e1tracsiszol\u00e1s<\/li>\n
              • SiC ostyav\u00e9kony\u00edt\u00e1s a t\u00e1pegys\u00e9gek sz\u00e1m\u00e1ra<\/li>\n
              • GaN \u00e9s GaAs szubsztr\u00e1t elv\u00e9konyod\u00e1sa<\/li>\n
              • Zaf\u00edr ostya prec\u00edzi\u00f3s v\u00e9kony\u00edt\u00e1sa<\/li>\n
              • Ultrav\u00e9kony osty\u00e1k el\u0151k\u00e9sz\u00edt\u00e9se 3D csomagol\u00e1shoz<\/li>\n<\/ul>\n
                \n

                Alkalmaz\u00e1sok<\/span><\/h2>\n

                1. Teljes\u00edtm\u00e9ny f\u00e9lvezet\u0151 eszk\u00f6z\u00f6k<\/span><\/h3>\n

                SiC MOSFET-ekben, IGBT-kben \u00e9s ultra-v\u00e9kony osty\u00e1kat ig\u00e9nyl\u0151 nagyfesz\u00fclts\u00e9g\u0171 eszk\u00f6z\u00f6kben haszn\u00e1latos.<\/p>\n

                \"\"2. Fejlett csomagol\u00e1s<\/span><\/h3>\n

                T\u00e1mogatja az ostyav\u00e9kony\u00edt\u00e1st a k\u00f6vetkez\u0151kh\u00f6z:<\/p>\n

                  \n
                • Flip-chip csomagol\u00e1s<\/li>\n
                • 2.5D \/ 3D IC integr\u00e1ci\u00f3<\/li>\n
                • TSV (Through Silicon Via) elj\u00e1r\u00e1sok<\/li>\n<\/ul>\n

                  3. \u00d6sszetett f\u00e9lvezet\u0151k<\/span><\/h3>\n

                  Alkalmazhat\u00f3 GaN, GaAs \u00e9s InP eszk\u00f6z\u00f6k gy\u00e1rt\u00e1s\u00e1hoz.<\/p>\n

                  4. LED \u00e9s optoelektronika<\/span><\/h3>\n

                  Zaf\u00edr \u00e9s \u00f6sszetett osty\u00e1k v\u00e9kony\u00edt\u00e1sa LED chipekhez \u00e9s optikai eszk\u00f6z\u00f6kh\u00f6z.<\/p>\n

                  \n

                  El\u0151ny\u00f6k<\/span><\/h2>\n
                    \n
                  • Kiforrott \u00e9s stabil ostyav\u00e9kony\u00edt\u00e1si technol\u00f3gia<\/li>\n
                  • Nagy pontoss\u00e1g\u00fa el\u0151tol\u00e1sos csiszol\u00f3rendszer<\/li>\n
                  • Kiv\u00e1l\u00f3 fel\u00fcleti \u00e9rdess\u00e9g-szab\u00e1lyoz\u00e1s<\/li>\n
                  • Nagy UPH (ak\u00e1r 30 ostya\/\u00f3ra a standard folyamatokn\u00e1l)<\/li>\n
                  • Er\u0151s alkalmazkod\u00f3k\u00e9pess\u00e9g a rideg \u00e9s kem\u00e9ny anyagokhoz<\/li>\n
                  • Teljesen automatiz\u00e1lt folyamatintegr\u00e1ci\u00f3s k\u00e9pess\u00e9g<\/li>\n<\/ul>\n
                    \n

                    A teljes\u00edtm\u00e9ny kiemelked\u0151 pontjai<\/span><\/h2>\n
                      \n
                    • Minim\u00e1lis felbont\u00e1s: Z-tengely vez\u00e9rl\u00e9s: 0,1 \u03bcm\/s<\/li>\n
                    • Egyenletes vastags\u00e1g: \u22641-2 \u03bcm TTV<\/li>\n
                    • Nagy sebess\u00e9g\u0171 ors\u00f3 rendk\u00edv\u00fcl alacsony rezg\u00e9ssel<\/li>\n
                    • Val\u00f3s idej\u0171 folyamatfel\u00fcgyelet \u00e9s napl\u00f3z\u00e1s<\/li>\n
                    • K+F \u00e9s t\u00f6meggy\u00e1rt\u00e1si k\u00f6rnyezetekkel egyar\u00e1nt kompatibilis<\/li>\n<\/ul>\n
                      \n

                      Testreszab\u00e1si lehet\u0151s\u00e9gek<\/span><\/h2>\n

                      Rugalmas testreszab\u00e1st biztos\u00edtunk a k\u00fcl\u00f6nb\u00f6z\u0151 ipari ig\u00e9nyekhez:<\/p>\n

                        \n
                      • Egyedi ostyafog\u00f3k (szab\u00e1lytalan form\u00e1k)<\/li>\n
                      • B\u0151v\u00edtett vastags\u00e1gm\u00e9r\u00e9si tartom\u00e1ny (ak\u00e1r 40 mm-ig)<\/li>\n
                      • Folyamatrecept testreszab\u00e1sa<\/li>\n
                      • Automatiz\u00e1l\u00e1si integr\u00e1ci\u00f3 az upstream\/downstream berendez\u00e9sekkel<\/li>\n<\/ul>\n
                        \n

                        GYIK<\/span><\/h2>\n

                        1. k\u00e9rd\u00e9s: Ez a rendszer k\u00e9pes feldolgozni a SiC osty\u00e1kat?<\/span><\/h3>\n

                        Igen, kifejezetten SiC osty\u00e1k v\u00e9kony\u00edt\u00e1s\u00e1ra \u00e9s h\u00e1toldali csiszol\u00e1sra optimaliz\u00e1lt\u00e1k, \u00e9s alkalmas a teljes\u00edtm\u00e9ny-eszk\u00f6z\u00f6k alkalmaz\u00e1saihoz.<\/p>\n

                        2. k\u00e9rd\u00e9s: Mekkora az el\u00e9rhet\u0151 vastags\u00e1gi pontoss\u00e1g?<\/span><\/h3>\n

                        A standard modellek \u00b11 \u03bcm, a cs\u00facskateg\u00f3ri\u00e1s konfigur\u00e1ci\u00f3k pedig \u00b10,5 \u03bcm-t \u00e9rnek el \u22641 \u03bcm TTV-vel.<\/p>\n

                        3. k\u00e9rd\u00e9s: T\u00e1mogatja a teljes automatiz\u00e1l\u00e1st?<\/span><\/h3>\n

                        Igen, a gy\u00e1rt\u00e1si k\u00f6vetelm\u00e9nyekt\u0151l f\u00fcgg\u0151en mind a teljes automata, mind a f\u00e9lautomata \u00fczemm\u00f3d el\u00e9rhet\u0151.<\/p>","protected":false},"excerpt":{"rendered":"

                        A Wafer Thinning System prec\u00edzi\u00f3s h\u00e1tracsiszol\u00f3 berendez\u00e9s egy nagy pontoss\u00e1g\u00fa waferfeldolgoz\u00e1si megold\u00e1s, amelyet a fejlett f\u00e9lvezet\u0151gy\u00e1rt\u00e1shoz terveztek. T\u00e1mogatja a 4 h\u00fcvelyk \u00e9s 12 h\u00fcvelyk k\u00f6z\u00f6tti osty\u00e1kat, bele\u00e9rtve a szil\u00edciumot (Si), szil\u00edcium-karbidot (SiC), gallium-arzenidet (GaAs), zaf\u00edrt \u00e9s m\u00e1s t\u00f6r\u00e9keny \u00f6sszetett f\u00e9lvezet\u0151 anyagokat.Ez a rendszer ultraprec\u00edz ostya h\u00e1tlapi v\u00e9kony\u00edt\u00e1sra lett tervezve, lehet\u0151v\u00e9 t\u00e9ve a vastags\u00e1g cs\u00f6kkent\u00e9s\u00e9t mikronos \u00e9s szubmikronos szintre, a kiv\u00e1l\u00f3 fel\u00fcleti integrit\u00e1s meg\u0151rz\u00e9se mellett.<\/p>","protected":false},"featured_media":2330,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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